Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 10/20 | 0.55 |
| ▸ | CA2 | P00918 | 10/20 | 0.55 |
| ▸ | CA9 | Q16790 | 8/20 | 0.55 |
| ▸ | CA12 | O43570 | 3/20 | 0.55 |
| ▸ | CA7 | P43166 | 3/20 | 0.55 |
| ▸ | CA14 | Q9ULX7 | 3/20 | 0.55 |
| ▸ | CA3 | P07451 | 2/20 | 0.55 |
| ▸ | CA4 | P22748 | 2/20 | 0.55 |
| ▸ | CA6 | P23280 | 2/20 | 0.55 |
| ▸ | CA5A | P35218 | 2/20 | 0.55 |
| ▸ | CA5B | Q9Y2D0 | 2/20 | 0.55 |
| ▸ | RECQL | P46063 | 2/20 | 0.53 |
| ▸ | GLA | P06280 | 1/20 | 0.53 |
| ▸ | HPGD | P15428 | 1/20 | 0.53 |
| ▸ | TSHR | P16473 | 1/20 | 0.53 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.53 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.53 |
| ▸ | BLM | P54132 | 1/20 | 0.53 |
| ▸ | CES2 | O00748 | 1/20 | 0.44 |
| ▸ | RAD52 | P43351 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Tetramethylammonium Ion SCHEMBL27493542 | 1.00 | CA1 (0.55) | CA1CA2CA9CA12CA7 | |
| Hydrogen Sulfide SCHEMBL27676602 | 0.96 | CA1 (0.59) | CA1CA2CA9CA12CA7 | |
| Hydrogen Sulfide SCHEMBL27676601 | 0.96 | CA1 (0.59) | CA1CA2CA9CA12CA7 | |
| Hydrogen Sulfide SCHEMBL1900178 | 0.96 | CA1 (0.59) | CA1CA2CA9CA12CA7 | |
| Hydrogen Sulfide SCHEMBL379099 | 0.94 | CA1 (0.57) | CA1CA2CA9CA12CA7 | |
| SCHEMBL4904743 | 0.94 | CA1 (0.61) | CA1CA2CA9CA12CA7 | |
| Octadecyl Sulfate SCHEMBL146302 | 0.94 | CA1 (0.61) | CA1CA2CA9CA12CA7 | |
| SCHEMBL9018754 | 0.94 | CA1 (0.61) | CA1CA2CA9CA12CA7 | |
| SCHEMBL10583495 | 0.94 | CA1 (0.61) | CA1CA2CA9CA12CA7 | |
| SCHEMBL22283885 | 0.94 | CA1 (0.61) | CA1CA2CA9CA12CA7 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8114220-B2 | Co-solvent, chelating agent, optionally ion pairing reagent, and optionally surfactant, dense fluid; effectively removes photoresist and/or post-etch residue material from microelectronic device without substantially over-etching underlying silicon-containing layers and metallic interconnect material | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2012-02-14 | — | — | US | claimed |
| US-20080269096-A1 | Formulations for Cleaning Ion-Implanted Photoresist Layers from Microelectronic Devices | Advance Technology Materials, Inc. (US) | 2008-10-30 | — | — | US | claimed |
| EP-1879704-A2 | FORMULATIONS FOR CLEANING ION-IMPLANTED PHOTORESIST LAYERS FROM MICROELECTRONIC DEVICES | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2008-01-23 | — | — | EP | claimed |
| WO-2006113621-A2 | FORMULATIONS FOR CLEANING ION-IMPLANTED PHOTORESIST LAYERS FROM MICROELECTRONIC DEVICES | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2006-10-26 | — | — | WO | claimed |
| US-8114220-B2 | Co-solvent, chelating agent, optionally ion pairing reagent, and optionally surfactant, dense fluid; effectively removes photoresist and/or post-etch residue material from microelectronic device without substantially over-etching underlying silicon-containing layers and metallic interconnect material | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2012-02-14 | — | — | US | disclosed |
| US-20080269096-A1 | Formulations for Cleaning Ion-Implanted Photoresist Layers from Microelectronic Devices | Advance Technology Materials, Inc. (US) | 2008-10-30 | — | — | US | disclosed |
| EP-1879704-A2 | FORMULATIONS FOR CLEANING ION-IMPLANTED PHOTORESIST LAYERS FROM MICROELECTRONIC DEVICES | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2008-01-23 | — | — | EP | disclosed |
| WO-2006113621-A2 | FORMULATIONS FOR CLEANING ION-IMPLANTED PHOTORESIST LAYERS FROM MICROELECTRONIC DEVICES | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2006-10-26 | — | — | WO | disclosed |