SCHEMBL584272

SCHEMBL584272

C=Cc1ccccc1[Si](C)(OC)OC

nearest known ligand 0.39

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.39
KMT2A Q03164 2/20 0.32
MEN1 O00255 1/20 0.30
CYP3A4 P08684 1/20 0.30
TSHR P16473 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29434625 0.84 ALDH1A1 (0.39) ALDH1A1KMT2AMEN1CYP3A4TSHR
SCHEMBL6517708 0.84 ALDH1A1 (0.39) ALDH1A1KMT2AMEN1CYP3A4TSHR
SCHEMBL441041 0.82 ALDH1A1 (0.38) ALDH1A1
SCHEMBL29434607 0.82 ALDH1A1 (0.40) ALDH1A1KMT2AMEN1CYP3A4TSHR
SCHEMBL688800 0.82 ALDH1A1 (0.40) ALDH1A1KMT2AMEN1CYP3A4TSHR
SCHEMBL6683444 0.82 ALDH1A1 (0.40) ALDH1A1KMT2AMEN1CYP3A4TSHR
SCHEMBL1270796 0.81 ALDH1A1 (0.36) ALDH1A1KMT2AMEN1CYP3A4
SCHEMBL15471181 0.81 ALDH1A1 (0.36) ALDH1A1KMT2A
SCHEMBL30590540 0.81 ALDH1A1 (0.36) ALDH1A1KMT2AMEN1CYP3A4
SCHEMBL19825684 0.79 ALDH1A1 (0.35) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 72 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3340253-A1 UV-RESISTANT ELECTRODE ASSEMBLY Solvay SA (BE) 2018-06-27 EP claimed
EP-3340252-A1 ELECTRODE ASSEMBLY Solvay SA (BE) 2018-06-27 EP claimed
EP-3663342-B1 FOAMABLE POLYSTYRENE RESIN PARTICLES, POLYSTYRENE PREFOAMED PARTICLES, FOAM-MOLDED ARTICLE, AND METHODS FOR PRODUCING THESE KANEKA CORP (JP) 2023-03-08 EP disclosed
CN-115202152-A Composition, cured film and method for producing same, semiconductor element, and display element JSR株式会社 2022-10-18 CN disclosed
CN-110997777-B Expandable polystyrene resin particles, polystyrene pre-expanded particles, expanded molded article, and methods for producing these 株式会社钟化 2022-08-02 CN disclosed
CN-110997778-B Expandable polystyrene resin particles, polystyrene pre-expanded particles, and expanded molded article 株式会社钟化 2022-06-24 CN disclosed
US-11312835-B2 Expandable polystyrene resin particles, polystyrene pre-expanded particles, and foam molded body KANEKA CORPORATION (JP) 2022-04-26 US disclosed
EP-3663342-A1 FOAMABLE POLYSTYRENE RESIN PARTICLES, POLYSTYRENE PREFOAMED PARTICLES, FOAM-MOLDED ARTICLE, AND METHODS FOR PRODUCING THESE Kaneka Corporation (JP) 2020-06-10 EP disclosed
US-20200172693-A1 FOAMABLE POLYSTYRENE RESIN PARTICLES, POLYSTYRENE PREFOAMED PARTICLES, FOAM-MOLDED ARTICLE, AND METHODS FOR PRODUCING THESE KANEKA CORPORATION (JP) 2020-06-04 US disclosed
US-20200172692-A1 EXPANDABLE POLYSTYRENE RESIN PARTICLES, POLYSTYRENE PRE-EXPANDED PARTICLES, AND FOAM MOLDED BODY KANEKA CORPORATION (JP) 2020-06-04 US disclosed
CN-110997777-A Expandable polystyrene resin particles, polystyrene pre-expanded particles, expanded molded article, and methods for producing these 株式会社钟化 2020-04-10 CN disclosed
US-20040063873-A1 Processes for producing cycloolefin addition polymer JSR CORPORATION (JP) 2004-04-01 US disclosed
EP-1394217-A2 Polymeric compositions useful in plastic resins ROHM AND HAAS COMPANY (US) 2004-03-03 EP disclosed
EP-1394209-A1 Polymeric compositions useful in plastic resins ROHM AND HAAS COMPANY (US) 2004-03-03 EP disclosed
EP-1364975-A1 PROCESSES FOR PRODUCING CYCLOOLEFIN ADDITION POLYMER JSR Corporation (JP) 2003-11-26 EP disclosed
CN-1331265-A Light solidified resin compsn. and light solidified membrane using same and moulded products and its preparing tech MITSUBISHI RAYON CO (JP) 2002-01-16 CN disclosed
CN-1070513-C Composite material and moldings produced therefrom MITSUBISHI RAYON CO (JP) 2001-09-05 CN disclosed
EP-0989162-A1 THERMOPLASTIC RESIN COMPOSITION, WATER-BASED COMPOSITION, HEAT-SENSITIVE PRESSURE-SENSITIVE ADHESIVE, AND HEAT-SENSITIVE SHEET Daicel Chemical Industries, Ltd. (JP) 2000-03-29 EP disclosed
EP-0989168-A1 Water-based coating composition Daicel Chemical Industries, Ltd. (JP) 2000-03-29 EP disclosed
CN-1187833-A Composite material and molded article comprising the same MITSUBISHI RAYON CO (JP) 1998-07-15 CN disclosed