SCHEMBL29454304

SCHEMBL29454304

Nc1cccc(Oc2ccc(-c3ccccc3)cc2)c1

nearest known ligand 0.81

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOB P27338 2/20 0.81
ALDH1A1 P00352 5/20 0.59
MEN1 O00255 3/20 0.59
KMT2A Q03164 3/20 0.59
MAPT P10636 3/20 0.59
SMN1; SMN2 Q16637 2/20 0.59
MITF O75030 1/20 0.59
GAA P10253 1/20 0.59
GFER P55789 1/20 0.59
NLRP1 Q9C000 1/20 0.59
NOD2 Q9HC29 1/20 0.59
MAOA P21397 2/20 0.57
NPC1 O15118 1/20 0.56
RAB9A P51151 1/20 0.56
NLRP3 Q96P20 1/20 0.56
CHEK2 O96017 1/20 0.51
ATM Q13315 1/20 0.50
POLB P06746 1/20 0.50
HSP90AA1 P07900 1/20 0.50
LMNA P02545 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4261949 1.00 MAOB (0.81) MAOBALDH1A1MEN1KMT2AMAPT
SCHEMBL29352381 0.94 MAOB (0.76) MAOBALDH1A1MEN1KMT2AMAPT
SCHEMBL28969425 0.94 MAOB (0.76) MAOBALDH1A1MEN1KMT2AMAPT
SCHEMBL30393189 0.94 MAOB (0.76) MAOBALDH1A1MEN1KMT2AMAPT
SCHEMBL4060068 0.94 MAOB (0.76) MAOBALDH1A1MEN1KMT2AMAPT
SCHEMBL203512 0.94 MAOB (0.76) MAOBALDH1A1MEN1KMT2AMAPT
SCHEMBL980456 0.92 MAOA (0.69) MAOBALDH1A1MEN1KMT2AMAPT
SCHEMBL5744229 0.92 MAOB (0.68) MAOBALDH1A1MEN1KMT2AMAPT
SCHEMBL3610637 0.92 MAOB (0.68) MAOBALDH1A1MEN1KMT2AMAPT
SCHEMBL30392583 0.92 MAOB (0.68) MAOBALDH1A1MEN1KMT2AMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4029690-B1 METAL-CLAD LAMINATE FOR FLEXIBLE ELECTRONIC DEVICES, AND FLEXIBLE ELECTRONIC DEVICE USING SAME NIPPON STEEL CHEMICAL & MAT CO LTD (JP) 2026-04-22 EP disclosed
WO-2025100253-A1 LAMINATE 住友化学株式会社 2025-05-15 WO disclosed
WO-2025100252-A1 LAMINATE 住友化学株式会社 2025-05-15 WO disclosed
WO-2025100254-A1 LAMINATE 住友化学株式会社 2025-05-15 WO disclosed
EP-4402221-B1 BORONIC HETEROCYCLIC COMPOUNDS FOR ORGANIC ELECTROLUMINESCENT DEVICES MERCK PATENT GMBH (DE) 2025-05-07 EP disclosed
US-20240400892-A1 BORONIC HETEROCYCLIC COMPOUNDS FOR ORGANIC ELECTROLUMINESCENT DEVICES UDC IRELAND LIMITED (IE) 2024-12-05 US disclosed
CN-113527882-B Polyimide film and copper-clad laminate 日铁化学材料株式会社 2024-10-18 CN disclosed
CN-115884996-B Film and method for producing the same 住友化学株式会社 2024-08-23 CN disclosed
CN-118063769-A Polyimide resin 住友化学株式会社 2024-05-24 CN disclosed
US-11958806-B2 Production method of maleimide UNITIKA LTD. (JP) 2024-04-16 US disclosed
CN-115884996-A Film 住友化学株式会社 2023-03-31 CN disclosed
CN-115884995-A Film 住友化学株式会社 2023-03-31 CN disclosed
WO-2022270375-A1 COMPOSITION 住友化学株式会社 2022-12-29 WO disclosed
WO-2022270373-A1 COMPOSITION 住友化学株式会社 2022-12-29 WO disclosed
WO-2022270374-A1 COMPOSITION 住友化学株式会社 2022-12-29 WO disclosed
EP-4029690-A1 METAL-CLAD LAMINATE FOR FLEXIBLE ELECTRONIC DEVICES, AND FLEXIBLE ELECTRONIC DEVICE USING SAME NIPPON STEEL Chemical & Material Co., Ltd. (JP) 2022-07-20 EP disclosed
CN-114670511-A Double-sided metal-clad laminate and circuit board 日铁化学材料株式会社 2022-06-28 CN disclosed
CN-114502658-A Resin composition, resin film, laminate, coverlay film, resin-containing copper foil, metal-clad laminate, and circuit board 日铁化学材料株式会社 2022-05-13 CN disclosed
CN-109572104-B Metal-clad laminate and circuit board 日铁化学材料株式会社 2022-05-03 CN disclosed
WO-2022045363-A1 FILM 住友化学株式会社 2022-03-03 WO disclosed