SCHEMBL563823

SCHEMBL563823

C=C(CC(F)(C(F)(F)F)C(F)(F)F)C(=O)O

nearest known ligand 0.59

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
TET2 Q6N021 5/20 0.59
TET3 O43151 1/20 0.39
TET1 Q8NFU7 1/20 0.39
GRIK1 P39086 1/20 0.33
GRIK2 Q13002 1/20 0.33
GRM1 Q13255 1/20 0.33
GRM2 Q14416 1/20 0.33
ALOX15 P16050 1/20 0.33
HSD17B10 Q99714 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3143412 0.91 TET2 (0.55) TET2TET3TET1GRIK1GRIK2
SCHEMBL613504 0.80 TET2 (0.46) TET2TET3TET1
SCHEMBL562519 0.80 TET2 (0.59) TET2TET3TET1GRIK1GRIK2
SCHEMBL562800 0.80 TET2 (0.59) TET2TET3TET1GRIK1GRIK2
SCHEMBL166215 0.79 TET2 (0.58) TET2TET3TET1GRIK1GRIK2
SCHEMBL14556955 0.78 TET2 (0.63) TET2TET3TET1GRIK1GRIK2
SCHEMBL532501 0.76 TET2 (0.55) TET2TET3TET1GRIK1GRIK2
SCHEMBL562995 0.76 TET2 (0.55) TET2TET3TET1GRIK1GRIK2
SCHEMBL563522 0.75 TET2 (0.53) TET2TET3TET1GRIK1GRIK2
SCHEMBL8144771 0.73 TET2 (0.52) TET2TET3TET1GRIK1GRIK2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2404940-B1 Method for producing polymer composition and polymer composition INCTEC INC (JP) 2014-12-24 EP claimed
US-20170160637-A9 UPPER LAYER-FORMING COMPOSITION AND RESIST PATTERNING METHOD JSR CORPORATION (JP) 2017-06-08 US disclosed
US-9529259-B2 Radiation-sensitive resin composition, resist pattern-forming method, acid diffusion control agent, compound, and method for producing compound JSR CORPORATION (JP) 2016-12-27 US disclosed
US-9500950-B2 Fluorine-containing polymer, purification method, and radiation-sensitive resin composition JSR CORPORATION (JP) 2016-11-22 US disclosed
US-9465291-B2 Radiation-sensitive resin composition, polymer, compound, and method for producing compound JSR CORPORATION (JP) 2016-10-11 US disclosed
US-20160109801-A1 UPPER LAYER-FORMING COMPOSITION AND RESIST PATTERNING METHOD JSR CORPORATION (JP) 2016-04-21 US disclosed
US-9268219-B2 Photoresist composition and resist pattern-forming method JSR CORPORATION (JP) 2016-02-23 US disclosed
US-9213236-B2 Fluorine-containing polymer, purification method, and radiation-sensitive resin composition JSR CORPORATION (JP) 2015-12-15 US disclosed
US-20150355539-A1 RADIATION-SENSITIVE RESIN COMPOSITION, RESIST PATTERN-FORMING METHOD, ACID DIFFUSION CONTROL AGENT, COMPOUND, AND METHOD FOR PRODUCING COMPOUND JSR CORPORATION (JP) 2015-12-10 US disclosed
EP-2743319-B1 Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet NITTO DENKO CORP (JP) 2015-07-22 EP disclosed
US-20110212401-A1 RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST PATTERN FORMATION METHOD JSR CORPORATION (JP) 2011-09-01 US disclosed
US-20100285405-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2010-11-11 US disclosed
US-20100255420-A1 RADIATION SENSITIVE RESIN COMPOSITION AND POLYMER JSR CORPORATION (JP) 2010-10-07 US disclosed
US-20100239981-A1 POLYMER AND POSITIVE-TONE RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2010-09-23 US disclosed
US-20100221664-A1 RADIATION-SENSITIVE COMPOSITION JSR CORPORATION (JP) 2010-09-02 US disclosed
US-20100215947-A1 HEAT-EXPANDABLE REMOVABLE ACRYLIC PRESSURE-SENSITIVE ADHESIVE TAPE OR SHEET NITTO DENKO CORPORATION (JP) 2010-08-26 US disclosed
US-7723445-B2 Curable resin composition, molded product, and process for producing the same SHOWA HIGHPOLYMER CO., LTD. (JP) 2010-05-25 US disclosed
US-20100075129-A1 THERMALLY-FOAMABLE RE-RELEASABLE ACRYLIC PRESSURE-SENSITIVE ADHESIVE TAPE OR SHEET NITTO DENKO CORPORATION (JP) 2010-03-25 US disclosed
US-20100021852-A1 COMPOSITION FOR FORMATION OF UPPER LAYER FILM, AND METHOD FOR FORMATION OF PHOTORESIST PATTERN JSR CORPORATION (JP) 2010-01-28 US disclosed
EP-1785440-A1 CURABLE RESIN COMPOSITION, SHAPED ARTICLE AND METHOD FOR PRODUCING SAME Showa Highpolymer Co., Ltd. (JP) 2007-05-16 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20150355539-A1 RADIATION-SENSITIVE RESIN COMPOSITION, RESIST PATTERN-FORMING METHOD, ACID DIFFUSION CONTROL AGENT, COMPOUND, AND METHOD FOR PRODUCING COMPOUND RER1, MSR1, MRPS35 TET2 4300/4885TET3 3885/4885TET1 3326/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.