SCHEMBL5943138

SCHEMBL5943138

C1OCOCO1.SCCCS

nearest known ligand 0.46

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
▸ TSHR P16473 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15401042 0.84 TSHR (0.55) TSHR
SCHEMBL25497 0.73 — —
SCHEMBL5943132 0.69 ALDH1A1 (0.50) —
SCHEMBL625427 0.69 — —
SCHEMBL7524999 0.69 — —
SCHEMBL6015190 0.68 TSHR (1.00) TSHR
SCHEMBL22490 0.68 — —
SCHEMBL5944923 0.68 TSHR (1.00) TSHR
SCHEMBL1707290 0.68 — —
SCHEMBL5789839 0.68 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105566878-B High-fire resistance polymerized thylene carbonate hydrocarbon ester resin composition SK新技术株式会社 2019-07-19 — — CN claimed
US-9969878-B2 Polyalkylene carbonate resin composition having high thermal stability SK INNOVATION CO., LTD. (KR) 2018-05-15 — — US claimed
US-9777153-B2 Polyalkylene carbonate resin composition having an interpenetrating crosslinked structure SK INNOVATION CO., LTD. (KR) 2017-10-03 — — US claimed
EP-2845878-B1 POLYALKYLENE CARBONATE RESIN COMPOSITION HAVING AN INTERPENETRATING CROSSLINKED STRUCTURE SK INNOVATION CO LTD (KR) 2017-07-12 — — EP claimed
CN-105566878-A Polyalkylene Carbonate Resin Composition Having High Thermal Stability SK INNOVATION CO LTD 2016-05-11 — — CN claimed
US-20160122535-A1 Polyalkylene Carbonate Resin Composition Having High Thermal Stability SK INNOVATION CO, LTD. (KR) 2016-05-05 — — US claimed
US-20150099829-A1 Polyalkylene Carbonate Resin Composition Having an Interpenetrating Crosslinked Structure SK INNOVATION CO, LTD. (KR) 2015-04-09 — — US claimed
EP-2845878-A2 POLYALKYLENE CARBONATE RESIN COMPOSITION HAVING AN INTERPENETRATING CROSSLINKED STRUCTURE SK Innovation Co., Ltd. (KR) 2015-03-11 — — EP claimed
CN-101533788-B Electric element having light-transmitting portion, method for sealing electric element, and thermosetting resin composition for sealing electric element DONGJIN SEMICHEM CO LTD 2013-08-07 — — CN claimed
CN-101533788-A Electrical element having transparent portion and a sealing method of the same and thermosetting resin composition for sealing DONGJIN SEMICHEM CO LTD (KR) 2009-09-16 — — CN claimed
US-10894861-B2 High molecular weight polymers from waste raw materials REPSOL, S.A. (ES) 2021-01-19 — — US disclosed
US-20190315915-A1 NEW HIGH MOLECULAR WEIGHT POLYMERS FROM WASTE RAW MATERIALS REPSOL, S.A. (ES) 2019-10-17 — — US disclosed
CN-106905550-B OLED encapsulation film and its manufacturing method and the encapsulation OLED method using the film 武汉市三选科技有限公司 2019-09-24 — — CN disclosed
CN-105566878-B High-fire resistance polymerized thylene carbonate hydrocarbon ester resin composition SK新技术株式会社 2019-07-19 — — CN disclosed
EP-3328915-B1 NEW HIGH MOLECULAR WEIGHT POLYMERS FROM WASTE RAW MATERIALS REPSOL SA (ES) 2019-04-24 — — EP disclosed
CN-102569674-A Encapsulation sheet, flat panel display device using the same, and method of manufacturing the flat panel display device SAMSUNG MOBILE DISPLAY CO LTD 2012-07-11 — — CN disclosed
US-20120161619-A1 ENCAPSULATION SHEET, FLAT PANEL DISPLAY DEVICE USING THE SAME, AND METHOD OF MANUFACTURING THE FLAT PANEL DISPLAY DEVICE SAMSUNG MOBILE DISPLAY CO., LTD. (KR) 2012-06-28 — — US disclosed
CN-101533788-A Electrical element having transparent portion and a sealing method of the same and thermosetting resin composition for sealing DONGJIN SEMICHEM CO LTD (KR) 2009-09-16 — — CN disclosed
CN-101120072-A Resin composition for sealing material, sealing material, sealing method and electroluminescent display MITSUI CHEMICALS INC (JP) 2008-02-06 — — CN disclosed
US-20060252325-A1 Protection product ICHIMURA SANGYO CO., LTD. (JP) 2006-11-09 — — US disclosed
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