SCHEMBL5611645

SCHEMBL5611645

CC=CNCCCCCCNC=CC

nearest known ligand 0.42

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
ADH1B P00325 2/20 0.42
ADH1C P00326 2/20 0.42
ADH1A P07327 2/20 0.42
ADH7 P40394 2/20 0.42
EPHX1 P07099 1/20 0.42
ADH4 P08319 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22157384 0.89 EPHX1 (0.58) ADH1BADH1CADH1AADH7EPHX1
SCHEMBL22157385 0.89 EPHX1 (0.58) ADH1BADH1CADH1AADH7EPHX1
SCHEMBL11859016 0.89 EPHX1 (0.58) ADH1BADH1CADH1AADH7EPHX1
SCHEMBL10350548 0.89 EPHX1 (0.58) ADH1BADH1CADH1AADH7EPHX1
SCHEMBL11859005 0.89 EPHX1 (0.58) ADH1BADH1CADH1AADH7EPHX1
SCHEMBL19068630 0.89 EPHX1 (0.58) ADH1BADH1CADH1AADH7EPHX1
SCHEMBL16452855 0.89 EPHX1 (0.58) ADH1BADH1CADH1AADH7EPHX1
Ammonia Solution, Strong SCHEMBL10826393 0.87 EPHX1 (0.56) ADH1BADH1CADH1AADH7EPHX1
Ammonia Solution, Strong SCHEMBL10827255 0.87 EPHX1 (0.56) ADH1BADH1CADH1AADH7EPHX1
Ammonia Solution, Strong SCHEMBL10827263 0.87 EPHX1 (0.56) ADH1BADH1CADH1AADH7EPHX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7271219-B2 Useful as overcoating materials and interlayer insulating materials for wiring boards SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2007-09-18 US disclosed
US-20040102601-A1 Useful as overcoating materials and interlayer insulating materials for wiring boards SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2004-05-27 US disclosed
EP-1375553-A1 CURABLE RESIN, CURABLE RESIN MATERIAL, CURABLE FILM, AND INSULATOR SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2004-01-02 EP disclosed