⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1345170 | 0.83 | — | — | |
| SCHEMBL22200158 | 0.80 | — | — | |
| SCHEMBL6046989 | 0.77 | — | — | |
| SCHEMBL2273674 | 0.74 | — | — | |
| SCHEMBL1428307 | 0.74 | — | — | |
| SCHEMBL1048126 | 0.72 | — | — | |
| SCHEMBL2102907 | 0.72 | — | — | |
| SCHEMBL1526298 | 0.70 | — | — | |
| SCHEMBL422241 | 0.70 | DNM1 (0.33) | — | |
| SCHEMBL23243610 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111886676-B | Method for treating surface of wafer and composition therefor | 中央硝子株式会社 | 2024-09-27 | — | — | CN | claimed |
| US-11603485-B2 | Surface treatment method of wafer and composition used for said method | CENTRAL GLASS COMPANY, LIMITED (JP) | 2023-03-14 | — | — | US | claimed |
| CN-118974894-A | Surface treatment composition and method for producing wafer | 中央硝子株式会社 | 2024-11-15 | — | — | CN | disclosed |
| CN-111886676-B | Method for treating surface of wafer and composition therefor | 中央硝子株式会社 | 2024-09-27 | — | — | CN | disclosed |
| CN-117766374-A | Substrate processing method, semiconductor device manufacturing method, substrate processing system, and recording medium | 株式会社国际电气 | 2024-03-26 | — | — | CN | disclosed |
| CN-117766384-A | Substrate processing method, semiconductor device manufacturing method, substrate processing system, and recording medium | 株式会社国际电气 | 2024-03-26 | — | — | CN | disclosed |
| CN-117702084-A | Substrate processing method, semiconductor device manufacturing method, substrate processing apparatus, and recording medium | 株式会社国际电气 | 2024-03-15 | — | — | CN | disclosed |
| CN-117253819-A | Substrate processing method, semiconductor device manufacturing method, substrate processing apparatus, and recording medium | 株式会社国际电气 | 2023-12-19 | — | — | CN | disclosed |
| US-11732115-B2 | Tire for vehicle wheels | PIRELLI TYRE S.P.A. (IT) | 2023-08-22 | — | — | US | disclosed |
| US-11603485-B2 | Surface treatment method of wafer and composition used for said method | CENTRAL GLASS COMPANY, LIMITED (JP) | 2023-03-14 | — | — | US | disclosed |
| US-10882983-B2 | Rubber composition | TRINSEO EUROPE GMBH (CH) | 2021-01-05 | — | — | US | disclosed |
| WO-2013149349-A1 | IONIC COMPOUNDS HAVING A SILYLOXY GROUP | HYDRO-QUéBEC (CA) | 2013-10-10 | — | — | WO | disclosed |
| CN-102803259-A | 1H-Imidazo[4, 5-c]quinolinone compounds, useful for the treatment of proliferative diseases | NOVARTIS AG | 2012-11-28 | — | — | CN | disclosed |
| CN-102137722-A | Hydrophobic and oleophobic coating and method for preparing the same | SONIC INNOVATIONS INC | 2011-07-27 | — | — | CN | disclosed |
| CN-102099425-A | Process for preparing redispersible surface-modified silicon dioxide particles | EVONIK DEGUSSA GMBH | 2011-06-15 | — | — | CN | disclosed |
| CN-102099424-A | Dispersion of hydrophobicized silicon dioxide particles and granules thereof | EVONIK DEGUSSA GMBH | 2011-06-15 | — | — | CN | disclosed |
| US-7871883-B2 | Method of manufacturing semiconductor device includes the step of depositing the capacitor insulating film in a form of a hafnium silicate | SONY CORPORATION (JP) | 2011-01-18 | — | — | US | disclosed |
| CN-1329470-C | Binding composition, electric circuit connecting material, electric component connecting structure and production thereof | HITACHI CHEMICAL CO LTD (JP) | 2007-08-01 | — | — | CN | disclosed |
| US-20070066010-A1 | Method of manufacturing semiconductor device | SONY CORPORATION (JP) | 2007-03-22 | — | — | US | disclosed |
| CN-1680507-A | Binding composition, electric circuit connecting material, electric component connecting structure and production thereof | HITACHI CHEMICAL CO LTD (JP) | 2005-10-12 | — | — | CN | disclosed |