⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9436553 | 1.00 | — | — | |
| SCHEMBL7788702 | 0.82 | — | — | |
| SCHEMBL10960044 | 0.82 | — | — | |
| SCHEMBL31404134 | 0.82 | — | — | |
| SCHEMBL8907582 | 0.82 | — | — | |
| SCHEMBL10614211 | 0.82 | — | — | |
| SCHEMBL11196504 | 0.82 | — | — | |
| SCHEMBL936744 | 0.82 | — | — | |
| SCHEMBL10769328 | 0.82 | — | — | |
| SCHEMBL29465839 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 2192 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119943760-B | CSMD ceramic tube shell with double-sided heat dissipation and low resistance | 安徽鸿安信电子科技有限公司 | 2026-05-15 | — | — | CN | claimed |
| US-20260088584-A1 | LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF | TAIWAN ASIA SEMICONDUCTOR CORP (TW) | 2026-03-26 | — | — | US | claimed |
| EP-4716035-A1 | LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF | Taiwan-Asia Semiconductor Corporation (TW) | 2026-03-25 | — | — | EP | claimed |
| US-20260020389-A1 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | TAIWAN ASIA SEMICONDUCTOR CORP (TW) | 2026-01-15 | — | — | US | claimed |
| US-20260005670-A1 | FBAR STRUCTURE HAVING SINGLE CRYSTALLINE PIEZOELECTRIC LAYER AND FABRICATING METHOD THEREOF | SHENZHEN NEWSONIC TECH CO LTD (CN) | 2026-01-01 | — | — | US | claimed |
| US-12472588-B2 | Manufacturing insulated spherical weld gold wire for integrated circuit double-layer stacked package | Shenzhen Zhongbao New Material Technology Co., Ltd. (CN) | 2025-11-18 | — | — | US | claimed |
| US-12433068-B2 | LED with ALGAINP window layer | QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD (CN) | 2025-09-30 | — | — | US | claimed |
| US-12418165-B2 | Capacitive feedthrough for hybrid hermetic modules for space applications | THALES ALENIA SPACE ITALIA S.P.A. CON UNICO SOCIO (IT) | 2025-09-16 | — | — | US | claimed |
| US-20250197198-A1 | MANUFACTURING PROCESS FOR MICROELECTROMECHANICAL DEVICES HAVING IMPROVED SEALING PERFORMANCE | STMICROELECTRONICS INTERNATIONAL N.V. (CH) | 2025-06-19 | — | — | US | claimed |
| EP-4571249-A1 | MANUFACTURING PROCESS FOR MICROELECTROMECHANICAL DEVICES HAVING IMPROVED SEALING PERFORMANCE | STMicroelectronics International N.V. (CH) | 2025-06-18 | — | — | EP | claimed |
| US-4692993-A | Schottky barrier charge coupled device (CCD) manufacture | HUGHES ELECTRONICS CORPORATION | 1987-09-15 | — | — | US | claimed |
| US-4665413-A | Edge junction schottky diode | EATON CORPORATION (US) | 1987-05-12 | — | — | US | claimed |
| US-H170-H | Self aligned notch for InP planar transferred electron oscillator | UNITED STATES OF AMERICA (US) | 1986-12-02 | — | — | US | claimed |
| US-4613890-A | Alloyed contact for n-conducting GaAlAs-semi-conductor material | TELEFUNKEN ELECTRONIC GMBH (DE) | 1986-09-23 | — | — | US | claimed |
| US-4499656-A | Deep mesa process for fabricating monolithic integrated Schottky barrier diode for millimeter wave mixers | SPERRY CORPORATION (US) | 1985-02-19 | — | — | US | claimed |
| US-4312112-A | Method of making field-effect transistors with micron and submicron gate lengths | EATON CORPORATION (US) | 1982-01-26 | — | — | US | claimed |
| US-4310570-A | Field-effect transistors with micron and submicron gate lengths | EATON CORPORATION (US) | 1982-01-12 | — | — | US | claimed |
| US-4075650-A | MILLIMETER WAVE SEMICONDUCTOR DEVICE | CUTLER-HAMMER, INC. (US) | 1978-02-21 | — | — | US | claimed |
| US-3986251-A | Germanium doped light emitting diode bonding process | MOTOROLA, INC. (US) | 1976-10-19 | — | — | US | claimed |
| US-3941916-A | Electronic circuit package and method of brazing | BURROUGHS CORPORATION (US) | 1976-03-02 | — | — | US | claimed |