SCHEMBL570762

SCHEMBL570762

CCC(Cl)(CCl)P(=O)(O)O

nearest known ligand 0.39

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
FDPS P14324 14/20 0.39
SMPD1 P17405 2/20 0.39
GGPS1 O95749 6/20 0.37
LPAR1 Q92633 3/20 0.34
LPAR3 Q9UBY5 3/20 0.34
LPAR2 Q9HBW0 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL434074 0.87 FDPS (0.44) FDPSSMPD1GGPS1LPAR1LPAR3
SCHEMBL10619237 0.75 FDPS (0.34) FDPSSMPD1GGPS1LPAR1LPAR3
SCHEMBL16816993 0.72 FDPS (0.58) FDPSSMPD1GGPS1LPAR1LPAR3
Phosphoric Acid SCHEMBL29565136 0.69 FDPS (0.42) FDPSSMPD1GGPS1LPAR1LPAR3
SCHEMBL27602395 0.69
SCHEMBL4410109 0.69
SCHEMBL4060154 0.69 FDPS (0.42) FDPSSMPD1GGPS1LPAR1LPAR3
SCHEMBL9435584 0.67 FDPS (0.35) FDPSSMPD1
SCHEMBL22499638 0.67
Phosphoric Acid SCHEMBL28638023 0.66 KDM4E (0.38) FDPS

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250133947-A1 Thermal Evaporation-Growth of Halide Perovskites Through Phosphonic Acid Addition GEORGIA TECH RES INST (US) 2025-04-24 US disclosed
EP-2601245-A1 CYCLOSILOXANE-SUBSTITUTED POLYSILOXANE COMPOUNDS, COMPOSITIONS CONTAINING THE COMPOUNDS AND METHODS OF USE THEREOF Biofilm IP, LLC (US) 2013-06-12 EP disclosed
WO-2012018403-A1 CYCLOSILOXANE-SUBSTITUTED POLYSILOXANE COMPOUNDS, COMPOSITIONS CONTAINING THE COMPOUNDS AND METHODS OF USE THEREOF BIOFILM IP, LLC (US) 2012-02-09 WO disclosed
US-7635748-B2 Resin and article molded therefrom TORAY INDUSTRIES, INC. (JP) 2009-12-22 US disclosed
EP-1270646-B1 RESIN COMPOSITION AND ARTICLES MOLDED THEREFROM TORAY INDUSTRIES (JP) 2008-11-26 EP disclosed
US-7442757-B2 Resin, resin composition, method for manufacturing the same, and molded material including the same TORAY INDUSTRIES, INC. (JP) 2008-10-28 US disclosed
US-20080139778-A1 Resin and article molded therefrom TAKANISHI KEIJIRO 2008-06-12 US disclosed
US-20060287464-A1 Resin and article molded therefrom TORAY INDUSTRIES, INC. (JP) 2006-12-21 US disclosed
EP-1640405-A1 RESIN AND ARTICLE MOLDED THEREFROM TORAY INDUSTRIES, INC. (JP) 2006-03-29 EP disclosed
US-20060047104-A1 Resin, resin composition, process for production thereof, and moldings made by using the same TORAY INDUSTRIES, INC. (JP) 2006-03-02 US disclosed
EP-1518884-A1 RESIN, RESIN COMPOSITIONS, PROCESS FOR PRODUCTION THEREOF, AND MOLDINGS MADE BY USING THE SAME TORAY INDUSTRIES, INC. (JP) 2005-03-30 EP disclosed
US-6750313-B2 HIGH REFRACTIVE INDEX AND LOW DISPERSION CHARACTERISTICS; OPTICAL LENSES, FILMS, DISCS; POLYCARBONATE RESIN CONTAINING A PHOSPHONIC ACID GROUP TORAY INDUSTRIES, INC. (JP) 2004-06-15 US disclosed
US-20030013836-A1 Resin composition and articles molded therefrom TORAY INDUSTRIES, INC., A CORPORATION OF JAPAN (JP) 2003-01-16 US disclosed
EP-1270646-A1 RESIN COMPOSITION AND ARTICLES MOLDED THEREFROM TORAY INDUSTRIES, INC. (JP) 2003-01-02 EP disclosed