SCHEMBL561701

SCHEMBL561701

[Ag].[Cu].[SbH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29281203 0.87
Hydrogen Sulfide SCHEMBL28521813 0.87
SCHEMBL27775645 0.87
SCHEMBL28167075 0.87
SCHEMBL25373886 0.82
SCHEMBL780255 0.82
SCHEMBL30686738 0.82
SCHEMBL176382 0.82
SCHEMBL29873070 0.82
SCHEMBL8502732 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114696174-A Slip ring device, yawing system and wind generating set 北京金风科创风电设备有限公司 2022-07-01 CN claimed
CN-1523242-A Bearing bush with a high-performance antifriction layer 刘会学 2004-08-25 CN claimed
EP-4391046-A1 SEMICONDUCTOR DEVICE, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Huawei Digital Power Technologies Co., Ltd. (CN) 2024-06-26 EP disclosed
CN-117080181-A Power module capable of reducing thermal resistance 苏州悉智科技有限公司 2023-11-17 CN disclosed
CN-105087952-B The method of desulfurization enriching Cu silver antimony is evaporated in vacuo in a kind of many metal smelt slags from sulfur-bearing 昆明理工大学 2017-07-07 CN disclosed
US-9351408-B2 Coreless layer buildup structure with LGA and joining layer I3 ELECTRONICS, INC. 2016-05-24 US disclosed
CN-105087952-A Method for removing sulfur and gathering copper, silver and antimony from sulfur-containing multi-metal smelting slag through vacuum distillation UNIV KUNMING SCIENCE & TECHNOLOGY 2015-11-25 CN disclosed
US-8541687-B2 Coreless layer buildup structure ENDICOTT INTERCONNECT TECHNOLOGIES, INC. (US) 2013-09-24 US disclosed
US-8536459-B2 Coreless layer buildup structure with LGA ENDICOTT INTERCONNECT TECHNOLOGIES, INC. (US) 2013-09-17 US disclosed
US-20120247822-A1 CORELESS LAYER LAMINATED CHIP CARRIER HAVING SYSTEM IN PACKAGE STRUCTURE ENDICOTT INTERCONNECT TECHNOLOGIES, INC. (US) 2012-10-04 US disclosed
US-20120160544-A1 CORELESS LAYER BUILDUP STRUCTURE WITH LGA ENDICOTT INTERCONNECT TECHNOLOGIES, INC. (US) 2012-06-28 US disclosed
US-20050280136-A1 Method for producing Z-axis interconnection assembly of printed wiring board elements INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2005-12-22 US disclosed
US-6969436-B2 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2005-11-29 US disclosed
CN-1523242-A Bearing bush with a high-performance antifriction layer 刘会学 2004-08-25 CN disclosed
US-6757152-B2 Cascade capacitor AVX CORPORATION 2004-06-29 US disclosed
US-20040084137-A1 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements INTERNATIONAL BUSINESS MACHINES CORPORATION 2004-05-06 US disclosed
US-20040057192-A1 Cascade capacitor GALVAGNI JOHN L (US) 2004-03-25 US disclosed
US-6638607-B1 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements INTERNATIONAL BUSINESS MACHINES CORPORATION 2003-10-28 US disclosed
US-20030072125-A1 Cascade capacitor AVX CORPORATION 2003-04-17 US disclosed
WO-2003021614-A1 CASCADE CAPACITOR AVX CORPORATION (US) 2003-03-13 WO disclosed