Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TP53 | P04637 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL554659 | 0.87 | — | — | |
| SCHEMBL1397076 | 0.81 | — | — | |
| SCHEMBL15062569 | 0.78 | THRB (0.33) | TP53 | |
| SCHEMBL56117 | 0.78 | TSHR (0.41) | — | |
| SCHEMBL1095066 | 0.75 | CA12 (0.38) | TP53 | |
| SCHEMBL57194 | 0.74 | — | — | |
| SCHEMBL57169 | 0.73 | CYP2C19 (0.42) | — | |
| SCHEMBL1702626 | 0.72 | KDM4E (0.32) | — | |
| SCHEMBL2276679 | 0.70 | — | — | |
| SCHEMBL3953647 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 94 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12391853-B2 | Adhesive formulations for roofing applications and related methods | BMIC LLC (US) | 2025-08-19 | — | — | US | disclosed |
| US-20250206871-A1 | COATING PRIMER HAVING GOOD APPLICABILITY AT LOW TEMPERATURES | SIKA TECHNOLOGY AG (CH) | 2025-06-26 | — | — | US | disclosed |
| CN-118632907-A | Method for producing storage-stable aqueous primers for glass and ceramic substrates | SIKA技术股份公司 | 2024-09-10 | — | — | CN | disclosed |
| EP-4219641-B1 | AQUEOUS PRETREATMENT FOR BONDS WITH AN ENHANCED HEAT STABILITY | SIKA TECH AG (CH) | 2024-09-04 | — | — | EP | disclosed |
| US-11920038-B2 | Method for manufacturing processed cork chip and method for constructing floor using same | A-ROAD CO. (KR) | 2024-03-05 | — | — | US | disclosed |
| US-20230313006-A1 | PRIMER FOR POLYURETHANE ADHESIVE | DDP SPECIALTY ELECTRONIC MATERIALS US LLC (US) | 2023-10-05 | — | — | US | disclosed |
| US-20230313005-A1 | ADHESIVE FORMULATIONS FOR ROOFING APPLICATIONS AND RELATED METHODS | BMIC LLC (US) | 2023-10-05 | — | — | US | disclosed |
| US-11718773-B2 | Adhesive formulations for roofing applications and related methods | BMIC LLC (US) | 2023-08-08 | — | — | US | disclosed |
| EP-4219641-A1 | AQUEOUS PRETREATMENT FOR BONDS WITH AN ENHANCED HEAT STABILITY | Sika Technology AG (CH) | 2023-08-02 | — | — | EP | disclosed |
| EP-4214257-A1 | PRIMER FOR POLYURETHANE ADHESIVE | DDP Specialty Electronic Materials US, LLC (US) | 2023-07-26 | — | — | EP | disclosed |
| EP-1926739-A1 | SURFACTANT-STABILIZED ORGANOALKOXYSILANE COMPOSITION | Sika Technology AG (CH) | 2008-06-04 | — | — | EP | disclosed |
| EP-1923361-A1 | Low temperature primer coating composition | Sika Technology AG (CH) | 2008-05-21 | — | — | EP | disclosed |
| EP-1894966-A1 | Aqueous primer composition comprising aminosilane and mercaptosilane | Sika Technology AG (CH) | 2008-03-05 | — | — | EP | disclosed |
| US-20070190345-A1 | Aqueous two-component organoalkoxysilane composition | SIKA TECHNOLOGY AG (CH) | 2007-08-16 | — | — | US | disclosed |
| WO-2007057441-A1 | MIXING DEVICE FOR LIQUIDS | SIKA TECHNOLOGY AG (CH) | 2007-05-24 | — | — | WO | disclosed |
| EP-1787712-A1 | Mixing device for liquids | Sika Technology AG (CH) | 2007-05-23 | — | — | EP | disclosed |
| WO-2007026015-A1 | SURFACTANT-STABILIZED ORGANOALKOXYSILANE COMPOSITION | SIKA TECHNOLOGY AG (CH) | 2007-03-08 | — | — | WO | disclosed |
| EP-1760084-A1 | Tenside stabilized organoalkoxysilane composition | Sika Technology AG (CH) | 2007-03-07 | — | — | EP | disclosed |
| EP-1760128-A1 | Two-component aqueous organoalkoxysilane composition | Sika Technology AG (CH) | 2007-03-07 | — | — | EP | disclosed |
| EP-1717254-A1 | Moisture-curable composition with improved elongation | Sika Technology AG (CH) | 2006-11-02 | — | — | EP | disclosed |