SCHEMBL5950403

SCHEMBL5950403

CC(C)(O)c1ccc(C(C)(C)O)c(Cl)c1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.41
KMT2A Q03164 1/20 0.41
PDE2A O00408 3/20 0.41
HSD11B1 P28845 1/20 0.40
AR P10275 2/20 0.39
TSHR P16473 3/20 0.37
MAPK1 P28482 2/20 0.35
CYP3A4 P08684 1/20 0.35
TDP1 Q9NUW8 1/20 0.35
PGR P06401 1/20 0.35
CYP2C19 P33261 1/20 0.34
CASR P41180 2/20 0.33
GCK P35557 1/20 0.33
GCKR Q14397 1/20 0.33
PDE10A Q9Y233 1/20 0.33
TYK2 P29597 1/20 0.33
PRKAB2 O43741 1/20 0.33
PRKAG1 P54619 1/20 0.33
PRKAA2 P54646 1/20 0.33
PRKAA1 Q13131 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29732744 1.00 MEN1 (0.41) MEN1KMT2APDE2AHSD11B1AR
SCHEMBL10600692 0.82 TSHR (0.56) MEN1KMT2APDE2AHSD11B1AR
SCHEMBL9239974 0.80 TSHR (0.58) MEN1KMT2AHSD11B1TSHRMAPK1
SCHEMBL548369 0.79 MEN1 (0.36) MEN1KMT2AHSD11B1ARTSHR
SCHEMBL11699940 0.78 HSD17B10 (0.48) MEN1KMT2AHSD11B1ARTSHR
SCHEMBL1995699 0.78 CYP3A4 (0.45) MEN1KMT2APDE2AHSD11B1AR
SCHEMBL19708930 0.78 PDK1 (0.39) TSHRMAPK1CYP3A4TDP1PGR
SCHEMBL9272585 0.77 ESR1 (0.41) MEN1KMT2APDE2AARTSHR
SCHEMBL14307623 0.77 TSHR (0.46) MEN1KMT2APDE2AHSD11B1AR
SCHEMBL12264367 0.77 MEN1 (0.45) MEN1KMT2APDE2AHSD11B1AR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023089976-A1 CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED OBJECT DIC株式会社 2023-05-25 WO disclosed
US-20230159695-A1 CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT DIC CORPORATION (JP) 2023-05-25 US disclosed
WO-2023008079-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT DIC株式会社 2023-02-02 WO disclosed
US-7005216-B2 Photo mask RENESAS TECHNOLOGY CORP. (JP) 2006-02-28 US disclosed
US-6790564-B2 FOR USE IN PRODUCING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICES; EFFICIENCY RENESAS TECHNOLOGY CORPORATION (JP) 2004-09-14 US disclosed
US-20030129505-A1 Krypton fluoride laser lithography; photoresist pattern RENESAS ELECTRONICS CORPORATION (JP) 2003-07-10 US disclosed
US-20020086222-A1 Photomask and manufacturing method of an electronic device therewith RENESAS ELECTRONICS CORPORATION (JP) 2002-07-04 US disclosed
US-5399715-A Polyamino oligomers and polymaleimide compounds SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1995-03-21 US disclosed
EP-0577836-A1 POLYAMINO-OLIGOMER AND POLYMALEIMIDE COMPOUND SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1994-01-12 EP disclosed