SCHEMBL5817823

SCHEMBL5817823

CCCCOCC1CCC2OC2C1

nearest known ligand 0.47

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 1/20 0.47
ALDH1A1 P00352 1/20 0.41
TDP1 Q9NUW8 1/20 0.41
PDK1 Q15118 1/20 0.34
TSHR P16473 2/20 0.32
PPP5C P53041 1/20 0.32
PPM1B O75688 1/20 0.32
PTPN1 P18031 1/20 0.32
PPP1CC P36873 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5275198 0.97 SMN1; SMN2 (0.44) SMN1; SMN2ALDH1A1TDP1PDK1TSHR
SCHEMBL5820808 0.95 ALDH1A1 (0.47) SMN1; SMN2ALDH1A1TDP1TSHR
SCHEMBL13935488 0.93 ALDH1A1 (0.50) SMN1; SMN2ALDH1A1TDP1
SCHEMBL5278688 0.93 ALDH1A1 (0.50) SMN1; SMN2ALDH1A1TDP1
SCHEMBL13935383 0.93 ALDH1A1 (0.50) SMN1; SMN2ALDH1A1TDP1
SCHEMBL14256301 0.93 ALDH1A1 (0.50) SMN1; SMN2ALDH1A1TDP1
SCHEMBL16556737 0.92 ALDH1A1 (0.45) SMN1; SMN2ALDH1A1TDP1TSHR
SCHEMBL5822587 0.91 SMN1; SMN2 (0.36) SMN1; SMN2ALDH1A1TDP1PPM1BPTPN1
SCHEMBL13935572 0.89 TSHR (0.35) SMN1; SMN2TSHR
SCHEMBL11759538 0.89 TSHR (0.40) SMN1; SMN2ALDH1A1TDP1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116004226-B Composite perovskite quantum dot material, perovskite quantum dot composition, and preparation methods and applications thereof 北京航空航天大学合肥创新研究院(北京航空航天大学合肥研究生院) 2023-12-15 CN claimed
CN-116004226-A Composite perovskite quantum dot material, perovskite quantum dot composition, and preparation methods and applications thereof 北京航空航天大学合肥创新研究院(北京航空航天大学合肥研究生院) 2023-04-25 CN claimed
CN-116004226-B Composite perovskite quantum dot material, perovskite quantum dot composition, and preparation methods and applications thereof 北京航空航天大学合肥创新研究院(北京航空航天大学合肥研究生院) 2023-12-15 CN disclosed
CN-116004226-A Composite perovskite quantum dot material, perovskite quantum dot composition, and preparation methods and applications thereof 北京航空航天大学合肥创新研究院(北京航空航天大学合肥研究生院) 2023-04-25 CN disclosed
US-9063415-B2 Photocurable resin composition and novel siloxane compound ADEKA CORPORATION (JP) 2015-06-23 US disclosed
US-9017905-B2 Chemically amplified positive resist composition and pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-04-28 US disclosed
US-9017905-B2 Chemically amplified positive resist composition and pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-04-28 US disclosed
US-20140205949-A1 PHOTOCURABLE RESIN COMPOSITION AND NOVEL SILOXANE COMPOUND ADEKA CORPORATION (JP) 2014-07-24 US disclosed
US-20140087294-A1 CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-03-27 US disclosed
US-20140087294-A1 CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-03-27 US disclosed
US-20080075883-A1 PROCESS FOR PRODUCING MOLDED PRINTED MATERIAL, AND MOLDED PRINTED MATERIAL FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed
EP-1632794-A2 Radiation sensitive resin composition for forming microlens JSR Corporation (JP) 2006-03-08 EP disclosed
US-20060008735-A1 Radiation sensitive resin composition for forming microlens JSR CORPORATION (JP) 2006-01-12 US disclosed