Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.43 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.43 |
| ▸ | SIGMAR1 | Q99720 | 1/20 | 0.41 |
| ▸ | TSHR | P16473 | 1/20 | 0.39 |
| ▸ | APOBEC3A | P31941 | 1/20 | 0.38 |
| ▸ | APOBEC3G | Q9HC16 | 1/20 | 0.38 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.38 |
| ▸ | ACHE | P22303 | 1/20 | 0.37 |
| ▸ | IDO1 | P14902 | 1/20 | 0.37 |
| ▸ | EGFR | P00533 | 1/20 | 0.36 |
| ▸ | ERBB2 | P04626 | 1/20 | 0.36 |
| ▸ | MAOA | P21397 | 1/20 | 0.36 |
| ▸ | MAOB | P27338 | 1/20 | 0.36 |
| ▸ | SLC6A2 | P23975 | 2/20 | 0.35 |
| ▸ | SLC6A3 | Q01959 | 2/20 | 0.35 |
| ▸ | TAAR1 | Q96RJ0 | 1/20 | 0.35 |
| ▸ | HTR2A | P28223 | 1/20 | 0.35 |
| ▸ | SLC6A4 | P31645 | 1/20 | 0.35 |
| ▸ | HRH1 | P35367 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Fluoride Ion SCHEMBL124362 | 0.96 | TDP1 (0.41) | KDM4EALDH1A1TDP1SIGMAR1TSHR | |
| Fluoride Ion SCHEMBL124361 | 0.96 | TDP1 (0.41) | KDM4EALDH1A1TDP1SIGMAR1TSHR | |
| SCHEMBL14948410 | 0.90 | CNR2 (0.38) | KDM4EALDH1A1TDP1SIGMAR1APOBEC3A | |
| SCHEMBL565108 | 0.85 | KDM4E (0.58) | KDM4EALDH1A1TDP1APOBEC3AAPOBEC3G | |
| Water SCHEMBL9684775 | 0.83 | KDM4E (0.56) | KDM4EALDH1A1TDP1APOBEC3AAPOBEC3G | |
| SCHEMBL21747552 | 0.83 | KDM4E (0.56) | KDM4EALDH1A1TDP1APOBEC3AAPOBEC3G | |
| Hydrochloric Acid SCHEMBL1559083 | 0.83 | KDM4E (0.62) | KDM4EALDH1A1TDP1APOBEC3AAPOBEC3G | |
| Iodide SCHEMBL22188504 | 0.83 | KDM4E (0.56) | KDM4EALDH1A1TDP1APOBEC3AAPOBEC3G | |
| Ammonia Solution, Strong SCHEMBL28850907 | 0.83 | KDM4E (0.56) | KDM4EALDH1A1TDP1APOBEC3AAPOBEC3G | |
| Bromide SCHEMBL6122965 | 0.83 | KDM4E (0.56) | KDM4EALDH1A1TDP1APOBEC3AAPOBEC3G |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2387735-B1 | NONPOLYMERIC BINDERS FOR SEMICONDUCTOR SUBSTRATE COATINGS | FUJIFILM ELECTRONIC MAT USA INC (US) | 2019-03-13 | — | — | EP | disclosed |
| US-8729166-B2 | Polymer composition for microelectronic assembly | PROMERUS, LLC (US) | 2014-05-20 | — | — | US | disclosed |
| US-20140024750-A1 | Polymer Composition for Microelectronic Assembly | PROMERUS, LLC (US) | 2014-01-23 | — | — | US | disclosed |
| US-8575248-B2 | Polymer composition for microelectronic assembly | PROMERUS, LLC (US) | 2013-11-05 | — | — | US | disclosed |
| US-8535872-B2 | Thermally cured underlayer for lithographic application | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2013-09-17 | — | — | US | disclosed |
| EP-2601239-A1 | POLYMER COMPOSITION FOR MICROELECTRONIC ASSEMBLY | Promerus, LLC (US) | 2013-06-12 | — | — | EP | disclosed |
| US-20120178871-A1 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | DE BINOD B (US) | 2012-07-12 | — | — | US | disclosed |
| US-8153346-B2 | Hydroxyl containing polymer, amino crosslinking agent and thermal acid generator; undercoating for multilayer lithography material | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2012-04-10 | — | — | US | disclosed |
| WO-2012019092-A1 | POLYMER COMPOSITION FOR MICROELECTRONIC ASSEMBLY | PROMERUS LLC (US) | 2012-02-09 | — | — | WO | disclosed |
| US-20120034387-A1 | Polymer Composition for Microelectronic Assembly | PROMERUS LLC (US) | 2012-02-09 | — | — | US | disclosed |
| US-8037621-B2 | Article of footwear including a woven strap system | NIKE, INC. (US) | 2011-10-18 | — | — | US | disclosed |
| WO-2010083350-A1 | NONPOLYMERIC BINDERS FOR SEMICONDUCTOR SUBSTRATE COATINGS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2010-07-22 | — | — | WO | disclosed |
| US-7727705-B2 | High etch resistant underlayer compositions for multilayer lithographic processes | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2010-06-01 | — | — | US | disclosed |
| EP-2089774-A2 | DEVICE MANUFACTURING PROCESS UTILIZING A DOUBLE PATTERING PROCESS | FujiFilm Electronic Materials USA, Inc. (US) | 2009-08-19 | — | — | EP | disclosed |
| WO-2008140846-A1 | HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-11-20 | — | — | WO | disclosed |
| US-20080206667-A1 | HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. | 2008-08-28 | — | — | US | disclosed |
| US-20080206676-A1 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS, U.S.A, INC | 2008-08-28 | — | — | US | disclosed |
| WO-2008103776-A2 | THERMALLY CURED UNDERLAYER FOR LITHOGRAPHIC APPLICATION | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-08-28 | — | — | WO | disclosed |
| US-20080199814-A1 | Device manufacturing process utilizing a double patterning process | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. | 2008-08-21 | — | — | US | disclosed |
| WO-2008070060-A2 | DEVICE MANUFACTURING PROCESS UTILIZING A DOUBLE PATTERING PROCESS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-06-12 | — | — | WO | disclosed |