SCHEMBL5696355

SCHEMBL5696355

N#CC(C#N)(C#N)Cc1c[c]ccc1

nearest known ligand 0.34

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
ATM Q13315 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1071998 0.75 ESR1 (0.40)
SCHEMBL533194 0.75
SCHEMBL533106 0.75
SCHEMBL1560823 0.72
SCHEMBL1067474 0.72 SLC6A2 (0.33)
SCHEMBL17134066 0.72
SCHEMBL17133994 0.72 SLC6A2 (0.33)
SCHEMBL1072823 0.72 ALDH1A1 (0.32)
SCHEMBL611674 0.72
SCHEMBL9875599 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1196463-B1 EPOXY RESIN PREPARED FROM P-HYDROXYSTYRENE HAVING HIGH FUNCTIONALITY, LOW MELT VISCOSITY WITH HIGH GLASS TRANSITION TEMPERATURE KEEHAN DONALD J (US) 2006-05-17 EP disclosed
EP-1196463-A4 EPOXY RESIN PREPARED FROM P-HYDROXYSTYRENE HAVING HIGH FUNCTIONALITY, LOW MELT VISCOSITY WITH HIGH GLASS TRANSITION TEMPERATURE KEEHAN DONALD J (US) 2002-07-17 EP disclosed
US-6391979-B1 REACTING P-HYDROXYSTYRENE AND EPICHLORHYDRIN KEEHAN DONALD J (US) 2002-05-21 US disclosed
EP-1196463-A1 EPOXY RESIN PREPARED FROM P-HYDROXYSTYRENE HAVING HIGH FUNCTIONALITY, LOW MELT VISCOSITY WITH HIGH GLASS TRANSITION TEMPERATURE KEEHAN, Donald J (US) 2002-04-17 EP disclosed
US-6180723-B1 PRODUCING AN EPOXY AGENT BY REACTING CERTAIN P-HYDROXYSTYRENE NOVOLAK POLYMERS AND EPICHLOROHYDRIN IN THE PRESENCE OF ONE OR MORE ALKALI AGENTS; LOW MELT VISCOSITY PRIOR TO CURE AND HIGH GLASS TRANSITION TEMPERATURE AFTER CURING KEEHAN DONALD J (US) 2001-01-30 US disclosed
WO-2000064955-A1 EPOXY RESIN PREPARED FROM P-HYDROXYSTYRENE HAVING HIGH FUNCTIONALITY, LOW MELT VISCOSITY WITH HIGH GLASS TRANSITION TEMPERATURE KEEHAN DONALD J (US) 2000-11-02 WO disclosed