⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31365278 | 0.87 | — | — | |
| SCHEMBL31318452 | 0.87 | — | — | |
| SCHEMBL29368341 | 0.82 | — | — | |
| SCHEMBL29351697 | 0.82 | — | — | |
| SCHEMBL3475096 | 0.82 | — | — | |
| SCHEMBL29359857 | 0.82 | — | — | |
| SCHEMBL29967248 | 0.82 | — | — | |
| SCHEMBL31305565 | 0.82 | — | — | |
| SCHEMBL9340102 | 0.82 | — | — | |
| SCHEMBL15390446 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119319251-A | Preparation method of indium-based alloy powder for low-melting-point soldering paste | 北京科技大学 | 2025-01-17 | — | — | CN | claimed |
| CN-115172190-B | Alloy welding method of power chip on T-shaped tube shell | 锦州七七七微电子有限责任公司 | 2024-12-06 | — | — | CN | claimed |
| CN-112967938-B | Aerospace-level integrated circuit total dose shielding method and anti-radiation reinforcement effect verification method | 中国电子科技集团公司第四十七研究所 | 2024-11-08 | — | — | CN | claimed |
| CN-117182226-A | Welding method for non-packaging slide circuit | 北京无线电测量研究所 | 2023-12-08 | — | — | CN | claimed |
| CN-116936481-A | Silicon carbide-based rotary rectifier diode suitable for 250 DEG C | 辽宁芯诺电子科技有限公司 | 2023-10-24 | — | — | CN | claimed |
| CN-116844982-A | Encapsulation method of photo MOS relay | 山东航天电子技术研究所 | 2023-10-03 | — | — | CN | claimed |
| CN-112151400-B | Method for solving problem of bonding of SMD tube shell with gold-aluminum system | 锦州七七七微电子有限责任公司 | 2023-04-21 | — | — | CN | claimed |
| CN-115172190-A | Alloy welding method for power chip on T-shaped pipe shell | 锦州七七七微电子有限责任公司 | 2022-10-11 | — | — | CN | claimed |
| CN-112151400-A | Method for solving SMD tube shell bonding point gold-aluminum system | 锦州七七七微电子有限责任公司 | 2020-12-29 | — | — | CN | claimed |
| EP-3353125-A1 | HIGH OPTICAL POWER LIGHT CONVERSION DEVICE USING A PHOSPHOR ELEMENT WITH SOLDER ATTACHMENT | Materion Corporation (US) | 2018-08-01 | — | — | EP | claimed |
| WO-2017053747-A1 | HIGH OPTICAL POWER LIGHT CONVERSION DEVICE USING A PHOSPHOR ELEMENT WITH SOLDER ATTACHMENT | Materion Corporation (US) | 2017-03-30 | — | — | WO | claimed |
| US-12526920-B1 | Indium-niobium superconducting solder columns for cryogenic and quantum computer applications and methods for making same | TOPLINE CORPORATION (US) | 2026-01-13 | — | — | US | disclosed |
| CN-120816089-A | Tool clamp for surface treatment of SIP module low-temperature solder and treatment welding method | 中国电子科技集团公司第二十研究所 | 2025-10-21 | — | — | CN | disclosed |
| CN-119319251-A | Preparation method of indium-based alloy powder for low-melting-point soldering paste | 北京科技大学 | 2025-01-17 | — | — | CN | disclosed |
| CN-115172190-B | Alloy welding method of power chip on T-shaped tube shell | 锦州七七七微电子有限责任公司 | 2024-12-06 | — | — | CN | disclosed |
| CN-205907314-U | System for handle zinc leaching residue | 江苏省冶金设计院有限公司 | 2017-01-25 | — | — | CN | disclosed |
| CN-106148682-A | Process the method and system of zinc leaching residue | 江苏省冶金设计院有限公司 | 2016-11-23 | — | — | CN | disclosed |
| CN-104107989-A | High-temperature semiconductor solid crystal solder paste and preparation method thereof | SHANGHAI PLUS NEW MATERIAL TECHNOLOGY CO LTD | 2014-10-22 | — | — | CN | disclosed |
| CN-103782459-A | Semiconductor laser mounting with intact diffusion barrier layer | SPECTRASENSORS INC | 2014-05-07 | — | — | CN | disclosed |
| WO-2006020769-A1 | SEMICONDUCTOR ATTACHMENT METHOD AND ASSEMBLY | CRYDOM TECHNOLOGIES (KY) | 2006-02-23 | — | — | WO | disclosed |