⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3475096 | 1.00 | — | — | |
| SCHEMBL31020876 | 0.82 | — | — | |
| SCHEMBL7142804 | 0.82 | — | — | |
| SCHEMBL11173483 | 0.82 | — | — | |
| SCHEMBL10599496 | 0.82 | — | — | |
| SCHEMBL31070051 | 0.82 | — | — | |
| Lithium SCHEMBL31306357 | 0.82 | — | — | |
| SCHEMBL15390446 | 0.82 | — | — | |
| SCHEMBL5657111 | 0.82 | — | — | |
| SCHEMBL34461900 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 666 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260123381-A1 | SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME | STATS CHIPPAC MAN PTE LTD (SG) | 2026-04-30 | — | — | US | claimed |
| EP-3471621-B1 | DEVICES AND METHODS FOR ACOUSTIC PARTICLE SEPARATION | BECTON DICKINSON CO (US) | 2026-04-29 | — | — | EP | claimed |
| US-20260082908-A1 | Heat Dissipating Lid, Chip Package Structure, and Electronic Device | HUAWEI TECHNOLOGIES CO., LTD. (CN) | 2026-03-19 | — | — | US | claimed |
| EP-4704149-A1 | HEAT DISSIPATION COVER, CHIP PACKAGING STRUCTURE AND ELECTRONIC DEVICE | Huawei Technologies Co., Ltd. (CN) | 2026-03-04 | — | — | EP | claimed |
| CN-120201867-A | Green light organic electroluminescent device based on Pt (II) complex and preparation method thereof | 电子科技大学 | 2025-06-24 | — | — | CN | claimed |
| US-20250201692-A1 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2025-06-19 | — | — | US | claimed |
| CN-120090047-A | High-power semiconductor laser stacked array and packaging method thereof | 山东华光光电子股份有限公司 | 2025-06-03 | — | — | CN | claimed |
| CN-120040095-A | Low-radiation film, coated laminated glass and coated hollow glass | 布勒莱宝光学设备（北京）有限公司 | 2025-05-27 | — | — | CN | claimed |
| CN-119811779-A | Second-generation high-temperature superconducting tape composite structure and preparation method thereof | 上海交通大学 | 2025-04-11 | — | — | CN | claimed |
| CN-119776777-A | Preparation method of sputtering plane silver-indium alloy target | 芜湖映日科技股份有限公司 | 2025-04-08 | — | — | CN | claimed |
| CN-112531036-B | Flexible silver-indium double gradient doped CZTSSe film and preparation method and application thereof | 福州大学 | 2022-06-10 | — | — | CN | claimed |
| CN-216413048-U | Chip device | 海光信息技术股份有限公司 | 2022-04-29 | — | — | CN | claimed |
| CN-114323478-A | Method for detecting high-vacuum sealing performance of indium-silver alloy | 兰州空间技术物理研究所 | 2022-04-12 | — | — | CN | claimed |
| CN-114023709-B | Combined type substrate structure suitable for heat dissipation of high-power bare chip | 中国电子科技集团公司第二十九研究所 | 2022-03-22 | — | — | CN | claimed |
| CN-108620764-B | Soldering paste for low-temperature soldering and preparation method thereof | 苏州昭舜物联科技有限公司 | 2022-03-08 | — | — | CN | claimed |
| CN-114135232-A | Bearing insert sleeve of roller bit and preparation method thereof | 中石化江钻石油机械有限公司 | 2022-03-04 | — | — | CN | claimed |
| US-11251334-B2 | Method of manufacturing light emitting devices | NICHIA CORPORATION (JP) | 2022-02-15 | — | — | US | claimed |
| CN-114023489-A | Low-temperature silver paste and heterojunction battery | 苏州晶银新材料科技有限公司 | 2022-02-08 | — | — | CN | claimed |
| CN-114023709-A | Combined type substrate structure suitable for heat dissipation of high-power bare chip | 中国电子科技集团公司第二十九研究所 | 2022-02-08 | — | — | CN | claimed |
| CN-113997546-A | Long burette blow molding mould | 玉环楚港模具科技有限公司 | 2022-02-01 | — | — | CN | claimed |