Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAOB | P27338 | 1/20 | 0.68 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.59 |
| ▸ | MAPT | P10636 | 2/20 | 0.59 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.59 |
| ▸ | MEN1 | O00255 | 2/20 | 0.59 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.59 |
| ▸ | MITF | O75030 | 1/20 | 0.59 |
| ▸ | GAA | P10253 | 1/20 | 0.59 |
| ▸ | GFER | P55789 | 1/20 | 0.59 |
| ▸ | NLRP1 | Q9C000 | 1/20 | 0.59 |
| ▸ | NOD2 | Q9HC29 | 1/20 | 0.59 |
| ▸ | MAOA | P21397 | 2/20 | 0.52 |
| ▸ | ATM | Q13315 | 1/20 | 0.50 |
| ▸ | POLB | P06746 | 1/20 | 0.50 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.50 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.48 |
| ▸ | LTA4H | P09960 | 1/20 | 0.48 |
| ▸ | NPC1 | O15118 | 1/20 | 0.47 |
| ▸ | RAB9A | P51151 | 1/20 | 0.47 |
| ▸ | NLRP3 | Q96P20 | 1/20 | 0.47 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30392583 | 1.00 | MAOB (0.68) | MAOBALDH1A1MAPTSMN1; SMN2MEN1 | |
| SCHEMBL30421408 | 0.96 | MAOB (0.68) | MAOBALDH1A1MAPTSMN1; SMN2MEN1 | |
| SCHEMBL3610637 | 0.96 | MAOB (0.68) | MAOBALDH1A1MAPTSMN1; SMN2MEN1 | |
| SCHEMBL30393189 | 0.94 | MAOB (0.76) | MAOBALDH1A1MAPTSMN1; SMN2MEN1 | |
| SCHEMBL29352381 | 0.94 | MAOB (0.76) | MAOBALDH1A1MAPTSMN1; SMN2MEN1 | |
| SCHEMBL28969425 | 0.94 | MAOB (0.76) | MAOBALDH1A1MAPTSMN1; SMN2MEN1 | |
| SCHEMBL4060068 | 0.94 | MAOB (0.76) | MAOBALDH1A1MAPTSMN1; SMN2MEN1 | |
| SCHEMBL203512 | 0.94 | MAOB (0.76) | MAOBALDH1A1MAPTSMN1; SMN2MEN1 | |
| SCHEMBL29454304 | 0.92 | MAOB (0.81) | MAOBALDH1A1MAPTSMN1; SMN2MEN1 | |
| SCHEMBL4261949 | 0.92 | MAOB (0.81) | MAOBALDH1A1MAPTSMN1; SMN2MEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6441099-B1 | LOW MOLECULAR WEIGHT PHENYLETHYNYL-CONTAINING POLYIMIDES OR POLYAMIC ACIDS; CURED FILM; USE WITH ANY PHENYLETHYNYL CONTAINING POLYMER TO IMPROVE MELT PROCESSABILITY | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF THE NATIONAL AERONAUTICS AND SPACE ADMINSTRATION | 2002-08-27 | — | — | US | claimed |
| US-6350817-B1 | WHICH CAN BE USED WITH ANY PHENYLETHYNYL CONTAINING POLYMER, OR OLIGOMERS, TO DECREASE MELT FLOW AND CONSEQUENTLY PROCESSING PRESSURES REQUIRED TO FABRICATE MOLDED PARTS, ADHESIVE BONDS, AND FIBER REINFORCED COMPOSITE PARTS. | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE UNITED STATES NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | 2002-02-26 | — | — | US | claimed |
| CN-116075421-A | Laminate, method for producing laminate, and method for producing flexible electronic device | 东洋纺株式会社 | 2023-05-05 | — | — | CN | disclosed |
| EP-1189973-B1 | COMPOSITION OF AND METHOD FOR MAKING HIGH PERFORMANCE RESINS FOR INFUSION AND TRANSFER MOLDING PROCESSES | NASA (US) | 2006-09-20 | — | — | EP | disclosed |
| US-6441099-B1 | LOW MOLECULAR WEIGHT PHENYLETHYNYL-CONTAINING POLYIMIDES OR POLYAMIC ACIDS; CURED FILM; USE WITH ANY PHENYLETHYNYL CONTAINING POLYMER TO IMPROVE MELT PROCESSABILITY | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF THE NATIONAL AERONAUTICS AND SPACE ADMINSTRATION | 2002-08-27 | — | — | US | disclosed |
| EP-1189973-A1 | COMPOSITION OF AND METHOD FOR MAKING HIGH PERFORMANCE RESINS FOR INFUSION AND TRANSFER MOLDING PROCESSES | The Government of the United States as represented by the Administrator of the National Aeronautics and Space Administration (US) | 2002-03-27 | — | — | EP | disclosed |
| US-6359107-B1 | FOR FABRICATION OF COMPOSITE PARTS, SUCH AS FOR AEROSPACE APPLICATIONS | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR, NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | 2002-03-19 | — | — | US | disclosed |
| US-6350817-B1 | WHICH CAN BE USED WITH ANY PHENYLETHYNYL CONTAINING POLYMER, OR OLIGOMERS, TO DECREASE MELT FLOW AND CONSEQUENTLY PROCESSING PRESSURES REQUIRED TO FABRICATE MOLDED PARTS, ADHESIVE BONDS, AND FIBER REINFORCED COMPOSITE PARTS. | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE UNITED STATES NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | 2002-02-26 | — | — | US | disclosed |
| WO-2000069948-A1 | COMPOSITION OF AND METHOD FOR MAKING HIGH PERFORMANCE RESINS FOR INFUSION AND TRANSFER MOLDING PROCESSES | THE GOVERNMENT OF THE UNITED STATES AS REPRESENTED BY THE ADMINISTRATOR OF THE NATIONAL AERONAUTICS AND SPACE ADMINISTRATION (US) | 2000-11-23 | — | — | WO | disclosed |
| US-5648451-A | Process for producing photosensitive resin | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1997-07-15 | — | — | US | disclosed |
| US-4980436-A | Molding materials; processibility; heat resistance; encapsulation of electrical apparatus | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1990-12-25 | — | — | US | disclosed |