SCHEMBL589034

SCHEMBL589034

C=C=CC(C)CCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1173840 0.85
SCHEMBL1173651 0.81 ADH1B (0.39)
SCHEMBL27429562 0.81 ADH1B (0.39)
SCHEMBL789474 0.80
SCHEMBL28806452 0.78
SCHEMBL27901435 0.77
SCHEMBL27946488 0.77
SCHEMBL28223039 0.73
SCHEMBL11425936 0.73
SCHEMBL27489464 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 132 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11597818-B2 Molded article FURUKAWA ELECTRIC CO., LTD. (JP) 2023-03-07 US disclosed
EP-3438186-B1 THERMOPLASTIC RESIN COMPOSITION, THERMOPLASTIC RESIN COMPOSITION PRODUCTION METHOD, CELLULOSE-REINFORCED RESIN MOLDED PRODUCT, AND CELLULOSE-REINFORCED RESIN MOLDED PRODUCT MANUFACTURING METHOD FURUKAWA ELECTRIC CO LTD (JP) 2023-02-22 EP disclosed
US-11530316-B2 2022-12-20 US disclosed
CN-108351458-B Optical film, polarizing plate and image display device 柯尼卡美能达株式会社 2021-05-25 CN disclosed
EP-3689974-A1 MOLDED ARTICLE Furukawa Electric Co., Ltd. (JP) 2020-08-05 EP disclosed
US-20200224008-A1 MOLDED ARTICLE FURUKAWA ELECTRIC CO., LTD. (JP) 2020-07-16 US disclosed
CN-111148798-A Molded article 古河电气工业株式会社 2020-05-12 CN disclosed
EP-3438186-A1 THERMOPLASTIC RESIN COMPOSITION, THERMOPLASTIC RESIN COMPOSITION PRODUCTION METHOD, CELLULOSE-REINFORCED RESIN MOLDED PRODUCT, AND CELLULOSE-REINFORCED RESIN MOLDED PRODUCT MANUFACTURING METHOD Furukawa Electric Co., Ltd. (JP) 2019-02-06 EP disclosed
US-20190023877-A1 THERMOPLASTIC RESIN COMPOSITION, METHOD OF PRODUCING THERMOPLASTIC RESIN COMPOSITION, MOLDED ARTICLE OF CELLULOSE-REINFORCED RESIN, AND METHOD OF PRODUCING MOLDED ARTICLE OF CELLULOSE-REINFORCED RESIN FURUKAWA ELECTRIC CO., LTD. (JP) 2019-01-24 US disclosed
EP-2338939-B1 CONDUCTIVE POLYMER SOLUTION, CONDUCTIVE COATING FILM AND INPUT DEVICE SHINETSU POLYMER CO (JP) 2019-01-16 EP disclosed
US-4916050-A GOOD COLOR REPRODUCIBILITY KONICA CORPORATION (JP) 1990-04-10 US disclosed
US-4898943-A Tricyclic triazolopyrimidine derivatives DAIICHI SEIYAKU CO., LTD. (JP) 1990-02-06 US disclosed
EP-0293190-A2 Silver halide light-sensitive photographic material KONICA CORPORATION (JP) 1988-11-30 EP disclosed
EP-0279298-A1 Tricyclic triazolopyrimidine derivatives DAIICHI SEIYAKU CO., LTD. (JP) 1988-08-24 EP disclosed
US-4606933-A Acrylate-functional organopolysiloxanes SWS SILICONES CORPORATION (US) 1986-08-19 US disclosed
US-4366277-A STABILIZERS FOR POLYMERS; PHOTOSTABILITY; HEAT RESISTANCE CARSTAB CORPORATION (US) 1982-12-28 US disclosed
US-4356279-A HEAT AND LIGHT STABILIZERS CARSTAB CORPORATION (US) 1982-10-26 US disclosed
EP-0033663-A1 2,2,6,6-Tetramethyl-4-piperidyl - substituted heterocyclic ring compounds, a method for their preparation and polymers containing the same CARSTAB CORPORATION (US) 1981-08-12 EP disclosed
US-4192892-A MANDELIC ACID AMIDE DERIVATIVES SWEDEM AB (SE) 1980-03-11 US disclosed
US-4183931-A SEDATIVE-HYPNOTICS, ANTICONVULSANTS, CENTRAL NERVOUS SYSTEM DEPRESSANTS RESEARCH CORPORATION (US) 1980-01-15 US disclosed