SCHEMBL5946409

SCHEMBL5946409

CC(C)(C)C(Br)OP(=O)(OCCCCl)OCCCCl

nearest known ligand 0.38

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.38
CYP3A4 P08684 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29186287 0.97 ALDH1A1 (0.38) ALDH1A1CYP3A4
SCHEMBL5946365 0.89 ALDH1A1 (0.50) ALDH1A1
SCHEMBL29186286 0.86 ALDH1A1 (0.50) ALDH1A1
SCHEMBL2352826 0.74
SCHEMBL29353826 0.73 ALDH1A1 (0.41) ALDH1A1CYP3A4
SCHEMBL233122 0.72 ALDH1A1 (0.68) ALDH1A1CYP3A4
SCHEMBL11605278 0.72 ALDH1A1 (0.44) ALDH1A1CYP3A4
SCHEMBL31296073 0.69 ALDH1A1 (0.41) ALDH1A1CYP3A4
SCHEMBL17866159 0.68 ALDH1A1 (0.55) ALDH1A1CYP3A4
SCHEMBL8412147 0.68 ALDH1A1 (0.79) ALDH1A1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115210340-B Flame retardant composition for styrene resin foam, flame retardant styrene resin foam composition, and extrusion molded foam thereof 第一工业制药株式会社 2024-04-05 CN disclosed
US-20230089518-A1 FLAME RETARDANT COMPOSITION FOR FOAMED STYRENE RESIN, FLAME-RETARDANT FOAMED-STYRENE-BASED RESIN COMPOSITION, AND EXTRUDED FOAM MOLDED PRODUCT THEREOF DKS CO. LTD. (JP) 2023-03-23 US disclosed
US-20060035989-A1 Composition for flame-retardant flexible polyurethane foam DAIHACHI CHEMICAL INDUSTRY CO., LTD. (JP) 2006-02-16 US disclosed
EP-1559734-A1 COMPOSITION FOR FLAME-RETARDANT FLEXIBLE POLYURETHANE FOAM DAIHACHI CHEMICAL INDUSTRY CO., LTD. (JP) 2005-08-03 EP disclosed