SCHEMBL5666646

SCHEMBL5666646

C#Cc1ccc(C(=O)O)c2ccc(C(=O)O)cc12

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ACE2 Q9BYF1 3/20 0.54
PTPN1 P18031 1/20 0.47
KDM4E B2RXH2 4/20 0.41
MYC P01106 1/20 0.38
POLB P06746 2/20 0.36
L3MBTL1 Q9Y468 2/20 0.36
CA12 O43570 1/20 0.36
CA1 P00915 1/20 0.36
CA2 P00918 1/20 0.36
GAA P10253 1/20 0.36
MAPT P10636 1/20 0.36
CA4 P22748 1/20 0.36
CA6 P23280 1/20 0.36
PTGS2 P35354 1/20 0.36
CA7 P43166 1/20 0.36
CA9 Q16790 1/20 0.36
CA14 Q9ULX7 1/20 0.36
TSHR P16473 2/20 0.35
TP53 P04637 1/20 0.35
HSD17B10 Q99714 2/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31401768 0.82 ACE2 (0.68) ACE2PTPN1KDM4EMYCPOLB
SCHEMBL29904697 0.82 ACE2 (0.68) ACE2PTPN1KDM4EMYCPOLB
SCHEMBL29904698 0.82 ACE2 (0.68) ACE2PTPN1KDM4EMYCPOLB
SCHEMBL3687555 0.82 ACE2 (0.68) ACE2PTPN1KDM4EMYCPOLB
SCHEMBL1713016 0.80 KDM4E (0.47) ACE2PTPN1KDM4EMYCPOLB
SCHEMBL5006696 0.80 KDM4E (0.47) ACE2PTPN1KDM4EMYCPOLB
Hydrochloric Acid SCHEMBL3453575 0.79 KDM4E (0.46) ACE2PTPN1KDM4EMYCPOLB
SCHEMBL689124 0.79 NR4A1 (0.47) KDM4EL3MBTL1CA12CA1CA2
SCHEMBL5667782 0.78 ACE2 (0.49) ACE2PTPN1KDM4EHSD17B10CDC25A
SCHEMBL690497 0.76 TSHR (0.46) KDM4EPOLBL3MBTL1CA12CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1333050-B1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO (JP) 2006-12-27 EP disclosed
US-7049371-B2 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2006-05-23 US disclosed
US-20040002572-A1 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2004-01-01 US disclosed
EP-1333050-A1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2003-08-06 EP disclosed
EP-1327653-A1 HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2003-07-16 EP disclosed
US-6518390-B2 Polybenzoxazole and crosslinking agent SUMITOMO BAKELITE COMPANY, LTD. (JP) 2003-02-11 US disclosed
US-20020013443-A1 Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2002-01-31 US disclosed