SCHEMBL588311

SCHEMBL588311

NC(=S)SCC(F)(F)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6153994 0.97 CYP1A2 (0.34)
SCHEMBL11392603 0.77 CYP1A2 (0.39)
SCHEMBL19806119 0.72
SCHEMBL9336198 0.69
SCHEMBL28647066 0.69 CYP1A2 (0.33)
SCHEMBL694158 0.65
SCHEMBL703179 0.65 CYP1A2 (0.57)
SCHEMBL8654641 0.65 ALDH1A1 (0.35)
SCHEMBL775544 0.65
SCHEMBL4197495 0.63 CYP1A2 (0.55)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8114220-B2 Co-solvent, chelating agent, optionally ion pairing reagent, and optionally surfactant, dense fluid; effectively removes photoresist and/or post-etch residue material from microelectronic device without substantially over-etching underlying silicon-containing layers and metallic interconnect material ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2012-02-14 US claimed
US-20080269096-A1 Formulations for Cleaning Ion-Implanted Photoresist Layers from Microelectronic Devices Advance Technology Materials, Inc. (US) 2008-10-30 US claimed
EP-1879704-A2 FORMULATIONS FOR CLEANING ION-IMPLANTED PHOTORESIST LAYERS FROM MICROELECTRONIC DEVICES ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2008-01-23 EP claimed
WO-2006113621-A2 FORMULATIONS FOR CLEANING ION-IMPLANTED PHOTORESIST LAYERS FROM MICROELECTRONIC DEVICES ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2006-10-26 WO claimed
CN-107112061-A Separation of targeting binding 泰拉能源公司 2017-08-29 CN disclosed
CN-107112054-A nuclear material processing 泰拉能源公司 2017-08-29 CN disclosed
US-8114220-B2 Co-solvent, chelating agent, optionally ion pairing reagent, and optionally surfactant, dense fluid; effectively removes photoresist and/or post-etch residue material from microelectronic device without substantially over-etching underlying silicon-containing layers and metallic interconnect material ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2012-02-14 US disclosed
US-20080269096-A1 Formulations for Cleaning Ion-Implanted Photoresist Layers from Microelectronic Devices Advance Technology Materials, Inc. (US) 2008-10-30 US disclosed
EP-1879704-A2 FORMULATIONS FOR CLEANING ION-IMPLANTED PHOTORESIST LAYERS FROM MICROELECTRONIC DEVICES ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2008-01-23 EP disclosed
WO-2006113621-A2 FORMULATIONS FOR CLEANING ION-IMPLANTED PHOTORESIST LAYERS FROM MICROELECTRONIC DEVICES ADVANCED TECHNOLOGY MATERIALS, INC. (US) 2006-10-26 WO disclosed
US-6638749-B1 Fluoroether sulfate, fluoroether- polyethylene glycol block copolymer, fluoroether sorbitol or fluoroether dithicarbamate chelate; solubilizes proteins, peptides and amino acids GENENCOR INTERNATIONAL, INC. 2003-10-28 US disclosed
US-6562605-B1 Extraction of water soluble biopolymers from a fluid; form carbon dioxide/surfactant mixture, mix with water soluble biopolymer, recover biopolymer from mixture GENENCOR INTERNATIONAL, INC. 2003-05-13 US disclosed
WO-1997018234-A2 EXTRACTION OF PROTEINS INTO CARBON DIOXIDE GENENCOR INTERNATIONAL, INC. (US) 1997-05-22 WO disclosed