SCHEMBL574332

SCHEMBL574332

CC[SiH](CC)NC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2267659 0.79
SCHEMBL2269624 0.75
SCHEMBL2271166 0.69
SCHEMBL2100114 0.67
SCHEMBL2271598 0.65 TSHR (0.35)
SCHEMBL2269240 0.64
SCHEMBL10429776 0.64
SCHEMBL2273462 0.64
SCHEMBL2104126 0.62
SCHEMBL20522630 0.62

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 170 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12604684-B2 Method and system for mitigating underlayer damage during formation of patterned structures ASM IP HOLDING B.V. (NL) 2026-04-14 US claimed
US-12554191-B2 Pellicle membrane and method of forming the same TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2026-02-17 US claimed
US-12431354-B2 Silicon nitride and silicon oxide deposition methods using fluorine inhibitor ASM IP HOLDING B.V. (NL) 2025-09-30 US claimed
US-20250297360-A1 SUBSTRATE PROCESSING METHOD ASM IP HOLDING B.V. (NL) 2025-09-25 US claimed
US-12392038-B2 Thin-film deposition method and system ASM IP HOLDING B.V. (NL) 2025-08-19 US claimed
US-20250253145-A1 SUBSTRATE PROCESSING METHOD ASM IP HOLDING B.V. (NL) 2025-08-07 US claimed
US-12276021-B2 Methods of forming phosphosilicate glass layers, structures formed using the methods and systems for performing the methods ASM IP HOLDING B.V. (NL) 2025-04-15 US claimed
US-20230408904-A1 PELLICLE MEMBRANE AND METHOD OF FORMING THE SAME TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2023-12-21 US claimed
US-20230407477-A1 SUBSTRATE PROCESSING APPARATUS INCLUDING IMPROVED EXHAUST STRUCTURE ASM IP HOLDING B.V. (NL) 2023-12-21 US claimed
CN-117248192-A Substrate processing apparatus including improved exhaust structure ASM IP私人控股有限公司 2023-12-19 CN claimed
US-9496328-B2 Methods of manufacturing capacitors for semiconductor devices SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-11-15 US claimed
US-20160043163-A1 METHODS OF MANUFACTURING CAPACITORS FOR SEMICONDUCTOR DEVICES SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-02-11 US claimed
US-8383522-B2 Micro pattern forming method TOKYO ELECTRON LIMITED (JP) 2013-02-26 US claimed
US-8197915-B2 Method of depositing silicon oxide film by plasma enhanced atomic layer deposition at low temperature ASM JAPAN K.K. (JP) 2012-06-12 US claimed
US-8168375-B2 Patterning method TOKYO ELECTRON LIMITED (JP) 2012-05-01 US claimed
US-20110237082-A1 MICRO PATTERN FORMING METHOD TOKYO ELECTRON LIMITED (JP) 2011-09-29 US claimed
US-7989354-B2 Patterning method TOKYO ELECTRON LIMITED (JP) 2011-08-02 US claimed
US-20100255218-A1 Method of Depositing Silicon Oxide Film by Plasma Enhanced Atomic Layer Deposition at Low Temperature ASM JAPAN K.K. (JP) 2010-10-07 US claimed
US-20100130015-A1 PATTERNING METHOD TOKYO ELECTRON LIMITED (JP) 2010-05-27 US claimed
US-20100112496-A1 PATTERNING METHOD TOKYO ELECTRON LIMITED (JP) 2010-05-06 US claimed