Hydrochloric Acid

Hydrochloric Acid

SCHEMBL564335

[Cl-].[Cl-].[Cl-].[Cl-].[Nb+4]C1=CC=CC1

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ACHEBDKRB2CHRM1CHRM2CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNGGUCY1A1GUCY1A2GUCY1B1GUCY1B2NAMPTPTAFRSLC10A2SLC6A2SLC6A3TACR1dacAdacBdacCftsImrcAmrcBmrdA

The experimentally established mechanism targets of Hydrochloric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250357120-A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE INCLUDING PLASMA ETCHING PROCESS SAMSUNG ELECTRONICS CO LTD (KR) 2025-11-20 US claimed
US-20120035056-A1 Nb-DOPED PEROVSKITE FLUX PINNING OF REBCO BASED SUPERCONDUCTORS BY MOCVD U.S. DEPARTMENT OF ENERGY 2012-02-09 US claimed
US-20250357120-A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE INCLUDING PLASMA ETCHING PROCESS SAMSUNG ELECTRONICS CO LTD (KR) 2025-11-20 US disclosed
US-12473309-B2 Organometallic compound and method of manufacturing integrated circuit using the same SAMSUNG ELECTRONICS CO., LTD. 2025-11-18 US disclosed
CN-118437322-A High-stability modified supported metal catalyst and preparation method and application thereof 中国科学院大学 2024-08-06 CN disclosed
US-20210388010-A1 ORGANOMETALLIC COMPOUND AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT USING THE SAME ADEKA CORPORATION (JP) 2021-12-16 US disclosed
US-10844073-B2 Palladium-mediated ketolization PRESIDENT AND FELLOWS OF HARVARD COLLEGE (US) 2020-11-24 US disclosed
EP-3074450-B1 MOISTURE CURABLE COMPOUND WITH METAL-ARENE COMPLEXES MOMENTIVE PERFORMANCE MAT INC (US) 2020-11-11 EP disclosed
CN-105793326-B Moisture-curable compositions with metal-arene complexes 莫门蒂夫性能材料股份有限公司 2020-07-21 CN disclosed
US-10392400-B2 Palladium-mediated ketolization PRESIDENT AND FELLOWS OF HARVARD COLLEGE (US) 2019-08-27 US disclosed
US-10174169-B2 Moisture curable compound with metal-arene complexes MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2019-01-08 US disclosed
US-8703638-B2 Process for production and use of carbonitride mixture particles or oxycarbonitride mixture particles SHOWA DENKO K.K. (JP) 2014-04-22 US disclosed
US-20120035056-A1 Nb-DOPED PEROVSKITE FLUX PINNING OF REBCO BASED SUPERCONDUCTORS BY MOCVD U.S. DEPARTMENT OF ENERGY 2012-02-09 US disclosed
US-20110183234-A1 PROCESS FOR PRODUCTION AND USE OF CARBONITRIDE MIXTURE PARTICLES OR OXYCARBONITRIDE MIXTURE PARTICLES SHOWA DENKO K.K. (JP) 2011-07-28 US disclosed
EP-2347996-A1 METHOD FOR PRODUCING CARBONITRIDE MIXTURE PARTICLE OR OXYCARBONITRIDE MIXTURE PARTICLE, AND USE THEREOF Showa Denko K.K. (JP) 2011-07-27 EP disclosed
US-20080178476-A1 Sharpener Blade KUM LIMITED (IE) 2008-07-31 US disclosed
US-6790918-B2 OLEFIN POLYMERIZATION CATALYSTS, PYRIDINE OR QUINOLINE CONTAINING LIGAND WITH GROUP 4 METAL EQUISTAR CHEMICALS, LP 2004-09-14 US disclosed
US-6759493-B1 NOVEL BIDENTATE PYRIDINE TRANSITION METAL COMPOUNDS WHICH HAVE EXCELLENT ACTIVITY AS ALPHA-OLEFIN POLYMERIZATION CATALYSTS EQUISTAR CHEMICALS, LP 2004-07-06 US disclosed
US-20040097670-A1 Transition metal catalysts containing bidentate ligands and method of using and preparing same EQUISTAR CHEMICALS, LP 2004-05-20 US disclosed
US-6034027-A COORDINATION CATALYST EQUISTAR CHEMICALS, LP (US) 2000-03-07 US disclosed