SCHEMBL5711908

SCHEMBL5711908

CC[SiH](C)N(C)[Si](C)(C)CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9359023 0.78
SCHEMBL1526298 0.78
SCHEMBL8777831 0.74
SCHEMBL972471 0.66
SCHEMBL2268850 0.64
SCHEMBL22200158 0.64
SCHEMBL22733947 0.63
SCHEMBL918584 0.62
SCHEMBL31347640 0.61
SCHEMBL131706 0.61

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 66 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240218217-A1 THERMOSETTING RESIN COMPOSITION AND INSULATING ADHESIVE FILM THEREOF SHENGYI TECHNOLOGY CO., LTD. (CN) 2024-07-04 US claimed
CN-115895546-A Thermosetting resin composition and insulating adhesive film thereof 广东生益科技股份有限公司 2023-04-04 CN claimed
EP-1071431-A4 NOVEL DELIVERY OF HYDROXY CARBOXYLIC ACIDS CLARIANT LSM ITALIA SPA (US) 2002-03-13 EP claimed
US-6267977-B1 REACTING FREE HYDROXYCARBOXYLIC ACIDS OR THEIR HYDRATES WITH HEXAORGANODISILAZANES TO FORM PURE BIS(TRIORGANOSILYL)HYDROXYCARBOXYLATES ARCHIMICA ( FLORIDA), INC. 2001-07-31 US claimed
EP-1071431-A1 NOVEL DELIVERY OF HYDROXY CARBOXYLIC ACIDS PCR, INC. (US) 2001-01-31 EP claimed
WO-1999045933-A9 NOVEL DELIVERY OF HYDROXY CARBOXYLIC ACIDS PCR (US) 1999-11-18 WO claimed
WO-1999045933-A1 NOVEL DELIVERY OF HYDROXY CARBOXYLIC ACIDS PCR, INC. (US) 1999-09-16 WO claimed
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
US-20250188609-A1 SEAM-FREE AND CRACK-FREE DEPOSITION LAM RES CORP (US) 2025-06-12 US disclosed
WO-2025121026-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, RESIN FILM, AND SEMICONDUCTOR DEVICE 旭化成株式会社 2025-06-12 WO disclosed
WO-2025100081-A1 COMPOSITION, EPOXY RESIN COMPOSITION, FILM, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE 旭化成株式会社 2025-05-15 WO disclosed
US-12286541-B2 Surface-treated sol-gel silica and method for producing same TOKUYAMA CORPORATION (JP) 2025-04-29 US disclosed
US-20250054747-A1 CONFORMAL DEPOSITION OF SILICON NITRIDE LAM RES CORP (US) 2025-02-13 US disclosed
EP-1071431-A4 NOVEL DELIVERY OF HYDROXY CARBOXYLIC ACIDS CLARIANT LSM ITALIA SPA (US) 2002-03-13 EP disclosed
US-6267977-B1 REACTING FREE HYDROXYCARBOXYLIC ACIDS OR THEIR HYDRATES WITH HEXAORGANODISILAZANES TO FORM PURE BIS(TRIORGANOSILYL)HYDROXYCARBOXYLATES ARCHIMICA ( FLORIDA), INC. 2001-07-31 US disclosed
US-6228380-B1 APPLYING HYDROXYCARBOXYLIC ACID TO SKIN WITHOUT CORROSION OR BURNING ARCHIMICA (FLORIDA) INC. 2001-05-08 US disclosed
EP-1071431-A1 NOVEL DELIVERY OF HYDROXY CARBOXYLIC ACIDS PCR, INC. (US) 2001-01-31 EP disclosed
US-6143309-A MIXTURE WITH APROTIC SOLVENT; COSMETIC ARCHIMICA (FLORIDA), INC. (US) 2000-11-07 US disclosed
WO-1999045933-A9 NOVEL DELIVERY OF HYDROXY CARBOXYLIC ACIDS PCR (US) 1999-11-18 WO disclosed
WO-1999045933-A1 NOVEL DELIVERY OF HYDROXY CARBOXYLIC ACIDS PCR, INC. (US) 1999-09-16 WO disclosed