Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | RAB9A | P51151 | 16/20 | 0.86 |
| ▸ | NPC1 | O15118 | 15/20 | 0.86 |
| ▸ | GFER | P55789 | 3/20 | 0.86 |
| ▸ | RXFP1 | Q9HBX9 | 2/20 | 0.86 |
| ▸ | MAPT | P10636 | 10/20 | 0.71 |
| ▸ | KDM4E | B2RXH2 | 10/20 | 0.71 |
| ▸ | ALDH1A1 | P00352 | 9/20 | 0.71 |
| ▸ | TP53 | P04637 | 7/20 | 0.71 |
| ▸ | MEN1 | O00255 | 6/20 | 0.71 |
| ▸ | KMT2A | Q03164 | 6/20 | 0.71 |
| ▸ | HSD17B10 | Q99714 | 5/20 | 0.71 |
| ▸ | SMN1; SMN2 | Q16637 | 9/20 | 0.71 |
| ▸ | NFKB1 | P19838 | 4/20 | 0.71 |
| ▸ | NFKB2 | Q00653 | 4/20 | 0.71 |
| ▸ | RELA | Q04206 | 4/20 | 0.71 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.71 |
| ▸ | HPGD | P15428 | 5/20 | 0.69 |
| ▸ | ATM | Q13315 | 2/20 | 0.69 |
| ▸ | GLA | P06280 | 1/20 | 0.69 |
| ▸ | GAA | P10253 | 1/20 | 0.69 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29603993 | 1.00 | RAB9A (0.86) | RAB9ANPC1GFERRXFP1MAPT | |
| SCHEMBL1852701 | 0.93 | RAB9A (1.00) | RAB9ANPC1GFERRXFP1MAPT | |
| SCHEMBL29404722 | 0.93 | RAB9A (1.00) | RAB9ANPC1GFERRXFP1MAPT | |
| SCHEMBL5371887 | 0.92 | NPC1 (0.73) | RAB9ANPC1GFERRXFP1MAPT | |
| SCHEMBL2488592 | 0.91 | RAB9A (0.96) | RAB9ANPC1GFERRXFP1MAPT | |
| SCHEMBL30296348 | 0.91 | RAB9A (0.96) | RAB9ANPC1GFERRXFP1MAPT | |
| SCHEMBL2251048 | 0.91 | RAB9A (0.71) | RAB9ANPC1GFERRXFP1MAPT | |
| SCHEMBL2247126 | 0.91 | RAB9A (0.71) | RAB9ANPC1GFERRXFP1MAPT | |
| SCHEMBL31696797 | 0.89 | RAB9A (0.93) | RAB9ANPC1GFERRXFP1MAPT | |
| SCHEMBL12210849 | 0.89 | RAB9A (0.79) | RAB9ANPC1GFERRXFP1MAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5777068-A | Photosensitive polyimide resin composition | NIPPON ZEON CO., LTD. (JP) | 1998-07-07 | — | — | US | claimed |
| EP-0702270-A2 | Photosensitive polyimide resin composition | NIPPON ZEON CO., LTD. (JP) | 1996-03-20 | — | — | EP | claimed |
| US-7438950-B2 | Metallic pattern forming method and conductive pattern material | FUJIFILM CORPORATION (JP) | 2008-10-21 | — | — | US | disclosed |
| US-7438950-B2 | Metallic pattern forming method and conductive pattern material | FUJIFILM CORPORATION (JP) | 2008-10-21 | — | — | US | disclosed |
| US-7151138-B2 | Resin composition of poly(aryl ketone), poly(arylene sulfide) and thermosetting imide resine | KUREHA CORPORATION (JP) | 2006-12-19 | — | — | US | disclosed |
| EP-1416015-B1 | Resin composition | KUREHA CHEMICAL IND CO LTD (JP) | 2006-01-18 | — | — | EP | disclosed |
| US-6743851-B2 | MIXTURE CONTAINING TETRAZOLE | NIPPON ZEON CO., LTD. (JP) | 2004-06-01 | — | — | US | disclosed |
| US-6734248-B2 | CONTAINING A 1H-TETRAZOLE OR A 5,5'-BIS-1H-TETRAZOLE | NIPPON ZEON CO., LTD. (JP) | 2004-05-11 | — | — | US | disclosed |
| US-20040087733-A1 | Resin composition | KUREHA CORPORATION (JP) | 2004-05-06 | — | — | US | disclosed |
| EP-1416015-A1 | Resin composition | Kureha Chemical Industry Co., Ltd. (JP) | 2004-05-06 | — | — | EP | disclosed |
| EP-0822229-B1 | POLYIMIDE RESIN COMPOSITION | NIPPON ZEON CO (JP) | 2003-07-30 | — | — | EP | disclosed |
| US-6403289-B1 | ALKALINE SOLUTION CONTAINING PHOTOPOLYMERIZABLE POLYAMIC ACID, BENZYLTRIALKYLAMMONIUM (OR PHOSPHONIUM) SALT OR BENZYLTRIARYLAMMONIUM (OR PHOSPHONIUM) SALT AND BASE; SEMICONDUCTORS | NIPPON ZEON CO., LTD. (JP) | 2002-06-11 | — | — | US | disclosed |
| US-20020035196-A1 | Polyimide film | TANAKA AKIRA (JP) | 2002-03-21 | — | — | US | disclosed |
| US-20020032273-A1 | Pattern forming process using polyimide resin composition | TANAKA AKIRA (JP) | 2002-03-14 | — | — | US | disclosed |
| US-6310135-B1 | PHOTOSENSITIVE RESINS WITH TETRAZOLE COMPOUND | NIPPON ZEON CO., LTD. (JP) | 2001-10-30 | — | — | US | disclosed |
| US-6160081-A | Photosensitive polyimide resin composition | NIPPON ZEON CO., LTD. (JP) | 2000-12-12 | — | — | US | disclosed |
| US-5886136-A | Pattern forming process | NIPPON ZEON CO., LTD. (JP) | 1999-03-23 | — | — | US | disclosed |
| US-5777068-A | Photosensitive polyimide resin composition | NIPPON ZEON CO., LTD. (JP) | 1998-07-07 | — | — | US | disclosed |
| EP-0822229-A1 | POLYIMIDE RESIN COMPOSITION | NIPPON ZEON CO., LTD. (JP) | 1998-02-04 | — | — | EP | disclosed |
| EP-0702270-A2 | Photosensitive polyimide resin composition | NIPPON ZEON CO., LTD. (JP) | 1996-03-20 | — | — | EP | disclosed |