SCHEMBL580421

SCHEMBL580421

CC1(C)CCCCC1(C)[O]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11829612 0.97
SCHEMBL502573 0.73
SCHEMBL4445315 0.70
SCHEMBL8618212 0.70
SCHEMBL17495568 0.70
SCHEMBL581765 0.67
SCHEMBL767078 0.65
SCHEMBL2344061 0.65
SCHEMBL4173299 0.65
SCHEMBL6937119 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 191 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114478396-A Dihydropyrimidine (thio) ketone compound and preparation method and application thereof 河南省人民医院 2022-05-13 CN claimed
WO-2024071129-A1 ACTIVE ESTER RESIN, EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF, PREPREG, LAMINATED BOARD, AND BUILD-UP FILM 日鉄ケミカル&マテリアル株式会社 2024-04-04 WO disclosed
CN-114478396-B Dihydropyrimidine (thio) ketone compound, preparation method and application thereof 河南省人民医院 2023-12-01 CN disclosed
US-11807711-B2 Phenoxy resin, resin composition including same, cured object obtained therefrom, and production method therefor NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) 2023-11-07 US disclosed
US-11803122-B2 Chemical amplification-type photosensitive composition, photosensitive dry film, production method of patterned resist layer, production method of plated molded article, compound, and production method of compound TOKYO OHKA KOGYO CO., LTD. (JP) 2023-10-31 US disclosed
WO-2023162552-A1 CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE COMPOSITION, PRODUCTION METHOD FOR SUBSTRATE WITH TEMPLATE, AND PRODUCTION METHOD FOR PLATED ARTICLE 東京応化工業株式会社 2023-08-31 WO disclosed
WO-2023162551-A1 METHOD FOR PRODUCING PLATED SHAPED ARTICLE 東京応化工業株式会社 2023-08-31 WO disclosed
US-20230273521-A1 CHEMICALLY AMPLIFIED PHOTOSENTIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-31 US disclosed
US-20230229084-A1 CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2023-07-20 US disclosed
EP-2435497-B1 POLYCYCLIC DITHIOPHENES CLAP CO LTD (KR) 2023-07-05 EP disclosed
US-5773631-A PROTECTION OF POLYMERS AND LUBRICANTS AGAINST THERMAL, OXIDATIVE OR LIGHT INDUCED DEGRDATION CIBA SPECIALTY CHEMICALS CORPORATION (US) 1998-06-30 US disclosed
EP-0842975-A1 Stabilising polyolefins for long term contact with an extracting medium Ciba SC Holding AG (CH) 1998-05-20 EP disclosed
EP-0839623-A1 Stabiliser combination for rotomolding process Ciba SC Holding AG (CH) 1998-05-06 EP disclosed
US-5607624-A Process for the preparation of 3-arylbenzofuranones CIBA-GEIGY CORPORATION (US) 1997-03-04 US disclosed
US-5516920-A POLYMER STABILIZERS CIBA-GEIGY CORPORATION (US) 1996-05-14 US disclosed
EP-0648765-A1 Process for the production of 3-arylbenzofuranones CIBA-GEIGY AG (CH) 1995-04-19 EP disclosed
EP-0125209-B1 LUBRICATING COMPOSITIONS CIBA-GEIGY AG (CH) 1987-07-29 EP disclosed
US-4544492-A THIOPHOSPHORIC ACID ESTER DERIVATIVES CIBA-GEIGY CORPORATION (US) 1985-10-01 US disclosed
EP-0125209-A2 Lubricating compositions CIBA-GEIGY AG (CH) 1984-11-14 EP disclosed
US-3980796-A CONTROL OF PARASITES AND NEMATODES HOECHST AKTIENGESELLSCHAFT (DT) 1976-09-14 US disclosed