SCHEMBL5694880

SCHEMBL5694880

O=S(=O)(O)CCCN1C(=CC2Sc3ccc(Cl)cc3N2CCCS(=O)(=O)O)Sc2ccc(Cl)cc21

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ MAPT P10636 6/20 0.45
▸ MAPK1 P28482 5/20 0.45
▸ RAD52 P43351 4/20 0.45
▸ TDP1 Q9NUW8 4/20 0.45
▸ TP53 P04637 4/20 0.45
▸ CYP3A4 P08684 4/20 0.45
▸ KDM4E B2RXH2 3/20 0.45
▸ USP2 O75604 2/20 0.45
▸ ALOX15 P16050 1/20 0.45
▸ L3MBTL1 Q9Y468 1/20 0.45
▸ CYP2D6 P10635 7/20 0.41
▸ KIF11 P52732 2/20 0.41
▸ DRD2 P14416 5/20 0.36
▸ ADRA2A P08913 4/20 0.36
▸ ADRA2B P18089 4/20 0.36
▸ ADRA2C P18825 4/20 0.36
▸ SLC6A2 P23975 4/20 0.36
▸ HTR2A P28223 4/20 0.36
▸ HTR2C P28335 4/20 0.36
▸ SLC6A4 P31645 4/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10036142 1.00 MAPT (0.45) MAPTMAPK1RAD52TDP1TP53
SCHEMBL10337000 0.91 TDP1 (0.42) MAPTMAPK1RAD52TDP1TP53
SCHEMBL10336998 0.91 TDP1 (0.42) MAPTMAPK1RAD52TDP1TP53
SCHEMBL10336999 0.91 TDP1 (0.42) MAPTMAPK1RAD52TDP1TP53
SCHEMBL19767589 0.84 MAPT (0.41) MAPTMAPK1RAD52TDP1TP53
SCHEMBL10036144 0.82 MAPT (0.41) MAPTMAPK1RAD52TDP1TP53
SCHEMBL13763557 0.79 MAPT (0.39) MAPTMAPK1RAD52TDP1TP53
SCHEMBL9069429 0.76 RAD52 (0.43) MAPTMAPK1RAD52TDP1TP53
SCHEMBL9104807 0.74 MAPT (0.73) MAPTMAPK1RAD52TDP1TP53
SCHEMBL13763560 0.73 MAPT (0.35) MAPTMAPK1RAD52TDP1TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1424593-B1 Thermally developable materials containing backside conductive layer EASTMAN KODAK CO (US) 2006-04-26 — — EP disclosed
US-20050106514-A1 Stabilized high-speed thermally developable emulsions and photothermographic materials EASTMAN KODAK COMPANY 2005-05-19 — — US disclosed
US-20040259044-A1 Photothermographic materials with improved image tone EASTMAN KODAK COMPANY 2004-12-23 — — US disclosed
EP-1455225-A1 Thermally developable emulsions and materials containing heterocyclic disulfide compounds EASTMAN KODAK COMPANY (US) 2004-09-08 — — EP disclosed
EP-1439413-A1 Thermally developable materials having barrier layer comprising inorganic filler particles EASTMAN KODAK COMPANY (US) 2004-07-21 — — EP disclosed
EP-1439414-A1 Thermally developable emulsions and materials containing triazinethione compounds EASTMAN KODAK COMPANY (US) 2004-07-21 — — EP disclosed
US-6746831-B1 BARRIER LAYER CAPABLE OF RETARDING DIFFUSION OF OR REACTING WITH LONG CHAIN ALIPHATIC CARBOXYLIC ACIDS FORMED FROM THEIR SILVER SALTS WHICH ARE NON-PHOTOSENSITIVE SOURCE OF REDUCIBLE SILVER IONS EASTMAN KODAK COMPANY 2004-06-08 — — US disclosed
EP-1424593-A2 Thermally developable materials containing backside conductive layer EASTMAN KODAK COMPANY (US) 2004-06-02 — — EP disclosed
US-6737227-B1 AND ASCORBIC ACID OR REDUCTONE REDUCING AGENTS; THERMOGRAPHIC AND PHOTOTHERMOGRAPHIC; INCREASED IMAGE DENSITY AND SHORTENED DEVELOPMENT TIME, DEVELOPMENT AT LOWER TEMPERATURES EASTMAN KODAK COMPANY 2004-05-18 — — US disclosed
US-6703191-B1 COMPRISING A BINDER AND IN REACTIVE ASSOCIATION, A PHOTOSENSITIVE SILVER HALIDE, A NON-PHOTOSENSITIVE SOURCE OF REDUCIBLE SILVER IONS, A REDUCING COMPOSITION FOR SAID NON-PHOTOSENSITIVE SOURCE REDUCIBLE SILVER IONS EASTMAN KODAK COMPANY 2004-03-09 — — US disclosed
US-6689546-B1 HAVING METAL ANTIMONATE CONDUCTIVE PARTICLES BURIED BENEATH PROTECTIVE OVERCOAT; STATIC FREE DEVELOPED FILMS EVEN AFTER PROLONGED STORAGE EASTMAN KODAK COMPANY 2004-02-10 — — US disclosed
US-6667148-B1 Imaging layer containing a non-photosensitive source of reducible silver ions. EASTMAN KODAK COMPANY 2003-12-23 — — US disclosed
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