⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8351332 | 0.95 | — | — | |
| SCHEMBL12209675 | 0.95 | — | — | |
| SCHEMBL22555957 | 0.88 | — | — | |
| SCHEMBL187714 | 0.82 | — | — | |
| SCHEMBL5832816 | 0.81 | — | — | |
| SCHEMBL11950506 | 0.79 | — | — | |
| SCHEMBL3868343 | 0.79 | — | — | |
| SCHEMBL9178213 | 0.79 | — | — | |
| SCHEMBL9004508 | 0.79 | — | — | |
| SCHEMBL9004493 | 0.79 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9238734-B2 | Room temperature and humidity thickening thermo-conductive silicon grease composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-01-19 | — | — | US | disclosed |
| US-9163144-B2 | Silicone resin composition, silicone laminated substrate using the same, method for producing the same, and LED device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2015-10-20 | — | — | US | disclosed |
| US-9074101-B2 | Siloxane-grafted silica, transparent silicone composition, and optoelectronic device encapsulated therewith | NIIGATA UNIVERSITY (JP) | 2015-07-07 | — | — | US | disclosed |
| US-20140120793-A1 | SILICONE RESIN COMPOSITION, SILICONE LAMINATED SUBSTRATE USING THE SAME, METHOD FOR PRODUCING THE SAME, AND LED DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-05-01 | — | — | US | disclosed |
| US-20120261068-A1 | CURABLE SILICONE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND OPAQUE SILICONE ADHESIVE SHEET FORMED FROM THE COMPOSITION | KASHIWAGI TSUTOMU (JP) | 2012-10-18 | — | — | US | disclosed |
| US-8164202-B2 | Optical semiconductor device encapsulated with silicone resin | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-04-24 | — | — | US | disclosed |
| US-20100213502-A1 | OPTICAL SEMICONDUCTOR DEVICE ENCAPSULATED WITH SILICONE RESIN | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-08-26 | — | — | US | disclosed |
| US-20090121180-A1 | SILOXANE-GRAFTED SILICA, TRANSPARENT SILICONE COMPOSITION, AND OPTOELECTRONIC DEVICE ENCAPSULATED THEREWITH | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-05-14 | — | — | US | disclosed |
| US-7276562-B2 | Epoxy-silicone mixed resin composition and light-emitting semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2007-10-02 | — | — | US | disclosed |
| US-20070142573-A1 | Epoxy/silicone hybrid resin composition and cured part | SHIN-ETSU CHEMICAL CO., LTD. | 2007-06-21 | — | — | US | disclosed |
| US-5403881-A | Room-temperature-curable composition | DOW CORNING TORAY SILICONE CO., LTD. (JP) | 1995-04-04 | — | — | US | disclosed |