SCHEMBL578684

SCHEMBL578684

Cc1cc(N)ccc1Cc1ccc(N)cc1

nearest known ligand 0.73

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.52
TSHR P16473 2/20 0.52
CYP3A4 P08684 2/20 0.52
TDP1 Q9NUW8 1/20 0.52
PDE10A Q9Y233 1/20 0.43
GAA P10253 1/20 0.42
MAPT P10636 1/20 0.42
MAPK1 P28482 1/20 0.42
HTT P42858 1/20 0.42
CASP1 P29466 1/20 0.41
GFER P55789 1/20 0.41
HTR6 P50406 1/20 0.40
CYP19A1 P11511 1/20 0.39
LOXL2 Q9Y4K0 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31175768 1.00 ALDH1A1 (0.52) ALDH1A1TSHRCYP3A4TDP1PDE10A
SCHEMBL8095125 0.92 GFER (0.48) ALDH1A1TSHRCYP3A4TDP1PDE10A
SCHEMBL8771412 0.90 ALDH1A1 (0.43) ALDH1A1TSHRCYP3A4TDP1PDE10A
SCHEMBL8100088 0.90 CYP3A4 (0.56) ALDH1A1TSHRCYP3A4TDP1GFER
SCHEMBL8087529 0.90 CYP3A4 (0.56) ALDH1A1TSHRCYP3A4TDP1GFER
SCHEMBL8095022 0.90 CYP3A4 (0.56) ALDH1A1TSHRCYP3A4TDP1GFER
SCHEMBL8085728 0.90 CYP3A4 (0.56) ALDH1A1TSHRCYP3A4TDP1GFER
SCHEMBL8095618 0.90 CYP3A4 (0.56) ALDH1A1TSHRCYP3A4TDP1GFER
SCHEMBL8093823 0.90 CYP3A4 (0.56) ALDH1A1TSHRCYP3A4TDP1GFER
SCHEMBL8093203 0.90 CYP3A4 (0.56) ALDH1A1TSHRCYP3A4TDP1GFER

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 235 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-16 US disclosed
EP-4660704-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2025-12-10 EP disclosed
US-20250355350-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-20 US disclosed
EP-4650874-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-19 EP disclosed
EP-4636485-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2025-10-22 EP disclosed
EP-4636011-A1 POLYMER, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-10-22 EP disclosed
EP-4553100-A1 POLYMER, POSITIVE AND NEGATIVE PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-05-14 EP disclosed
CN-119955091-A Polymer, positive-type negative-type photosensitive resin composition, pattern forming method, cured film forming method, interlayer insulating film, surface protective film, and electronic component 信越化学工业株式会社 2025-05-09 CN disclosed
US-20250147420-A1 Polymer, Positive And Negative Photosensitive Resin Compositions, Patterning Process, Method For Forming Cured Film, Interlayer Insulating Film, Surface Protective Film, And Electronic Component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-05-08 US disclosed
WO-2024052176-A1 RHEOLOGY MODIFYING OF POLYMERS WITH A RADICAL INITIATOR AND THIOURETHANE BASF SE (DE) 2024-03-14 WO disclosed
WO-2001029126-A1 STABILIZERS AND ANTIOZONANTS FOR ELASTOMERS CIBA SPECIALTY CHEMICALS HOLDING INC. (CH) 2001-04-26 WO disclosed
WO-2000018833-A1 SYNERGISTIC STABILIZING MIXTURES GREAT LAKES CHEMICAL (EUROPE) GMBH (CH) 2000-04-06 WO disclosed
EP-0714398-A1 GAMMA CRYSTALLINE MODIFICATION OF 2,2',2\"-NITRILO TRIETHYL-TRIS-(3,3',5,5'-TETRA-TERT-BUTYL-1,1'-BIPHENYL-2,2'-DIYL)PHOSPHITE] Ciba SC Holding AG (CH) 1996-06-05 EP disclosed
WO-1995005387-A1 GAMMA CRYSTALLINE MODIFICATION OF 2,2',2'-NITRILO[TRIETHYL-TRIS-(3,3',5,5'-TETRA-TERT-BUTYL-1,1'-BIPHENYL-2,2'-DIYL)PHOSPHITE] CIBA-GEIGY AG (CH) 1995-02-23 WO disclosed
EP-0359805-B1 USE OF SOLIDS AS ANTIBLOCKING ADDITIVES FOR MARKER LIQUIDS KAUFMANN R DATAPRINT (DE) 1994-01-19 EP disclosed
EP-0368803-A1 Lubricant compositions CIBA-GEIGY AG (CH) 1990-05-16 EP disclosed
EP-0359805-A1 USE OF SOLIDS AS ANTIBLOCKING ADDITIVES FOR MARKER LIQUIDS. KAUFMANN RAINER DATAPRINT (DE) 1990-03-28 EP disclosed
WO-1989009247-A1 USE OF SOLIDS AS ANTIBLOCKING ADDITIVES FOR MARKER LIQUIDS DATAPRINT DATENDRUCKSYSTEM R. KAUFMAN KG (DE) 1989-10-05 WO disclosed
EP-0328488-A2 Asymmetric disulfides in lubricant compositions CIBA-GEIGY AG (CH) 1989-08-16 EP disclosed
EP-0322362-A1 Thiadiazole derivatives as additives for lubricants CIBA-GEIGY AG (CH) 1989-06-28 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT ARCN1, PRDM9, LBR ALDH1A1 3706/4885TSHR 3214/4885CYP3A4 2409/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.