SCHEMBL1713016

SCHEMBL1713016

C#Cc1cc(C(=O)O)ccc1C(=O)O

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 2/20 0.47
CDC25A P30304 1/20 0.44
CDC25B P30305 1/20 0.44
HSD17B10 Q99714 1/20 0.44
MYC P01106 1/20 0.43
TSHR P16473 3/20 0.42
TP53 P04637 1/20 0.42
CA12 O43570 3/20 0.42
CA1 P00915 3/20 0.42
CA2 P00918 3/20 0.42
CA4 P22748 3/20 0.42
CA6 P23280 3/20 0.42
CA7 P43166 3/20 0.42
CA9 Q16790 3/20 0.42
CA14 Q9ULX7 3/20 0.42
POLB P06746 2/20 0.42
L3MBTL1 Q9Y468 2/20 0.42
GAA P10253 1/20 0.42
MAPT P10636 1/20 0.42
PTGS2 P35354 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL3453575 0.98 KDM4E (0.46) KDM4ECDC25ACDC25BHSD17B10MYC
Naphthalene SCHEMBL28213981 0.91 KDM4E (0.49) KDM4ECDC25ACDC25BHSD17B10MYC
SCHEMBL4440190 0.90 KMO (0.51) KDM4ECDC25ACDC25BHSD17B10PTPN1
SCHEMBL5006696 0.84 KDM4E (0.47) KDM4ECDC25ACDC25BHSD17B10MYC
SCHEMBL690497 0.83 TSHR (0.46) KDM4ETSHRTP53CA12CA1
SCHEMBL5667262 0.82 ACMSD (0.46) KDM4ETSHRCA12CA1CA2
SCHEMBL5669197 0.82 TTR (0.46) KDM4ETSHRTP53CA12CA1
SCHEMBL5666646 0.80 ACE2 (0.54) KDM4ECDC25ACDC25BHSD17B10MYC
SCHEMBL5667512 0.80 KDM4E (0.45) KDM4EHSD17B10CA12CA1CA2
SCHEMBL689510 0.80 CYP1A2 (0.39) KDM4ECDC25ACDC25BHSD17B10TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2344568-B1 ACETYLENIC POLYAMIDE NEXAM CHEMICAL AB (SE) 2017-12-20 EP claimed
US-8492507-B2 Acetylenic polyamide NEXAM CHEMICAL AB (SE) 2013-07-23 US claimed
CN-102159622-A Acetylenic polyamide NEXAM CHEMICAL AB 2011-08-17 CN claimed
US-20110190469-A1 ACETYLENIC POLYAMIDE NEXAM CHEMICAL AB (SE) 2011-08-04 US claimed
EP-2344568-A1 ACETYLENIC POLYAMIDE Nexam Chemical AB (SE) 2011-07-20 EP claimed
WO-2010036170-A1 ACETYLENIC POLYAMIDE NEXAM CHEMICAL AB (SE) 2010-04-01 WO claimed
WO-2010030216-A1 ACETYLENIC POLY(ALKYLENE PHTHALATE) NEXAM CHEMICAL AB (SE) 2010-03-18 WO claimed
CN-115197565-B Semi-crystalline polyamide composition based on short diamines with high glass transition temperature, process for its production and use thereof 阿科玛法国公司 2024-10-11 CN disclosed
CN-115197565-A Semi-crystalline polyamide composition based on short diamines with high glass transition temperature, method for the production thereof and use thereof 阿科玛法国公司 2022-10-18 CN disclosed
CN-110446740-B Semi-crystalline polyamide compositions based on short diamines with high glass transition temperature, method for the production thereof and use thereof 阿科玛法国公司 2022-07-12 CN disclosed
US-11360387-B2 Silicon-containing underlayers ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2022-06-14 US disclosed
CN-110431169-B Semi-crystalline polyamide composition having a high glass transition temperature and a high melting temperature, method for preparing same and use thereof 阿科玛法国公司 2022-05-17 CN disclosed
CN-109956869-B Preparation method of room-temperature phosphorescent benzoate compound 北京大学 2021-05-28 CN disclosed
US-20040002572-A1 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2004-01-01 US disclosed
CN-1462289-A Heat-resistant resin precursor, heat-resistant resin, insulating film and semiconductr device SUMITOMO DAKELITE CO LTD (JP) 2003-12-17 CN disclosed
CN-1461323-A Material for insulating film, coating varnish for insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE CO (JP) 2003-12-10 CN disclosed
EP-1333050-A1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2003-08-06 EP disclosed
EP-1327653-A1 HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2003-07-16 EP disclosed
US-6518390-B2 Polybenzoxazole and crosslinking agent SUMITOMO BAKELITE COMPANY, LTD. (JP) 2003-02-11 US disclosed
US-20020013443-A1 Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2002-01-31 US disclosed