⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14524581 | 0.88 | — | — | |
| SCHEMBL581055 | 0.87 | — | — | |
| SCHEMBL962544 | 0.85 | — | — | |
| SCHEMBL14524583 | 0.84 | CDC25A (0.31) | — | |
| SCHEMBL7627457 | 0.80 | — | — | |
| SCHEMBL9757072 | 0.77 | — | — | |
| SCHEMBL329013 | 0.76 | — | — | |
| SCHEMBL436478 | 0.76 | — | — | |
| SCHEMBL436480 | 0.76 | — | — | |
| SCHEMBL64309 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 246 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111770645-B | Large-imposition high-ounce copper solder resist one-time printing ink process | 昆山大洋电路板有限公司 | 2024-12-13 | — | — | CN | claimed |
| CN-111770645-A | Large-makeup high-ounce copper solder-resist one-time printing ink process | 昆山大洋电路板有限公司 | 2020-10-13 | — | — | CN | claimed |
| CN-111154191-A | High-temperature-resistant corrosion-resistant conveying belt and preparation method thereof | 浙江环能传动科技有限公司 | 2020-05-15 | — | — | CN | claimed |
| JP-7286126-A | — | — | None | — | — | JP | disclosed |
| US-20260085141-A1 | MODIFIED POLYMER, COMPOSITION, COATING FILM, AND MULTILAYER BODY | DAIKIN INDUSTRIES, LTD. (JP) | 2026-03-26 | — | — | US | disclosed |
| US-12528901-B2 | Modified polymer, composition, coating film and multilayer body | DAIKIN FLUOROCHEMICALS (CHINA) CO., LTD. (CN) | 2026-01-20 | — | — | US | disclosed |
| EP-4653500-A1 | THERMOSETTING RESIN COMPOSITION AND CURED FILM | Kyoeisha Chemical Co., Ltd. (JP) | 2025-11-26 | — | — | EP | disclosed |
| US-20250270418-A1 | THERMOSETTING RESIN COMPOSITION AND CURED FILM | KYOEISHA CHEMICAL CO., LTD. (JP) | 2025-08-28 | — | — | US | disclosed |
| US-20250197665-A1 | COATING FILM AND COATED ARTICLE | DAIKIN INDUSTRIES, LTD. (JP) | 2025-06-19 | — | — | US | disclosed |
| US-20250197649-A1 | ANTI-ICING COATING AND ANTI-ICING COATING FILM, AND ANTI-FOULING COATING AND ANTI-FOULING COATING FILM | DAIKIN FLUOROCHEMICALS (CHINA) CO., LTD. (CN) | 2025-06-19 | — | — | US | disclosed |
| CN-113366683-B | Structure, composite, battery, and method for manufacturing composite | 大金工业株式会社 | 2025-06-13 | — | — | CN | disclosed |
| EP-0939105-A1 | DURABLE WATER REPELLENT AND COATED ARTICLES | DAIKIN INDUSTRIES, LTD. (JP) | 1999-09-01 | — | — | EP | disclosed |
| US-5840806-A | COMPOSITION COMPRISING RESIN FORMED BY CONDENSATION OF POLYSILOXANE WITH POLYMER HAVING HYDROLYZABLE SILYL GROUP AND ADDITIONAL FUNCTIONAL GROUP, COMPOUND CAPABLE OF REACTING WITH SAID GROUP | DAINIPPON INK AND CHEMICALS, INC. (JP) | 1998-11-24 | — | — | US | disclosed |
| JP-H07286126-A | BINDER FOR INORGANIC/ORGANIC COMBINED-COATING COATING AGENT | DAINIPPON TORYO CO LTD | 1995-10-31 | — | — | JP | disclosed |
| EP-0464704-B1 | Fluorine-containing copolymer and the curable composition containing the same | DAIKIN IND LTD (JP) | 1995-01-11 | — | — | EP | disclosed |
| US-5216081-A | Comprising a fluoroolefin, a beta-methyl alpha olefin, functionalized unsaturated compounds and unsaturated esters; paints; weatherproofing; solvent solubility; antisoilants | DAIKIN INDUSTRIES, LTD. (JP) | 1993-06-01 | — | — | US | disclosed |
| EP-0222157-B1 | RESIN COMPOSITION | DAINIPPON INK AND CHEMICALS, INC. (JP) | 1992-12-30 | — | — | EP | disclosed |
| EP-0464704-A1 | Fluorine-containing copolymer and the curable composition containing the same | DAIKIN INDUSTRIES, LIMITED (JP) | 1992-01-08 | — | — | EP | disclosed |
| US-4886862-A | MOISTURE-CURABLE SILYL-GROUP CONTAINING COPOLYMER OF A FLUOROALKYL PERVINYL ETHER AND A VINYL CARBOXYLATE, CATALYST AND SOLVENT; PAINTS; COATINGS, WEATHERPROOFING; HARDNESS | DAINIPPON INK AND CHEMICALS, INC. (JP) | 1989-12-12 | — | — | US | disclosed |
| EP-0222157-A2 | Resin composition | DAINIPPON INK AND CHEMICALS, INC. (JP) | 1987-05-20 | — | — | EP | disclosed |