Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP2 | O95551 | 1/20 | 0.35 |
| ▸ | NSD2 | O96028 | 1/20 | 0.35 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.35 |
| ▸ | PAX8 | Q06710 | 1/20 | 0.35 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.32 |
| ▸ | MEN1 | O00255 | 1/20 | 0.32 |
| ▸ | USP2 | O75604 | 1/20 | 0.32 |
| ▸ | MAPT | P10636 | 1/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.32 |
| ▸ | THRB | P10828 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12440737 | 0.96 | TDP2 (0.33) | TDP2NSD2HSP90AA1PAX8KDM4E | |
| SCHEMBL17490275 | 0.87 | — | — | |
| SCHEMBL15910085 | 0.85 | TDP2 (0.32) | TDP2NSD2HSP90AA1PAX8 | |
| SCHEMBL14016730 | 0.82 | TDP2 (0.31) | TDP2NSD2HSP90AA1PAX8 | |
| SCHEMBL14791103 | 0.79 | — | — | |
| SCHEMBL11401650 | 0.74 | TDP2 (0.37) | TDP2NSD2HSP90AA1PAX8KDM4E | |
| SCHEMBL14791105 | 0.73 | DUSP3 (0.44) | KDM4EMEN1MAPTKMT2A | |
| SCHEMBL1134720 | 0.71 | — | — | |
| SCHEMBL9770862 | 0.71 | — | — | |
| SCHEMBL14016710 | 0.68 | KDM4E (0.44) | KDM4EMEN1USP2MAPTKMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 2007 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250237947-A1 | Dry Film Resist, Photosensitive Dry Film, and Copper Clad Laminate | HANGZHOU FIRST ELECTRONIC MATERIAL CO., LTD (CN) | 2025-07-24 | — | — | US | claimed |
| CN-119165729-A | Photosensitive resist ink and preparation method of metal grid line | 杭州福斯特电子材料有限公司 | 2024-12-20 | — | — | CN | claimed |
| CN-118871861-A | Dry film resist, photosensitive dry film and copper-clad plate | 杭州福斯特电子材料有限公司 | 2024-10-29 | — | — | CN | claimed |
| CN-112947001-B | Photosensitive resin composition, dry film resist and manufacturing method of PCB | 杭州福斯特电子材料有限公司 | 2024-05-28 | — | — | CN | claimed |
| CN-113341647-B | Dry film resist composition and dry film resist laminate | 杭州福斯特电子材料有限公司 | 2024-05-28 | — | — | CN | claimed |
| CN-117687268-B | Photosensitive resin composition, photosensitive dry film and copper-clad plate | 湖南初源新材料股份有限公司 | 2024-04-19 | — | — | CN | claimed |
| CN-117687268-A | Photosensitive resin composition, photosensitive dry film and copper-clad plate | 湖南初源新材料股份有限公司 | 2024-03-12 | — | — | CN | claimed |
| WO-2023185530-A1 | DRY FILM RESIST, PHOTOSENSITIVE DRY FILM, AND COPPER CLAD LAMINATE | 杭州福斯特电子材料有限公司 | 2023-10-05 | — | — | WO | claimed |
| CN-116184763-A | Photocurable resin composition and application thereof | 杭州福斯特电子材料有限公司 | 2023-05-30 | — | — | CN | claimed |
| CN-110471256-B | Photosensitive resin composition | 杭州福斯特电子材料有限公司 | 2023-05-12 | — | — | CN | claimed |
| CN-113341647-A | Dry film resist composition and dry film resist laminate | 浙江福斯特新材料研究院有限公司 | 2021-09-03 | — | — | CN | claimed |
| CN-109031889-B | Low-foam high-adhesion photosensitive dry film resist | 杭州福斯特电子材料有限公司 | 2021-08-24 | — | — | CN | claimed |
| CN-108241259-B | Resist composition with good hole masking function and capable of directly depicting, exposing and imaging | 杭州福斯特电子材料有限公司 | 2021-08-10 | — | — | CN | claimed |
| CN-112947001-A | Photosensitive resin composition, dry film resist and manufacturing method of PCB | 浙江福斯特新材料研究院有限公司 | 2021-06-11 | — | — | CN | claimed |
| CN-107077068-B | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board | 昭和电工材料株式会社 | 2021-03-12 | — | — | CN | claimed |
| CN-107203095-B | White alkali-soluble photosensitive composition and preparation method and application thereof | 江苏广信感光新材料股份有限公司 | 2020-08-18 | — | — | CN | claimed |
| CN-107329368-B | Alkali-soluble photosensitive composition, and preparation method and application thereof | 江苏广信感光新材料股份有限公司 | 2020-08-14 | — | — | CN | claimed |
| CN-107219726-B | Resin composition and application | 浙江福斯特新材料研究院有限公司 | 2020-07-28 | — | — | CN | claimed |
| US-4562142-A | PRINTED CIRCUITS | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1985-12-31 | — | — | US | claimed |
| US-4438190-A | PROTECTIVE COATINGS FOR PRINTED CIRCUITS | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1984-03-20 | — | — | US | claimed |