⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5711905 | 0.93 | — | — | |
| SCHEMBL5701564 | 0.93 | — | — | |
| SCHEMBL217199 | 0.81 | — | — | |
| SCHEMBL18181680 | 0.78 | — | — | |
| SCHEMBL27148780 | 0.77 | — | — | |
| SCHEMBL13588473 | 0.76 | — | — | |
| SCHEMBL2600716 | 0.76 | — | — | |
| SCHEMBL6753254 | 0.74 | — | — | |
| SCHEMBL14446054 | 0.73 | — | — | |
| SCHEMBL12209675 | 0.72 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230212396-A1 | THERMALLY CONDUCTIVE ADDITION-CURABLE SILICONE COMPOSITION AND METHOD FOR PRODUCING THE SAME | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-07-06 | — | — | US | disclosed |
| JP-2022099205-A | 1,1,1-TRIMETHOXY-3,3-DIMETHYL DISILOXANE AND METHOD FOR PRODUCING THE SAME | ケイ素材料開発株式会社 | 2022-07-04 | — | — | JP | disclosed |
| JP-2022099205-A | 1,1,1-TRIMETHOXY-3,3-DIMETHYL DISILOXANE AND METHOD FOR PRODUCING THE SAME | ケイ素材料開発株式会社 | 2022-07-04 | — | — | JP | disclosed |
| US-10030184-B2 | Addition one part curing type heat-conductive silicone grease composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-07-24 | — | — | US | disclosed |
| WO-2017065015-A1 | GRANULAR AGROCHEMICAL COMPOSITION | クミアイ化学工業株式会社 | 2017-04-20 | — | — | WO | disclosed |
| US-7081503-B2 | Process producing vinyl polymer having alkenyl group at end, vinyl polymer, and curable composition | KANEKA CORPORATION (JP) | 2006-07-25 | — | — | US | disclosed |
| US-7009004-B2 | Process for producing vinyl polymer having alkenyl group at end vinyl polymer and curable composition | KANEKA CORPORATION (JP) | 2006-03-07 | — | — | US | disclosed |
| EP-1101767-B1 | Oligosiloxane and method of preparing same | DOW CORNING TORAY SILICONE (JP) | 2006-01-25 | — | — | EP | disclosed |
| US-20060004171-A1 | Process for producing vinyl polymer having alkenyl group at end, vinyl polymer, and curable composition | TSUJI RYOTARO | 2006-01-05 | — | — | US | disclosed |
| US-20040097678-A1 | Process for producing vinyl polymer having alkenyl group at end vinyl polymer and curable composition | KANEKA CORPORATION (JP) | 2004-05-20 | — | — | US | disclosed |
| US-6380301-B1 | CONTAINING SURFACE TREATED FILLER | DOW CORNING TORAY SILICONE CO., LTD. (JP) | 2002-04-30 | — | — | US | disclosed |
| US-6376635-B1 | USING HYDROSILATION CATALYST | DOW CORNING TORAY SILICON CO., LTD. (JP) | 2002-04-23 | — | — | US | disclosed |
| EP-0567253-B1 | Silicone rubber compositions | GEN ELECTRIC (US) | 2001-12-19 | — | — | EP | disclosed |
| EP-1101767-A2 | Oligosiloxane and method of preparing same | Dow Corning Toray Silicone Co., Ltd. (JP) | 2001-05-23 | — | — | EP | disclosed |
| EP-1101798-A2 | Thermally conductive silicone rubber composition | Dow Corning Toray Silicone Co., Ltd. (JP) | 2001-05-23 | — | — | EP | disclosed |
| US-5397817-A | Molding compounds having low durometer and high tear strength | GENERAL ELECTRIC COMPANY (US) | 1995-03-14 | — | — | US | disclosed |
| EP-0586153-A2 | Silicone Compositions | GENERAL ELECTRIC COMPANY (US) | 1994-03-09 | — | — | EP | disclosed |
| CN-1083499-A | The molding composite that soft and high-tear strength are arranged | GEN ELECTRIC (US) | 1994-03-09 | — | — | CN | disclosed |
| EP-0570207-A1 | Flame retardant system for polyorganosiloxane compositions | GENERAL ELECTRIC COMPANY (US) | 1993-11-18 | — | — | EP | disclosed |
| EP-0567253-A1 | Silicone rubber compositions | GENERAL ELECTRIC COMPANY (US) | 1993-10-27 | — | — | EP | disclosed |