SCHEMBL565381

SCHEMBL565381

CS(=O)(=S)OCCOS(C)(=O)=S

nearest known ligand 0.43

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
USP2 O75604 2/20 0.43
TSHR P16473 2/20 0.43
KDM4E B2RXH2 2/20 0.43
ALDH1A1 P00352 1/20 0.43
LMNA P02545 1/20 0.43
MMP9 P14780 1/20 0.43
ALOX15 P16050 1/20 0.43
CA1 P00915 4/20 0.33
CA2 P00918 4/20 0.33
CYP3A4 P08684 1/20 0.31
CA9 Q16790 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3490136 0.91 USP2 (0.38) USP2TSHRKDM4EALDH1A1LMNA
SCHEMBL30320761 0.91 USP2 (0.38) USP2TSHRKDM4EALDH1A1LMNA
SCHEMBL5838819 0.91 USP2 (0.38) USP2TSHRKDM4EALDH1A1LMNA
SCHEMBL5838959 0.91 USP2 (0.38) USP2TSHRKDM4EALDH1A1LMNA
SCHEMBL564550 0.88 TSHR (0.52) USP2TSHRKDM4EALDH1A1LMNA
SCHEMBL563993 0.88 TSHR (0.60) USP2TSHRKDM4EALDH1A1LMNA
SCHEMBL5474235 0.85
SCHEMBL5838756 0.85 TSHR (0.57) USP2TSHRKDM4EALDH1A1LMNA
SCHEMBL10890011 0.85 TSHR (0.57) USP2TSHRKDM4EALDH1A1LMNA
SCHEMBL5464707 0.83

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025226837-A1 ANTI-BACTERIAL METALLOTHIONEIN ANTIBODIES AND USES THEREOF UNIVERSITY OF CONNECTICUT (US) 2025-10-30 WO disclosed
US-8956523-B2 Metal plating compositions and methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2015-02-17 US disclosed
US-20140081045-A1 METAL PLATING COMPOSITIONS AND METHODS ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2014-03-20 US disclosed
EP-1978134-B1 Metal plating compositions ROHM & HAAS ELECT MAT (US) 2013-09-11 EP disclosed
US-8337688-B2 Metal plating compositions ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2012-12-25 US disclosed
US-8329018-B2 Metal plating compositions and methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2012-12-11 US disclosed
EP-1978051-B1 Metal plating compositions and methods ROHM & HAAS ELECT MAT (US) 2012-02-22 EP disclosed
US-20120034371-A1 METAL PLATING COMPOSITIONS ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2012-02-09 US disclosed
US-20110318479-A1 METAL PLATING COMPOSITIONS AND METHODS ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2011-12-29 US disclosed
US-8048284-B2 Mixture of metal compound and polyamideether copolymer; electrical or decorative article; printed circuits; improved leveling and throwing power ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2011-11-01 US disclosed
US-8012334-B2 provide good leveling performance and throwing power; additives to improve the brightness, ductility and plating distribution of the metal deposit ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2011-09-06 US disclosed
US-20080269395-A1 Metal plating compositions ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2008-10-30 US disclosed
US-20080268138-A1 Metal plating compositions and methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2008-10-30 US disclosed
EP-1978051-A1 Metal plating compositions and methods Rohm and Haas Electronic Materials, L.L.C. (US) 2008-10-08 EP disclosed
EP-1978134-A1 Metal plating compositions Rohm and Haas Electronic Materials LLC (US) 2008-10-08 EP disclosed
US-20040104124-A1 Plating bath and method for depositing a metal layer on a substrate SHIPLEY COMPANY, L.L.C. 2004-06-03 US disclosed
US-6736954-B2 A METAL PLATING BATH COMPRISING METAL SALTS AND AN ADDITIVE CONSUMPTION INHIBITOR(A HETEROATOM ORGANIC COMPOUNDS WHICH MAY CONTAIN SULFUR, OXYGEN OR NITROGEN HETEROATOMS) IMPROVE THE BRIGHTNESS OF PLATED METAL AS WELL AS THE DUCTILITY SHIPLEY COMPANY, L.L.C. 2004-05-18 US disclosed
EP-1308540-A1 Plating bath and method for depositing a metal layer on a substrate Shipley Co. L.L.C. (US) 2003-05-07 EP disclosed
US-20030070934-A1 Plating bath and method for depositing a metal layer on a substrate SHIPLEY COMPANY, L.L.C. 2003-04-17 US disclosed