SCHEMBL329013

SCHEMBL329013

C=COCC[Si](OC)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL581028 0.86 LMNA (0.34)
SCHEMBL580870 0.84 LMNA (0.33)
SCHEMBL14524584 0.82 LMNA (0.36)
SCHEMBL9008717 0.79 LMNA (0.31)
SCHEMBL581061 0.78
SCHEMBL580359 0.76
SCHEMBL1398336 0.76
SCHEMBL766749 0.75 LMNA (0.33)
SCHEMBL9907031 0.75
SCHEMBL12971068 0.74

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 305 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3340252-A1 ELECTRODE ASSEMBLY Solvay SA (BE) 2018-06-27 EP claimed
US-20260085141-A1 MODIFIED POLYMER, COMPOSITION, COATING FILM, AND MULTILAYER BODY DAIKIN INDUSTRIES, LTD. (JP) 2026-03-26 US disclosed
US-12528901-B2 Modified polymer, composition, coating film and multilayer body DAIKIN FLUOROCHEMICALS (CHINA) CO., LTD. (CN) 2026-01-20 US disclosed
EP-4653500-A1 THERMOSETTING RESIN COMPOSITION AND CURED FILM Kyoeisha Chemical Co., Ltd. (JP) 2025-11-26 EP disclosed
US-20250270418-A1 THERMOSETTING RESIN COMPOSITION AND CURED FILM KYOEISHA CHEMICAL CO., LTD. (JP) 2025-08-28 US disclosed
US-20250197649-A1 ANTI-ICING COATING AND ANTI-ICING COATING FILM, AND ANTI-FOULING COATING AND ANTI-FOULING COATING FILM DAIKIN FLUOROCHEMICALS (CHINA) CO., LTD. (CN) 2025-06-19 US disclosed
US-20250197665-A1 COATING FILM AND COATED ARTICLE DAIKIN INDUSTRIES, LTD. (JP) 2025-06-19 US disclosed
CN-113366683-B Structure, composite, battery, and method for manufacturing composite 大金工业株式会社 2025-06-13 CN disclosed
CN-115210853-B Coating composition for producing interlayer insulating film, semiconductor element, and method for producing interlayer insulating film DIC株式会社 2025-06-03 CN disclosed
CN-114206958-B Fluoropolymer for metal clad laminate, composition for metal clad laminate, curable composition, metal clad laminate, and printed board 大金工业株式会社 2025-06-03 CN disclosed
EP-0809225-A1 REFLECTIVE SHEET NIPPON CARBIDE KOGYO KABUSHIKI KAISHA (JP) 1997-11-26 EP disclosed
EP-0700975-A1 COATING COMPOSITION AND COATED ARTICLE DAIKIN INDUSTRIES, LTD. (JP) 1996-03-13 EP disclosed
CN-1118607-A Coating composition and coated article DAIKIN IND LTD (JP) 1996-03-13 CN disclosed
EP-0464704-B1 Fluorine-containing copolymer and the curable composition containing the same DAIKIN IND LTD (JP) 1995-01-11 EP disclosed
US-5216081-A Comprising a fluoroolefin, a beta-methyl alpha olefin, functionalized unsaturated compounds and unsaturated esters; paints; weatherproofing; solvent solubility; antisoilants DAIKIN INDUSTRIES, LTD. (JP) 1993-06-01 US disclosed
EP-0222157-B1 RESIN COMPOSITION DAINIPPON INK AND CHEMICALS, INC. (JP) 1992-12-30 EP disclosed
US-5169915-A Solvent solubility, compatibility with curing agents DAIKIN INDUSTRIES, LTD. (JP) 1992-12-08 US disclosed
EP-0464704-A1 Fluorine-containing copolymer and the curable composition containing the same DAIKIN INDUSTRIES, LIMITED (JP) 1992-01-08 EP disclosed
US-4886862-A MOISTURE-CURABLE SILYL-GROUP CONTAINING COPOLYMER OF A FLUOROALKYL PERVINYL ETHER AND A VINYL CARBOXYLATE, CATALYST AND SOLVENT; PAINTS; COATINGS, WEATHERPROOFING; HARDNESS DAINIPPON INK AND CHEMICALS, INC. (JP) 1989-12-12 US disclosed
EP-0222157-A2 Resin composition DAINIPPON INK AND CHEMICALS, INC. (JP) 1987-05-20 EP disclosed