Known targets — ChEMBL curated mechanism
ACHEBDKRB2CHRM1CHRM2CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNGGUCY1A1GUCY1A2GUCY1B1GUCY1B2NAMPTPTAFRSLC10A2SLC6A2SLC6A3TACR1dacAdacBdacCftsImrcAmrcBmrdA
The experimentally established mechanism targets of Hydrochloric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL14958378 | 0.69 | — | — | |
| Hydrochloric Acid SCHEMBL6310520 | 0.65 | — | — | |
| Hydrochloric Acid SCHEMBL9571648 | 0.65 | — | — | |
| Hydrochloric Acid SCHEMBL28557768 | 0.65 | — | — | |
| Hydrochloric Acid SCHEMBL781796 | 0.65 | — | — | |
| SCHEMBL8079535 | 0.65 | — | — | |
| Hydrochloric Acid SCHEMBL27951974 | 0.65 | — | — | |
| Hydrochloric Acid SCHEMBL5827691 | 0.65 | — | — | |
| Hydrochloric Acid SCHEMBL7063112 | 0.65 | — | — | |
| Hydrochloric Acid SCHEMBL17529926 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250357120-A1 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE INCLUDING PLASMA ETCHING PROCESS | SAMSUNG ELECTRONICS CO LTD (KR) | 2025-11-20 | — | — | US | claimed |
| US-20120035056-A1 | Nb-DOPED PEROVSKITE FLUX PINNING OF REBCO BASED SUPERCONDUCTORS BY MOCVD | U.S. DEPARTMENT OF ENERGY | 2012-02-09 | — | — | US | claimed |
| US-20250357120-A1 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE INCLUDING PLASMA ETCHING PROCESS | SAMSUNG ELECTRONICS CO LTD (KR) | 2025-11-20 | — | — | US | disclosed |
| US-12473309-B2 | Organometallic compound and method of manufacturing integrated circuit using the same | SAMSUNG ELECTRONICS CO., LTD. | 2025-11-18 | — | — | US | disclosed |
| CN-118437322-A | High-stability modified supported metal catalyst and preparation method and application thereof | 中国科学院大学 | 2024-08-06 | — | — | CN | disclosed |
| US-20210388010-A1 | ORGANOMETALLIC COMPOUND AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT USING THE SAME | ADEKA CORPORATION (JP) | 2021-12-16 | — | — | US | disclosed |
| US-10844073-B2 | Palladium-mediated ketolization | PRESIDENT AND FELLOWS OF HARVARD COLLEGE (US) | 2020-11-24 | — | — | US | disclosed |
| EP-3074450-B1 | MOISTURE CURABLE COMPOUND WITH METAL-ARENE COMPLEXES | MOMENTIVE PERFORMANCE MAT INC (US) | 2020-11-11 | — | — | EP | disclosed |
| CN-105793326-B | Moisture-curable compositions with metal-arene complexes | 莫门蒂夫性能材料股份有限公司 | 2020-07-21 | — | — | CN | disclosed |
| US-10392400-B2 | Palladium-mediated ketolization | PRESIDENT AND FELLOWS OF HARVARD COLLEGE (US) | 2019-08-27 | — | — | US | disclosed |
| US-10174169-B2 | Moisture curable compound with metal-arene complexes | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2019-01-08 | — | — | US | disclosed |
| US-8703638-B2 | Process for production and use of carbonitride mixture particles or oxycarbonitride mixture particles | SHOWA DENKO K.K. (JP) | 2014-04-22 | — | — | US | disclosed |
| US-20120035056-A1 | Nb-DOPED PEROVSKITE FLUX PINNING OF REBCO BASED SUPERCONDUCTORS BY MOCVD | U.S. DEPARTMENT OF ENERGY | 2012-02-09 | — | — | US | disclosed |
| US-20110183234-A1 | PROCESS FOR PRODUCTION AND USE OF CARBONITRIDE MIXTURE PARTICLES OR OXYCARBONITRIDE MIXTURE PARTICLES | SHOWA DENKO K.K. (JP) | 2011-07-28 | — | — | US | disclosed |
| EP-2347996-A1 | METHOD FOR PRODUCING CARBONITRIDE MIXTURE PARTICLE OR OXYCARBONITRIDE MIXTURE PARTICLE, AND USE THEREOF | Showa Denko K.K. (JP) | 2011-07-27 | — | — | EP | disclosed |
| US-20080178476-A1 | Sharpener Blade | KUM LIMITED (IE) | 2008-07-31 | — | — | US | disclosed |
| US-6790918-B2 | OLEFIN POLYMERIZATION CATALYSTS, PYRIDINE OR QUINOLINE CONTAINING LIGAND WITH GROUP 4 METAL | EQUISTAR CHEMICALS, LP | 2004-09-14 | — | — | US | disclosed |
| US-6759493-B1 | NOVEL BIDENTATE PYRIDINE TRANSITION METAL COMPOUNDS WHICH HAVE EXCELLENT ACTIVITY AS ALPHA-OLEFIN POLYMERIZATION CATALYSTS | EQUISTAR CHEMICALS, LP | 2004-07-06 | — | — | US | disclosed |
| US-20040097670-A1 | Transition metal catalysts containing bidentate ligands and method of using and preparing same | EQUISTAR CHEMICALS, LP | 2004-05-20 | — | — | US | disclosed |
| US-6034027-A | COORDINATION CATALYST | EQUISTAR CHEMICALS, LP (US) | 2000-03-07 | — | — | US | disclosed |