SCHEMBL5830404

SCHEMBL5830404

CCCCCOCCC=C(C)C(=O)O

nearest known ligand 0.47

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
CES2 O00748 2/20 0.47
EP300 Q09472 1/20 0.43
MEN1 O00255 1/20 0.41
THRB P10828 1/20 0.41
HTT P42858 1/20 0.41
KMT2A Q03164 1/20 0.41
MAPT P10636 1/20 0.41
EPHX2 P34913 1/20 0.40
HCAR2 Q8TDS4 2/20 0.40
P2RY10 O00398 1/20 0.39
PLA2G2C Q5R387 3/20 0.38
TSHR P16473 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25222990 0.98 CES2 (0.50) CES2EP300MEN1THRBHTT
SCHEMBL5386604 0.98 CES2 (0.50) CES2EP300MEN1THRBHTT
SCHEMBL5382943 0.98 CES2 (0.50) CES2EP300MEN1THRBHTT
SCHEMBL5399497 0.98 CES2 (0.50) CES2EP300MEN1THRBHTT
SCHEMBL7092774 0.98 CES2 (0.50) CES2EP300MEN1THRBHTT
SCHEMBL209322 0.95 TSHR (0.42) CES2EP300MEN1THRBHTT
SCHEMBL474889 0.95 TSHR (0.42) CES2EP300MEN1THRBHTT
SCHEMBL262089 0.93 TSHR (0.41) CES2EP300MEN1THRBHTT
SCHEMBL5873277 0.93 TSHR (0.41) CES2EP300MEN1THRBHTT
SCHEMBL871680 0.89 EP300 (0.47) CES2EP300MEN1THRBHTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7101650-B2 Photosensitive resin composition for photoresist DONGJIN SEMICHEM CO., LTD. (KR) 2006-09-05 US claimed
US-20040248030-A1 Photosensitive resin composition for photoresist DONGJIN SEMICHEM CO., LTD. (KR) 2004-12-09 US claimed
WO-2003017001-A1 PHOTOSENSITIVE RESIN COMPOSITION FOR PHOTORESIST DONGJIN SEMICHEM CO., LTD. (KR) 2003-02-27 WO claimed
CN-100557509-C Photosensitive resin composition for photoresist DONGJIN SEMICHEM CO LTD (KR) 2009-11-04 CN disclosed
CN-100445846-C Photosensitive resin composition for photoresist DONGJIN SEMICHEM CO LTD (KR) 2008-12-24 CN disclosed
US-7101650-B2 Photosensitive resin composition for photoresist DONGJIN SEMICHEM CO., LTD. (KR) 2006-09-05 US disclosed
CN-1261822-C Photosensitive resin composition for photoresist DONGJIN SEMICHEM CO LTD (KR) 2006-06-28 CN disclosed
CN-1766732-A Photosensitive resin composition for photoresist DONGJIN SEMICHEM CO LTD (KR) 2006-05-03 CN disclosed
CN-1766719-A Photosensitive resin composition for photoresist DONGJIN SEMICHEM CO LTD (KR) 2006-05-03 CN disclosed
US-20040248030-A1 Photosensitive resin composition for photoresist DONGJIN SEMICHEM CO., LTD. (KR) 2004-12-09 US disclosed
CN-1543591-A Photosensitive resin composition for photoresist 东进瑟弥侃株式会社 2004-11-03 CN disclosed
WO-2003017001-A1 PHOTOSENSITIVE RESIN COMPOSITION FOR PHOTORESIST DONGJIN SEMICHEM CO., LTD. (KR) 2003-02-27 WO disclosed