SCHEMBL564550

SCHEMBL564550

CS(=O)(=S)OCCCOS(C)(=O)=S

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.52
USP2 O75604 2/20 0.52
KDM4E B2RXH2 1/20 0.52
ALDH1A1 P00352 1/20 0.52
LMNA P02545 1/20 0.52
MMP9 P14780 1/20 0.52
ALOX15 P16050 1/20 0.52
CA1 P00915 17/20 0.39
CA2 P00918 17/20 0.39
CA9 Q16790 15/20 0.39
CA12 O43570 5/20 0.38
CA7 P43166 5/20 0.38
CA14 Q9ULX7 5/20 0.38
CA3 P07451 4/20 0.38
CA4 P22748 4/20 0.38
CA6 P23280 4/20 0.38
CA5A P35218 4/20 0.38
CA5B Q9Y2D0 4/20 0.38
GLA P06280 1/20 0.34
HPGD P15428 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL563993 0.94 TSHR (0.60) TSHRUSP2KDM4EALDH1A1LMNA
SCHEMBL5838756 0.92 TSHR (0.57) TSHRUSP2KDM4EALDH1A1LMNA
SCHEMBL10890011 0.92 TSHR (0.57) TSHRUSP2KDM4EALDH1A1LMNA
SCHEMBL565381 0.88 USP2 (0.43) TSHRUSP2KDM4EALDH1A1LMNA
SCHEMBL5475262 0.87
SCHEMBL2397966 0.85
SCHEMBL5471922 0.85 CA1 (0.58) TSHRUSP2KDM4EALDH1A1LMNA
SCHEMBL5717944 0.83 CA1 (0.59) TSHRUSP2KDM4EALDH1A1LMNA
SCHEMBL5480655 0.83 CA1 (0.59) TSHRUSP2KDM4EALDH1A1LMNA
SCHEMBL5464695 0.83 CA1 (0.59) TSHRUSP2KDM4EALDH1A1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8956523-B2 Metal plating compositions and methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2015-02-17 US disclosed
US-20140081045-A1 METAL PLATING COMPOSITIONS AND METHODS ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2014-03-20 US disclosed
EP-1978134-B1 Metal plating compositions ROHM & HAAS ELECT MAT (US) 2013-09-11 EP disclosed
US-8337688-B2 Metal plating compositions ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2012-12-25 US disclosed
US-8329018-B2 Metal plating compositions and methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2012-12-11 US disclosed
EP-1978051-B1 Metal plating compositions and methods ROHM & HAAS ELECT MAT (US) 2012-02-22 EP disclosed
US-20120034371-A1 METAL PLATING COMPOSITIONS ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2012-02-09 US disclosed
US-20110318479-A1 METAL PLATING COMPOSITIONS AND METHODS ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2011-12-29 US disclosed
US-8048284-B2 Mixture of metal compound and polyamideether copolymer; electrical or decorative article; printed circuits; improved leveling and throwing power ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2011-11-01 US disclosed
US-8012334-B2 provide good leveling performance and throwing power; additives to improve the brightness, ductility and plating distribution of the metal deposit ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2011-09-06 US disclosed
US-20080269395-A1 Metal plating compositions ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2008-10-30 US disclosed
US-20080268138-A1 Metal plating compositions and methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2008-10-30 US disclosed
EP-1978051-A1 Metal plating compositions and methods Rohm and Haas Electronic Materials, L.L.C. (US) 2008-10-08 EP disclosed
EP-1978134-A1 Metal plating compositions Rohm and Haas Electronic Materials LLC (US) 2008-10-08 EP disclosed
US-20040104124-A1 Plating bath and method for depositing a metal layer on a substrate SHIPLEY COMPANY, L.L.C. 2004-06-03 US disclosed
US-6736954-B2 A METAL PLATING BATH COMPRISING METAL SALTS AND AN ADDITIVE CONSUMPTION INHIBITOR(A HETEROATOM ORGANIC COMPOUNDS WHICH MAY CONTAIN SULFUR, OXYGEN OR NITROGEN HETEROATOMS) IMPROVE THE BRIGHTNESS OF PLATED METAL AS WELL AS THE DUCTILITY SHIPLEY COMPANY, L.L.C. 2004-05-18 US disclosed
EP-1308540-A1 Plating bath and method for depositing a metal layer on a substrate Shipley Co. L.L.C. (US) 2003-05-07 EP disclosed
US-20030070934-A1 Plating bath and method for depositing a metal layer on a substrate SHIPLEY COMPANY, L.L.C. 2003-04-17 US disclosed