⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5425853 | 0.87 | — | — | |
| SCHEMBL3482648 | 0.86 | CYP3A4 (0.32) | — | |
| SCHEMBL5833981 | 0.86 | ADRB2 (0.32) | — | |
| SCHEMBL5834139 | 0.83 | — | — | |
| SCHEMBL6297053 | 0.83 | USP2 (0.36) | — | |
| SCHEMBL6298241 | 0.83 | USP2 (0.36) | — | |
| SCHEMBL17937574 | 0.81 | — | — | |
| SCHEMBL17937584 | 0.81 | TSHR (0.32) | — | |
| SCHEMBL16390065 | 0.81 | — | — | |
| SCHEMBL17937749 | 0.81 | CYP3A4 (0.37) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110249004-A | Polyimide precursor composition | 东京应化工业株式会社 | 2019-09-17 | — | — | CN | disclosed |
| CN-108387954-A | The manufacturing method of laminated body, flexible devices and laminated body | 东京应化工业株式会社 | 2018-08-10 | — | — | CN | disclosed |
| CN-108389512-A | The manufacturing method of laminated body, flexible devices and laminated body | 东京应化工业株式会社 | 2018-08-10 | — | — | CN | disclosed |
| CN-108250754-A | Containing silicone resin composition, containing silicone resin film, silica membrane, illuminated display element panel and luminous display unit | 东京应化工业株式会社 | 2018-07-06 | — | — | CN | disclosed |
| CN-107922733-A | Polyimide precursor composition | 东京应化工业株式会社 | 2018-04-17 | — | — | CN | disclosed |
| CN-107709464-A | Containing silicone resin composition | 东京应化工业株式会社 | 2018-02-16 | — | — | CN | disclosed |
| CN-107429059-A | ENERGY-SENSITIVE RESIN COMPOSITION | 东京应化工业株式会社 | 2017-12-01 | — | — | CN | disclosed |
| US-7005532-B2 | Process of producing alkoxysilanes | TOAGOSEI CO., LTD. (JP) | 2006-02-28 | — | — | US | disclosed |
| US-20050020845-A1 | Process of producing alkoxysilanes | TOAGOSEI CO., LTD. (JP) | 2005-01-27 | — | — | US | disclosed |
| EP-1428828-A1 | PROCESS FOR PREPARATION OF ALKOXYSILANES | TOAGOSEI CO., LTD. (JP) | 2004-06-16 | — | — | EP | disclosed |