SCHEMBL584362

SCHEMBL584362

C=CCC(CC=C)CCn1c(=O)[nH]c(=O)[nH]c1=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17144398 0.90
SCHEMBL6114549 0.81 CYP3A4 (0.31)
SCHEMBL13286768 0.75 ADORA2B (0.36)
SCHEMBL27968123 0.72 MAPT (0.34)
SCHEMBL302029 0.71 APEX1 (0.31)
SCHEMBL19872816 0.70 MEN1 (0.35)
SCHEMBL181982 0.70 CYP3A4 (0.54)
SCHEMBL6114572 0.69
SCHEMBL29252281 0.69 DAO (0.39)
SCHEMBL28539145 0.69 CYP3A4 (0.36)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240210827-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-06-27 US disclosed
WO-2024095777-A1 RESIN COMPOSITION 日本ゼオン株式会社 2024-05-10 WO disclosed
WO-2023182412-A1 RESIN PANEL FOR INFRARED SENSOR, AND INFRARED SENSOR AND ARTICLE EMPLOYING SAID RESIN PANEL 大日本印刷株式会社 2023-09-28 WO disclosed
WO-2023078367-A1 SECONDARY BATTERY 珠海冠宇电池股份有限公司 2023-05-11 WO disclosed
WO-2023053976-A1 RESIN COMPOSITION 日本ゼオン株式会社 2023-04-06 WO disclosed
WO-2022210788-A1 PHOTOSENSITIVE RESIN COMPOSITION 味の素株式会社 2022-10-06 WO disclosed
CN-110662805-B Silicone resin composition, adhesive using same, display device, semiconductor device, and lighting device 东丽株式会社 2022-02-08 CN disclosed
US-10990008-B2 Resin composition TORAY INDUSTRIES, INC. (JP) 2021-04-27 US disclosed
US-20200409263-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2020-12-31 US disclosed
US-10831101-B2 Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus ASAHI KASEI KABUSHIKI KAISHA (JP) 2020-11-10 US disclosed
EP-1832613-B9 GRAFT COPOLYMER, METHOD FOR PRODUCING SAME AND RESIN COMPOSITION CONTAINING SUCH GRAFT COPOLYMER KANEKA CORP (JP) 2012-08-29 EP disclosed
EP-1832613-B1 GRAFT COPOLYMER, METHOD FOR PRODUCING SAME AND RESIN COMPOSITION CONTAINING SUCH GRAFT COPOLYMER KANEKA CORP (JP) 2012-02-15 EP disclosed
EP-1746116-B1 COPOLYMER, GRAFT COPOLYMER, GRAFT COPOLYMER PARTICLE, FLAME RETARDANT, AND RESIN COMPOSITION KANEKA CORP (JP) 2011-07-06 EP disclosed
US-7855257-B2 Copolymer, graft copolymer, graft copolymer particles, flame retardant, and resin composition KANEKA CORPORATION (JP) 2010-12-21 US disclosed
US-20100204404-A1 LIQUID RESIN COMPOSITION AND CURED PRODUCT USING THE LIQUID RESIN COMPOSITION KANEKA CORPORATION 2010-08-12 US disclosed
EP-2189502-A1 LIQUID RESIN COMPOSITION AND CURED PRODUCT USING THE LIQUID RESIN COMPOSITION Kaneka Corporation (JP) 2010-05-26 EP disclosed
US-20080085975-A1 Graft Copolymer, Method For Producing The Same And Resin Composition Containing The Graft Copolymer KANEKA CORPORATION (JP) 2008-04-10 US disclosed
US-20070219319-A1 Copolymer, Graft Copolymer, Graft Copolymer Particles, Flame Retardant, and Resin Composition KANEKA CORPORATION 2007-09-20 US disclosed
EP-1832613-A1 GRAFT COPOLYMER, METHOD FOR PRODUCING SAME AND RESIN COMPOSITION CONTAINING SUCH GRAFT COPOLYMER Kaneka Corporation (JP) 2007-09-12 EP disclosed
EP-1746116-A1 COPOLYMER, GRAFT COPOLYMER, GRAFT COPOLYMER PARTICLE, FLAME RETARDANT, AND RESIN COMPOSITION Kaneka Corporation (JP) 2007-01-24 EP disclosed