SCHEMBL56374

SCHEMBL56374

CC(=O)CC(=O)N(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14890409 0.97 ALDH1A1 (0.40)
Formaldehyde SCHEMBL11794812 0.94 ALDH1A1 (0.39)
SCHEMBL283475 0.83 ALDH1A1 (0.48)
SCHEMBL6050366 0.81
SCHEMBL3279592 0.79
SCHEMBL14902216 0.78 ALDH1A1 (0.43)
SCHEMBL11464259 0.77
SCHEMBL11690382 0.77
SCHEMBL11324356 0.77
SCHEMBL53024 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2410 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250260059-A1 ELECTROLYTE FOR SECONDARY BATTERY, SECONDARY BATTERY, BATTERY MODULE, BATTERY PACK, AND ELECTRIC APPARATUS CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) LIMITED (CN) 2025-08-14 US claimed
EP-4593142-A1 ELECTROLYTE FOR SECONDARY BATTERY, SECONDARY BATTERY, BATTERY MODULE, BATTERY PACK, AND ELECTRIC DEVICE Contemporary Amperex Technology (Hong Kong) Limited (HK) 2025-07-30 EP claimed
EP-4576309-A1 SODIUM SECONDARY BATTERY, BATTERY MODULE, BATTERY PACK, AND ELECTRIC DEVICE Contemporary Amperex Technology (Hong Kong) Limited (HK) 2025-06-25 EP claimed
US-20250192232-A1 ELECTROLYTE FOR SECONDARY BATTERY, SECONDARY BATTERY, BATTERY MODULE, BATTERY PACK, AND ELECTRIC APPARATUS CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) LIMITED (CN) 2025-06-12 US claimed
EP-4560757-A1 ELECTROLYTE FOR SECONDARY BATTERY, SECONDARY BATTERY, BATTERY MODULE, BATTERY PACK, AND ELECTRICAL DEVICE Contemporary Amperex Technology Co., Limited (CN) 2025-05-28 EP claimed
WO-2025093527-A1 AN EMULSIFIABLE CONCENTRATE HAVING AN AMIDE/ESTER/CO-SOLVENT SOLVENT SYSTEM BASF SE (DE) 2025-05-08 WO claimed
US-20250109245-A1 PREPARATION OF UNSATURATED POLYESTERS EASTMAN CHEMICAL COMPANY (US) 2025-04-03 US claimed
US-20250075147-A1 FRAGRANCE AND FLAVOR COMPOSITIONS COMPRISING NEW FLAVOR AND FRAGRANCE INGREDIENTS OSMO LABS, PBC 2025-03-06 US claimed
US-20250068074-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE, PRODUCTION METHOD FOR CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-02-27 US claimed
US-20250060675-A1 PHOTORESIST STRIPPER COMPOSITION AND METHOD FOR FORMING PATTERN USING THE SAME SAMSUNG DISPLAY CO LTD (KR) 2025-02-20 US claimed
US-5569318-A MIXTUR OF SILICA SOL, GLYCERIN AND N,N-DIMETYL ACETOACETAMIDE APPLIED RESEARCH, INC. (US) 1996-10-29 US claimed
US-5352372-A Mixing dimethyldihydroxyethylene urea resin or an alkylated dimethyldihydroxyethylene urea with formaldehyde scavanger dimethylacetoacetamide to react; better whiteness SEQUA CHEMICALS, INC. (US) 1994-10-04 US claimed
WO-1994021589-A1 CITRACONIC ANHYDRIDE PREPARATION PROCESS AKZO NOBEL N.V. (NL) 1994-09-29 WO claimed
US-5160679-A Urea-formaldehyde adhesive HEXION INC. 1992-11-03 US claimed
US-5049698-A Chlorination EASTMAN KODAK COMPANY (US) 1991-09-17 US claimed
WO-1989004254-A1 METHOD FOR REPAIRING DAMAGED COMPOSITE ARTICLES THE DOW CHEMICAL COMPANY (US) 1989-05-18 WO claimed
EP-0315086-A2 Rubber modified vinyl ester resins from polyglycidyl ethers of adducts of a phenol with an unsaturated hydrocarbon THE DOW CHEMICAL COMPANY (US) 1989-05-10 EP claimed
EP-0315101-A2 Method for repairing damaged composite articles THE DOW CHEMICAL COMPANY (US) 1989-05-10 EP claimed
US-4824500-A Method for repairing damaged composite articles THE DOW CHEMICAL COMPANY (US) 1989-04-25 US claimed
US-4098930-A IMPREGNATION OF WEB WITH SOLUTION OF COPOLYMER OF ACRYLONITRILE IN DMF, COAGULATION IN WATER THE FUJIKAWA CABLE WORKS, LTD. (JP) 1978-07-04 US claimed