SCHEMBL5877574

SCHEMBL5877574

[Al+3].[GeH2-].[GeH2-].[GeH2-]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18497269 0.71
SCHEMBL29435316 0.71
SCHEMBL29376395 0.71
SCHEMBL59560 0.71
SCHEMBL9074915 0.71
SCHEMBL29350913 0.71
SCHEMBL29732782 0.71
SCHEMBL7546178 0.71
SCHEMBL1136 0.71
SCHEMBL3986820 0.50

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116018058-A Resistive random access memory and preparation method thereof 昕原半导体(上海)有限公司 2023-04-25 CN disclosed
WO-2023279543-A1 SEMICONDUCTOR STRUCTURE AND PREPARATION METHOD THEREFOR 长鑫存储技术有限公司 2023-01-12 WO disclosed
US-7087102-B2 Process for purification of germane AIR PRODUCTS AND CHEMICALS, INC. (US) 2006-08-08 US disclosed
US-20050191854-A1 Process for purification of germane VERSUM MATERIALS US, LLC 2005-09-01 US disclosed
US-6200895-B1 FORMATION OF CONTACTS WITH REFRACTORY METAL AND/OR REFRACTORY METAL NITRIDE LINERS THAT ASSIST IN FILLING THE CONTACTS; CONTACTS ARE INITIALLY LINED WITH A TITANIUM LAYER AND TITANIUM NITRIDE LAYER; HIGH ASPECT RATIO MICRON TECHNOLOGY, INC. 2001-03-13 US disclosed
US-6091148-A Electrical connection for a semiconductor structure MICRON TECHNOLOGY INC (US) 2000-07-18 US disclosed
US-4861623-A Method for forming deposited film by generating precursor with halogenic oxidizing agent CANON KABUSHIKI KAISHA (JP) 1989-08-29 US disclosed