SCHEMBL5867345

SCHEMBL5867345

F[Si](F)(F)I

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL42198 0.61
Hydrochloric Acid SCHEMBL10797371 0.55
SCHEMBL10388078 0.55
Barium SCHEMBL1411263 0.55
Iodide SCHEMBL25254362 0.55
Ammonia Solution, Strong SCHEMBL25422092 0.55
Fluoride SCHEMBL7699537 0.55
SCHEMBL21058052 0.55
SCHEMBL20768009 0.55
SCHEMBL3861056 0.55

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7030260-B2 Preparation of mixed-halogen halo-silanes HONEYWELL INTERNATIONAL INC. (US) 2006-04-18 US claimed
CN-1646425-A Process for preparing mixed halogen halosilanes HONEYWELL INT INC (US) 2005-07-27 CN claimed
EP-1480909-A2 PREPARATION OF MIXED-HALOGEN HALO-SILANES Honeywell International Inc. (US) 2004-12-01 EP claimed
US-20040019231-A1 Preparation of mixed-halogen halo-silanes HONEYWELL INTERNATIONAL INC. 2004-01-29 US claimed
WO-2003072502-A2 PREPARATION OF MIXED-HALOGEN HALO-SILANES HONEYWELL INTERNATIONAL INC. (US) 2003-09-04 WO claimed
CN-122054927-A High conductivity passivation layer and method of forming the same during high aspect ratio plasma etching 乔治洛德方法研究和开发液化空气有限公司 2026-05-15 CN disclosed
US-20250379062-A1 SIDEWALL PASSIVATION LAYERS AND METHOD OF FORMING THE SAME DURING HIGH ASPECT RATIO PLASMA ETCHING LAIR LIQUIDE SA POUR IETUDE ET IEPLOITATION DES PROCEDES GEORGES CLAUDE (FR) 2025-12-11 US disclosed
US-12341017-B2 Etching methods with alternating non-plasma and plasma etching processes AMERICAN AIR LIQUIDE, INC. (US) 2025-06-24 US disclosed
US-20250046618-A1 HIGH CONDUCTIVE PASSIVATION LAYERS AND METHOD OF FORMING THE SAME DURING HIGH ASPECT RATIO PLASMA ETCHING AMERICAN AIR LIQUIDE, INC. 2025-02-06 US disclosed
CN-119343753-A Sidewall passivation layer and method of forming the same during high aspect ratio plasma etching 乔治洛德方法研究和开发液化空气有限公司 2025-01-21 CN disclosed
US-12106971-B2 High conductive passivation layers and method of forming the same during high aspect ratio plasma etching AMERICAN AIR LIQUIDE, INC. (US) 2024-10-01 US disclosed
US-20240162042-A1 ETCHING METHODS WITH ALTERNATING NON-PLASMA AND PLASMA ETCHING PROCESSES AMERICAN AIR LIQUIDE, INC. 2024-05-16 US disclosed
WO-2003072502-A2 PREPARATION OF MIXED-HALOGEN HALO-SILANES HONEYWELL INTERNATIONAL INC. (US) 2003-09-04 WO disclosed
US-6054542-A USING COORDINATION CATALYSTS MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 2000-04-25 US disclosed
EP-0669347-B1 Ethylene polymer, and process for preparing the same MITSUI PETROCHEMICAL IND (JP) 1998-05-06 EP disclosed
EP-0668296-B1 Ethylene polymer and process for preparing the same MITSUI PETROCHEMICAL IND (JP) 1998-05-06 EP disclosed
US-5731393-A Ethylene polymer, process for preparing the same, solid titanium catalyst component for ethylene polymerization and ethylene polymerization catalyst MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1998-03-24 US disclosed
EP-0669347-A1 Ethylene polymer, process for preparing the same, solid titanium catalyst component for ethylene polymerization and ethylene polymerization catalyst MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1995-08-30 EP disclosed
EP-0668296-A1 Ethylene polymer and process for preparing the same MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1995-08-23 EP disclosed
US-4229558-A HAVING HIGH ISOTACTIC INDEX BY USING A CATALYST PREPARED FROM A MAGNESIUM GRIGNARD REAGENT, TITANIUM HALIDE AN ETHER AND A CARBOXYLIC ESTER COMBINED WITH AN ORGANOALUMINUM COMPOUND MITSUBISHI CHEMICAL INDUSTRIES LIMITED (JP) 1980-10-21 US disclosed