Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.50 |
| ▸ | HSD17B10 | Q99714 | 5/20 | 0.50 |
| ▸ | HIF1A | Q16665 | 3/20 | 0.50 |
| ▸ | HPGD | P15428 | 3/20 | 0.50 |
| ▸ | CYP1A2 | P05177 | 3/20 | 0.50 |
| ▸ | CYP1B1 | Q16678 | 1/20 | 0.50 |
| ▸ | THRB | P10828 | 1/20 | 0.50 |
| ▸ | TSHR | P16473 | 3/20 | 0.45 |
| ▸ | CYP2A6 | P11509 | 3/20 | 0.45 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.45 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.44 |
| ▸ | CASP1 | P29466 | 2/20 | 0.44 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.44 |
| ▸ | ERBB2 | P04626 | 1/20 | 0.44 |
| ▸ | FYN | P06241 | 1/20 | 0.44 |
| ▸ | MAOA | P21397 | 1/20 | 0.44 |
| ▸ | ACHE | P22303 | 1/20 | 0.44 |
| ▸ | AHR | P35869 | 1/20 | 0.44 |
| ▸ | NQO1 | P15559 | 1/20 | 0.42 |
| ▸ | HPRT1 | P00492 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3745734 | 0.95 | CYP1A2 (0.46) | ALDH1A1HSD17B10HIF1AHPGDCYP1A2 | |
| SCHEMBL5887696 | 0.95 | CYP1A2 (0.46) | ALDH1A1HSD17B10HIF1AHPGDCYP1A2 | |
| SCHEMBL4849377 | 0.92 | ALDH1A1 (0.55) | ALDH1A1HSD17B10HIF1AHPGDCYP1A2 | |
| SCHEMBL4846672 | 0.89 | HSD17B10 (0.52) | ALDH1A1HSD17B10HIF1AHPGDCYP1A2 | |
| SCHEMBL14353464 | 0.88 | ALDH1A1 (0.57) | ALDH1A1HSD17B10HIF1AHPGDCYP1A2 | |
| SCHEMBL4854639 | 0.87 | ALDH1A1 (0.56) | ALDH1A1HSD17B10HIF1AHPGDCYP1A2 | |
| SCHEMBL31756887 | 0.87 | ALDH1A1 (0.56) | ALDH1A1HSD17B10HIF1AHPGDCYP1A2 | |
| SCHEMBL4847351 | 0.87 | ALDH1A1 (0.56) | ALDH1A1HSD17B10HIF1AHPGDCYP1A2 | |
| SCHEMBL3932268 | 0.86 | CYP1A2 (0.48) | ALDH1A1HSD17B10HIF1AHPGDCYP1A2 | |
| SCHEMBL5471594 | 0.86 | ALDH1A1 (0.55) | ALDH1A1HSD17B10HIF1AHPGDCYP1A2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240213072-A1 | LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING PROCESSED SEMICONDUCTOR SUBSTRATE | NISSAN CHEMICAL CORPORATION (JP) | 2024-06-27 | — | — | US | disclosed |
| US-20240199918-A1 | ADHESIVE COMPOSITION, LAMINATE, METHOD OF MANUFACTURING LAMINATE, AND METHOD OF MANUFACTURING PROCESSED SUBSTRATE | NISSAN CHEMICAL CORPORATION (JP) | 2024-06-20 | — | — | US | disclosed |
| EP-4317339-A1 | ADHESIVE COMPOSITION, LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING PROCESSED SUBSTRATE | Nissan Chemical Corporation (JP) | 2024-02-07 | — | — | EP | disclosed |
| EP-4309893-A1 | LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE | Nissan Chemical Corporation (JP) | 2024-01-24 | — | — | EP | disclosed |
| EP-4310157-A1 | LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING MACHINED SEMICONDUCTOR SUBSTRATE | Nissan Chemical Corporation (JP) | 2024-01-24 | — | — | EP | disclosed |
| WO-2023074324-A1 | LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING PROCESSED SEMICONDUCTOR SUBSTRATE | 日産化学株式会社 | 2023-05-04 | — | — | WO | disclosed |
| EP-2868726-B1 | Ephemeral bonding | ROHM & HAAS ELECT MAT (US) | 2019-02-20 | — | — | EP | disclosed |
| EP-2933301-B1 | ADHESION PROMOTER | ROHM & HAAS ELECT MAT (US) | 2018-04-25 | — | — | EP | disclosed |
| US-9909040-B2 | Ephemeral bonding | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2018-03-06 | — | — | US | disclosed |
| US-9818636-B2 | Ephemeral bonding | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2017-11-14 | — | — | US | disclosed |
| US-20140120242-A1 | ADHESION PROMOTER | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2014-05-01 | — | — | US | disclosed |
| EP-2725605-A2 | Temporary wafer bonding | Rohm and Haas Electronic Materials LLC (US) | 2014-04-30 | — | — | EP | disclosed |
| US-6998148-B1 | Porous materials | SHIPLEY COMPANY, L.L.C. (US) | 2006-02-14 | — | — | US | disclosed |
| US-20050255710-A1 | Porous materials | SHIPLEY COMPANY, L.L.C. (US) | 2005-11-17 | — | — | US | disclosed |
| US-6399666-B1 | FOR MICROCIRCUIT; DECOMPOSABLE POLYMER AND DIELECTRIC | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2002-06-04 | — | — | US | disclosed |
| EP-0854849-B1 | ETHYNYL SUBSTITUTED AROMATIC COMPOUNDS, SYNTHESIS, POLYMERS AND USES THEREOF | DOW CHEMICAL CO (US) | 2001-10-31 | — | — | EP | disclosed |
| US-6121495-A | Ethynyl substituted aromatic compounds, synthesis, polymers and uses thereof | THE DOW CHEMICAL COMPANY (US) | 2000-09-19 | — | — | US | disclosed |
| US-6093636-A | FORMING ON A SUBSTRATE A DIELECTRIC LAYER COMPRISING DECOMPOSABLE POLYMER AND THERMOSETTING RESIN; HEATING TO CURE THE THERMOSETTING RESIN; DECOMPOSING THE DECOMPOSABLE POLYMER; LITOGRAPHIC PATTERNING; DEPOSITING A METALLIC FILM | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2000-07-25 | — | — | US | disclosed |
| EP-0854849-A1 | ETHYNYL SUBSTITUTED AROMATIC COMPOUNDS, SYNTHESIS, POLYMERS AND USES THEREOF | THE DOW CHEMICAL COMPANY (US) | 1998-07-29 | — | — | EP | disclosed |
| WO-1997010193-A1 | ETHYNYL SUBSTITUTED AROMATIC COMPOUNDS, SYNTHESIS, POLYMERS AND USES THEREOF | THE DOW CHEMICAL COMPANY (US) | 1997-03-20 | — | — | WO | disclosed |