SCHEMBL580116

SCHEMBL580116

CCOC(OCC)(OCC)C([SiH3])N=C=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5331134 0.74
SCHEMBL3628044 0.71
SCHEMBL7849951 0.69
SCHEMBL1361429 0.68
SCHEMBL27660119 0.66
SCHEMBL27823823 0.65 THRB (0.31)
SCHEMBL27639407 0.65
SCHEMBL394101 0.64
SCHEMBL1029234 0.64
SCHEMBL4119769 0.64 THRB (0.38)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 127 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3929260-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2025-12-17 EP disclosed
EP-4011978-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2025-11-19 EP disclosed
US-12221563-B2 Curable composition KANEKA CORPORATION (JP) 2025-02-11 US disclosed
EP-4368654-A1 MULTI-COMPONENT CURABLE COMPOSITION Kaneka Corporation (JP) 2024-05-15 EP disclosed
CN-117983518-A Method for manufacturing laminated structure and use thereof 株式会社钟化 2024-05-07 CN disclosed
EP-4317207-A1 CURABLE COMPOSITION AND CURED PRODUCT THEREOF Kaneka Corporation (JP) 2024-02-07 EP disclosed
CN-113423794-B Curable composition 株式会社钟化 2023-12-08 CN disclosed
CN-116997610-A Curable composition and cured product thereof 株式会社钟化 2023-11-03 CN disclosed
CN-114207017-B Curable composition 株式会社钟化 2023-06-20 CN disclosed
CN-111699216-B One-component curable composition for working seams 株式会社钟化 2023-06-09 CN disclosed
EP-1942153-A1 CURABLE COMPOSITION IMPROVED IN CURABILITY AND STORAGE STABILITY Kaneka Corporation (JP) 2008-07-09 EP disclosed
EP-1939256-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2008-07-02 EP disclosed
EP-1939257-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2008-07-02 EP disclosed
EP-1930376-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2008-06-11 EP disclosed
EP-1930375-A1 CURABLE COMPOSITION IMPROVED IN CURABILITY AND ADHESIVENESS Kaneka Corporation (JP) 2008-06-11 EP disclosed
US-20080051547-A1 Curable Composition KANEKA CORPORATION (JP) 2008-02-28 US disclosed
US-20080021140-A1 Curable Composition KANEKA CORPORATION (JP) 2008-01-24 US disclosed
EP-1754754-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2007-02-21 EP disclosed
EP-1734079-A1 SINGLE-COMPONENT CURABLE COMPOSITION Kaneka Corporation (JP) 2006-12-20 EP disclosed
EP-1731573-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2006-12-13 EP disclosed