Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.40 |
| ▸ | TSHR | P16473 | 1/20 | 0.40 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.39 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.39 |
| ▸ | MEN1 | O00255 | 1/20 | 0.35 |
| ▸ | GLA | P06280 | 1/20 | 0.35 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.35 |
| ▸ | PAOX | Q6QHF9 | 1/20 | 0.33 |
| ▸ | KDM1A | O60341 | 3/20 | 0.32 |
| ▸ | S1PR2 | O95136 | 5/20 | 0.31 |
| ▸ | S1PR4 | O95977 | 5/20 | 0.31 |
| ▸ | S1PR1 | P21453 | 5/20 | 0.31 |
| ▸ | S1PR3 | Q99500 | 5/20 | 0.31 |
| ▸ | S1PR5 | Q9H228 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1777209 | 0.98 | ALDH1A1 (0.39) | ALDH1A1TSHRCYP2C19CYP1A2MEN1 | |
| SCHEMBL28992758 | 0.98 | ALDH1A1 (0.39) | ALDH1A1TSHRCYP2C19CYP1A2MEN1 | |
| SCHEMBL28992785 | 0.98 | ALDH1A1 (0.39) | ALDH1A1TSHRCYP2C19CYP1A2MEN1 | |
| SCHEMBL57190 | 0.95 | CYP2C19 (0.38) | ALDH1A1TSHRCYP2C19CYP1A2MEN1 | |
| SCHEMBL28408651 | 0.94 | ALDH1A1 (0.52) | ALDH1A1TSHRCYP2C19CYP1A2S1PR2 | |
| SCHEMBL28260458 | 0.94 | ALDH1A1 (0.52) | ALDH1A1TSHRCYP2C19CYP1A2S1PR2 | |
| SCHEMBL10602321 | 0.94 | ALDH1A1 (0.52) | ALDH1A1TSHRCYP2C19CYP1A2S1PR2 | |
| SCHEMBL5861436 | 0.94 | ALDH1A1 (0.52) | ALDH1A1TSHRCYP2C19CYP1A2S1PR2 | |
| SCHEMBL30023458 | 0.94 | ALDH1A1 (0.52) | ALDH1A1TSHRCYP2C19CYP1A2S1PR2 | |
| SCHEMBL4272110 | 0.94 | ALDH1A1 (0.52) | ALDH1A1TSHRCYP2C19CYP1A2S1PR2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 52 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114057961-B | Polymer double-chain/inorganic nanoparticle composite Janus material and preparation method thereof | 清华大学 | 2022-11-18 | — | — | CN | claimed |
| CN-114057961-A | Polymer double-chain/inorganic nanoparticle composite Janus material and preparation method thereof | 清华大学 | 2022-02-18 | — | — | CN | claimed |
| EP-4692263-A1 | THERMALLY EXPANDABLE REFRACTORY MATERIAL COMPOSITION, THERMALLY EXPANDABLE REFRACTORY MATERIAL, AND METHOD FOR PRODUCING THERMALLY EXPANDABLE REFRACTORY MATERIAL | Sekisui Chemical Co., Ltd. (JP) | 2026-02-11 | — | — | EP | disclosed |
| EP-4660275-A1 | CURABLE HEAT-CONDUCTIVE ADHESIVE AGENT | Sekisui Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| EP-4660272-A1 | CURABLE THERMALLY CONDUCTIVE ADHESIVE, THERMALLY CONDUCTIVE MEMBER, AND BATTERY ASSEMBLY | Sekisui Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| US-20250361378-A1 | CURABLE COMPOSITION FOR SEALING MATERIAL, AND PANEL STRUCTURE USING SAID CURABLE COMPOSITION | SEKISUI FULLER COMPANY, LTD. (JP) | 2025-11-27 | — | — | US | disclosed |
| EP-4596637-A1 | RESIN COMPOSITION | SEKISUI CHEMICAL CO., LTD. (JP) | 2025-08-06 | — | — | EP | disclosed |
| WO-2025089072-A1 | POLYACETAL RESIN COMPOSITION | ポリプラスチックス株式会社 | 2025-05-01 | — | — | WO | disclosed |
| WO-2025089071-A1 | POLYACETAL RESIN COMPOSITION | ポリプラスチックス株式会社 | 2025-05-01 | — | — | WO | disclosed |
| EP-4541829-A1 | CURABLE COMPOSITION FOR SEALING MATERIAL, AND PANEL STRUCTURE USING SAID CURABLE COMPOSITION | Sekisui Fuller Company, Ltd. (JP) | 2025-04-23 | — | — | EP | disclosed |
| CN-118055976-B | Polyacetal resin composition | 宝理塑料株式会社 | 2025-04-11 | — | — | CN | disclosed |
| US-9695346-B2 | Adhesive for floor structure | SEKISUI FULLER COMPANY, LTD. (JP) | 2017-07-04 | — | — | US | disclosed |
| US-9422419-B2 | Surface-treated calcium carbonate filler, and curable resin composition containing the filler | MARUO CALCIUM CO., LTD. (JP) | 2016-08-23 | — | — | US | disclosed |
| US-20150337184-A1 | ADHESIVE FOR FLOOR STRUCTURE | SEKISUI FULLER COMPANY, LTD. (JP) | 2015-11-26 | — | — | US | disclosed |
| US-20150112009-A1 | SURFACE-TREATED CALCIUM CARBONATE FILLER, AND CURABLE RESIN COMPOSITION CONTAINING THE FILLER | MARUO CALCIUM CO., LTD. (JP) | 2015-04-23 | — | — | US | disclosed |
| EP-2848654-A1 | SURFACE-TREATED CALCIUM CARBONATE FILLER, AND CURABLE RESIN COMPOSITION CONTAINING SAID FILLER | Maruo Calcium Co., Ltd. (JP) | 2015-03-18 | — | — | EP | disclosed |
| EP-1457527-B1 | CURABLE COMPOSITION, SEALING MATERIAL, AND ADHESIVE | SEKISUI CHEMICAL CO LTD (JP) | 2013-03-27 | — | — | EP | disclosed |
| US-7135518-B2 | Curable compositions, sealing material, and adhesive | SEKISUI CHEMICAL CO., LTD. (JP) | 2006-11-14 | — | — | US | disclosed |
| US-20050261412-A1 | Curable compositions, sealing material, and adhesive | SEKISUI CHEMICAL CO., LTD. (JP) | 2005-11-24 | — | — | US | disclosed |
| EP-1457527-A1 | CURABLE COMPOSITIONS, SEALING MATERIAL, AND ADHESIVE | SEKISUI CHEMICAL CO., LTD. (JP) | 2004-09-15 | — | — | EP | disclosed |