SCHEMBL5667683

SCHEMBL5667683

O=C(O)c1cc(C(=O)O)cc(-c2ccc(C#Cc3ccccc3)cc2)c1

nearest known ligand 0.61

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
DHODH Q02127 4/20 0.61
HNF4A P41235 1/20 0.50
EGFR P00533 1/20 0.49
KMO O15229 1/20 0.48
FFAR1 O14842 4/20 0.46
APP P05067 1/20 0.44
P2RY14 Q15391 1/20 0.44
RARB P10826 1/20 0.43
RARG P13631 1/20 0.43
FFAR4 Q5NUL3 1/20 0.43
HAO1 Q9UJM8 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17354676 0.87 DHODH (0.49) DHODHEGFRKMOP2RY14RARB
SCHEMBL22972758 0.87 DHODH (0.49) DHODHEGFRKMOP2RY14RARB
SCHEMBL5669815 0.87 DHODH (0.49) DHODHHNF4AEGFRKMOFFAR1
SCHEMBL5669424 0.86 DHODH (0.58) DHODHHNF4AKMOHAO1
SCHEMBL2707734 0.84 APP (0.52) DHODHHNF4AFFAR1APPRARB
SCHEMBL23671728 0.84 DHODH (0.81) DHODHEGFRKMO
SCHEMBL5668225 0.84 EGFR (0.61) DHODHHNF4AEGFRKMORARB
SCHEMBL20026783 0.82 EGFR (0.58) EGFRRARBRARG
Hydrochloric Acid SCHEMBL2709682 0.82 AKR1C2 (0.50) DHODHHNF4AFFAR1APPRARB
SCHEMBL18624975 0.82 EGFR (0.58) EGFRRARBRARG

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1333050-B1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO (JP) 2006-12-27 EP disclosed
US-7049371-B2 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2006-05-23 US disclosed
US-20040002572-A1 Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2004-01-01 US disclosed
EP-1333050-A1 MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2003-08-06 EP disclosed
EP-1327653-A1 HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2003-07-16 EP disclosed
US-6518390-B2 Polybenzoxazole and crosslinking agent SUMITOMO BAKELITE COMPANY, LTD. (JP) 2003-02-11 US disclosed
US-20020013443-A1 Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2002-01-31 US disclosed