SCHEMBL5690174

SCHEMBL5690174

Cc1ccnc(Oc2ccc3cc(O)ccc3c2)c1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
DRD1 P21728 1/20 0.43
PPARG P37231 1/20 0.43
KMT2A Q03164 5/20 0.42
ESR1 P03372 2/20 0.42
MEN1 O00255 4/20 0.40
CRHR1 P34998 3/20 0.39
KDM4E B2RXH2 2/20 0.38
ALDH1A1 P00352 2/20 0.38
HPGD P15428 2/20 0.38
HSD17B10 Q99714 1/20 0.38
FTO Q9C0B1 1/20 0.38
RAB9A P51151 1/20 0.37
NPC1 O15118 1/20 0.37
CASP3 P42574 1/20 0.37
SENP8 Q96LD8 1/20 0.37
SENP7 Q9BQF6 1/20 0.37
SENP6 Q9GZR1 1/20 0.37
RIOK2 Q9BVS4 3/20 0.36
GSK3A P49840 2/20 0.36
MAPK10 P53779 2/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5686902 0.87 DRD1 (0.50) DRD1PPARGKMT2AESR1MEN1
SCHEMBL2905418 0.85 CYP1A2 (0.39) KMT2AESR1MEN1KDM4EALDH1A1
SCHEMBL21581572 0.84 DRD1 (0.45) DRD1PPARGKMT2AMEN1CRHR1
SCHEMBL2899116 0.83 KDM4E (0.49) KMT2AESR1MEN1KDM4EALDH1A1
SCHEMBL21328434 0.83 PPARG (0.46) DRD1PPARGKMT2AKDM4EALDH1A1
SCHEMBL2906411 0.78 CYP1A2 (0.42) KMT2AESR1MEN1KDM4EALDH1A1
SCHEMBL8237139 0.78 MEN1 (0.55) DRD1KMT2AMEN1CRHR1KDM4E
SCHEMBL5686998 0.78 SCN7A (0.47) PPARGKMT2AESR1MEN1KDM4E
SCHEMBL21581580 0.77 HAO1 (0.50) DRD1PPARGKMT2AMEN1CRHR1
SCHEMBL5687538 0.76 KDM4E (0.50) KMT2AMEN1KDM4EALDH1A1FTO

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1636209-A1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT Sumitomo Chemical Company, Limited (JP) 2006-03-22 EP disclosed
WO-2004113327-A1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2004-12-29 WO disclosed