Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NPC1 | O15118 | 1/20 | 0.45 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.45 |
| ▸ | GLA | P06280 | 1/20 | 0.44 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.44 |
| ▸ | HDAC3 | O15379 | 3/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.42 |
| ▸ | HDAC4 | P56524 | 2/20 | 0.42 |
| ▸ | HDAC1 | Q13547 | 2/20 | 0.42 |
| ▸ | HDAC2 | Q92769 | 2/20 | 0.42 |
| ▸ | HDAC8 | Q9BY41 | 2/20 | 0.42 |
| ▸ | HDAC6 | Q9UBN7 | 2/20 | 0.42 |
| ▸ | PLIN1 | O60240 | 2/20 | 0.42 |
| ▸ | LMNA | P02545 | 2/20 | 0.42 |
| ▸ | MAPT | P10636 | 2/20 | 0.42 |
| ▸ | RECQL | P46063 | 2/20 | 0.42 |
| ▸ | PLIN5 | Q00G26 | 2/20 | 0.42 |
| ▸ | ABHD5 | Q8WTS1 | 2/20 | 0.42 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.42 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.42 |
| ▸ | TNKS | O95271 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14473589 | 0.83 | APP (0.40) | NPC1L3MBTL1ALDH1A1LMNAMAPT | |
| SCHEMBL18622133 | 0.83 | TDP1 (0.52) | NPC1L3MBTL1GLATDP1HDAC3 | |
| SCHEMBL25879124 | 0.83 | TDP1 (0.52) | NPC1L3MBTL1GLATDP1HDAC3 | |
| SCHEMBL20696 | 0.83 | TDP1 (0.52) | NPC1L3MBTL1GLATDP1HDAC3 | |
| SCHEMBL21771052 | 0.79 | GLA (0.48) | NPC1L3MBTL1GLATDP1HDAC3 | |
| SCHEMBL18968247 | 0.76 | — | — | |
| SCHEMBL19872825 | 0.72 | GLA (0.42) | NPC1L3MBTL1GLATDP1HDAC3 | |
| SCHEMBL14620624 | 0.72 | NPC1 (0.46) | NPC1L3MBTL1GLATDP1HDAC3 | |
| SCHEMBL3799708 | 0.71 | GLA (0.53) | NPC1L3MBTL1GLATDP1HDAC3 | |
| SCHEMBL19221392 | 0.71 | GLA (0.44) | NPC1L3MBTL1GLATDP1HDAC3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20220168948-A1 | METHOD FOR SELECTIVE LASER SINTERING, USING THERMOPLASTIC POLYMER POWDERS | INEOS STYROLUTION GROUP GMBH (DE) | 2022-06-02 | — | — | US | disclosed |
| US-20220033593-A1 | THERMOPLASTIC POLYMER POWDERS AND USE THEREOF FOR SELECTIVE LASER SINTERING | INEOS STYROLUTION GROUP GMBH (DE) | 2022-02-03 | — | — | US | disclosed |
| EP-3853303-A1 | THERMOPLASTIC POLYMER POWDERS AND USE THEREOF FOR SELECTIVE LASER SINTERING | INEOS Styrolution Group GmbH (DE) | 2021-07-28 | — | — | EP | disclosed |
| EP-3853008-A1 | METHOD FOR SELECTIVE LASER SINTERING, USING THERMOPLASTIC POLYMER POWDERS | INEOS Styrolution Group GmbH (DE) | 2021-07-28 | — | — | EP | disclosed |
| WO-2020058312-A1 | THERMOPLASTIC POLYMER POWDERS AND USE THEREOF FOR SELECTIVE LASER SINTERING | INEOS STYROLUTION GROUP GMBH (DE) | 2020-03-26 | — | — | WO | disclosed |
| WO-2020058313-A1 | METHOD FOR SELECTIVE LASER SINTERING, USING THERMOPLASTIC POLYMER POWDERS | INEOS STYROLUTION GROUP GMBH (DE) | 2020-03-26 | — | — | WO | disclosed |
| US-8399338-B2 | Electronic component manufacturing method | DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 2013-03-19 | — | — | US | disclosed |
| US-8114759-B2 | Dicing method using a die attach film on an adhesive sheet | DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 2012-02-14 | — | — | US | disclosed |
| US-20110223743-A1 | ELECTRONIC COMPONENT MANUFACTURING METHOD | DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 2011-09-15 | — | — | US | disclosed |
| US-7943235-B2 | Adhesive sheet for processing semiconductor substrates | NITTO DENKO CORPORATION (JP) | 2011-05-17 | — | — | US | disclosed |
| US-20100028662-A1 | ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR SUBSTRATES | NITTO DENKO CORPORATION (JP) | 2010-02-04 | — | — | US | disclosed |
| EP-2100934-A1 | PRESSURE SENSITIVE ADHESIVE SHEET FOR SEMICONDUCTOR SUBSTRATE PROCESSING | Nitto Denko Corporation (JP) | 2009-09-16 | — | — | EP | disclosed |
| EP-1304218-B1 | PLASTIC FILM FOR MEDICAL LIQUID CONTAINER | FUJIMORI KOGYO CO LTD (JP) | 2009-08-05 | — | — | EP | disclosed |
| US-20080261038-A1 | ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR SUBSTRATES | NITTO DENKO CORPORATION (JP) | 2008-10-23 | — | — | US | disclosed |
| EP-1942166-A1 | Adhesive sheet for processing semiconductor substrates | Nitto Denko Corporation (JP) | 2008-07-09 | — | — | EP | disclosed |
| US-20080118764-A1 | ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR WAFERS AND/OR SUBSTRATES | NITTO DENKO CORPORATION (JP) | 2008-05-22 | — | — | US | disclosed |
| EP-1914284-A1 | Adhesive sheet for processing semiconductor wafers and/or substrates | Nitto Denko Corporation (JP) | 2008-04-23 | — | — | EP | disclosed |
| US-6797398-B2 | SUITABLE FOR USE AS A MATERIAL FROM WHICH TO FORM MEDICAL LIQUID CONTAINERS SUCH AS BAGS FOR TRANSFUSIONS, DRUG SOLUTIONS, AND BLOOD | FUJIMORI KOGYO CO., LTD. (JP) | 2004-09-28 | — | — | US | disclosed |
| US-20030124370-A1 | Plastic film for medical liquid container | FUJIMORI KOGYO CO., LTD. (JP) | 2003-07-03 | — | — | US | disclosed |
| EP-1304218-A1 | PLASTIC FILM FOR MEDICAL LIQUID CONTAINER | FUJIMORI KOGYO CO., LTD. (JP) | 2003-04-23 | — | — | EP | disclosed |