SCHEMBL5858715

SCHEMBL5858715

C=CCN(CCC[Si](C)(OC)OC)CC1CO1

nearest known ligand 0.30

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL139159 0.89 ALDH1A1 (0.30) ALDH1A1
SCHEMBL612441 0.86
SCHEMBL1393421 0.86
SCHEMBL9776546 0.82
SCHEMBL5696329 0.81
SCHEMBL5685331 0.78 ALDH1A1 (0.30) ALDH1A1
SCHEMBL29214425 0.76 ALDH1A1 (0.43) ALDH1A1
SCHEMBL9776558 0.76
SCHEMBL8405711 0.76
SCHEMBL458282 0.74 ALDH1A1 (0.40) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023136227-A1 THIXOTROPIC SILICONE GEL COMPOSITION, SILICONE GEL CURED PRODUCT, AND ELECTRICAL/ELECTRONIC COMPONENTS 信越化学工業株式会社 2023-07-20 WO disclosed
US-7135518-B2 Curable compositions, sealing material, and adhesive SEKISUI CHEMICAL CO., LTD. (JP) 2006-11-14 US disclosed
US-20050261412-A1 Curable compositions, sealing material, and adhesive SEKISUI CHEMICAL CO., LTD. (JP) 2005-11-24 US disclosed
EP-1457527-A1 CURABLE COMPOSITIONS, SEALING MATERIAL, AND ADHESIVE SEKISUI CHEMICAL CO., LTD. (JP) 2004-09-15 EP disclosed